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`EXHIBIT C
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`EXHIBIT C
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`

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`(12) United States Patent
`COSS, Jr. et al.
`
`USOO6725402B1
`(10) Patent No.:
`US 6,725,402 B1
`(45) Date of Patent:
`Apr. 20, 2004
`
`(54) METHOD AND APPARATUS FOR FAULT
`DETECTION OF A PROCESSING TOOLAND
`CONTROL THEREOF USING AN ADVANCED
`PROCESS CONTROL (APC) FRAMEWORK
`
`(75) Inventors: Elfido Coss, Jr., Austin, TX (US);
`Qingsu Wang, Austin, TX (US);
`Terrence J. Riley, Austin, TX (US)
`
`(73) ASSignee: has Micro Devices, Inc., Austin,
`
`WO
`W.,
`
`(*) Notice:
`
`Subject to any disclaimer, the term of this
`patent is extended or adjusted under 35
`U.S.C. 154(b) by 556 days.
`
`(21) Appl. No.: 09/629,073
`22) Filled:
`ul. 31, 2000
`(22)
`Jul. 31,
`7
`(51) Int. Cl.' ................................................. G06F 11/00
`(52) U.S. Cl. ........................... 714/48; 700/109; 700/95;
`714/742
`(58) Field of Search .............................. 714/4, 48, 742;
`700/109,139, 95; 438/14
`References Cited
`U.S. PATENT DOCUMENTS
`
`(56)
`
`11/2001 Kamieniecki et al. ........ 439/16
`6,315,574 B1
`1/2002 Cho ........................... 700/121
`6,336,055 B1
`(See R : (2: y - - - - - - - - - - - - - - - - - - - - - 7A.
`2- - 12
`CI C all. . . . . . . . . . . .
`- - -
`6,546,508 B1
`4/2003 Sonderman et al. .......... 714/48
`6556,881. B1
`4/2003 Miller ........................ 700/108
`2- - - 2
`6,606,582 B1
`8/2003 Brinkman et al. .......... 702/188
`FOREIGN PATENT DOCUMENTS
`WOO1/18623 A1
`3/2001
`......... GOSB/19/418
`WO ES: A1 3. - - - - - - - - - SERE
`OTHER PUBLICATIONS
`International PCT Search Report dated July 3, 2001 (PCT/
`US01/21159; TT3217-PCT).
`* cited by examiner
`Primary Examiner Scott Baderman
`ASSistant Examiner Anne L. Damiano
`(74) Attorney, Agent, or Firm Williams, Morgan &
`AmerSon, P.C.
`ABSTRACT
`(57)
`A method and apparatus for providing fault detection in an
`Advanced Process Control (APC) framework. A first inter
`face receives operational State data of a processing tool
`related to the manufacture of a processing piece. The State
`data is Sent from the first interface to a fault detection unit.
`A fault detection unit determines if a fault condition exists
`with the processing tool based upon the state data. A
`5,661,669 A 8/1997 Mozumder et al. ......... 364/552
`SSC A 4/1998 Berken et al - - - - - - - - - 3.Is predetermined action is performed on the processing tool in
`E. A : S. E. al.". 395/|S
`response to the presence of a fault condition. In accordance
`6.115.6 43 A 9/2000 Stine et all
`-
`- - - - - - - - - - - - - - - -700/110
`with one embodiment, the predetermined action is to shut
`6.161054A
`12/2000 Rosenthalet al... 700/21
`down the processing tool So as to prevent further production
`6,232,134 B1
`5/2001 Farber et al. .................. 438/9
`of faulty wafers.
`6,263,255 B1
`7/2001 Tan et al. ................... 700/121
`6,314,385 B1
`11/2001 Kim et al. .................. 702/184
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`17 Claims, 5 Drawing Sheets
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`SENSOR
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`FACTORY
`CONTROL
`SYSTEM
`125
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`DAA
`COLLECON
`13
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`APC FRAMEWORK
`135
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`FAUL
`CTION
`SYSTEM
`120
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`U.S. Patent
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`Apr. 20, 2004
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`Sheet 1 of 5
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`US 6,725,402 B1
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`FACTORY
`CONTROL
`SYSTEM
`125
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`DATA
`COLLECTION
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`SENSOR
`115
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`APC FRAMEWORK
`135
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`FAULT
`DETECTION
`SYSTEM
`120
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`Figure 1
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`U.S. Patent
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`Apr. 20, 2004
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`Sheet 2 of 5
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`US 6,725,402 B1
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`z ?un61-I
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`U.S. Patent
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`US 6,725,402 B1
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`£ © Infi!--
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`U.S. Patent
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`Apr. 20, 2004
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`Sheet 4 of 5
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`US 6,725,402 B1
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`Obtain Operational Tool State Data of Processing Tool
`410
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`Tool State Data is Received at El and Accumulated in
`Data Collection Unit
`420
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`Translate Tool State Data from a First Communications
`Protcol to a Second Communications Protocol in a Tool
`Data File
`43O
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`Send Tool Data File From Data Collection Unit to Fault
`Detection System
`440
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`Create MRF, MAF, TAF, and Compareto Fault Model
`Data to Determine Tool Health Data of the
`Processing Tool
`450
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`Figure 4A
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`U.S. Patent
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`Apr. 20, 2004
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`Sheet 5 of 5
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`US 6,725,402 B1
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`Forward Tool Health Data to Plan Executor of APC
`FrameWOrk
`460
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`Plan Executor of APC Framework inspects
`Tool Health Data for a Fault Condition
`470
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`Plan Executor of APC Framework Performs a
`Predetermined Action Based Upon Results of Tool
`Health Data
`480
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`Figure 4B
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`US 6,725,402 B1
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`1
`METHOD AND APPARATUS FOR FAULT
`DETECTION OF A PROCESSING TOOLAND
`CONTROL THEREOF USING AN ADVANCED
`PROCESS CONTROL (APC) FRAMEWORK
`
`BACKGROUND OF THE INVENTION
`1. Field of the Invention
`This invention relates generally to Semiconductor fabri
`cation technology, and, more particularly, to a method and
`apparatus for fault detection and control of a processing tool
`using an Advanced Process Control (APC) framework.
`2. Description of the Related Art
`There is a constant drive in the Semiconductor industry to
`increase the quality, reliability, and throughput of integrated
`circuit devices Such as microprocessors, memory devices
`and the like. This drive is fueled by consumer demands for
`higher quality computers and electronic devices that operate
`more reliably.
`These demands by the consumer have resulted in Some
`improvements in the manufacture of Semiconductor devices
`as well as in the manufacture of integrated circuit devices
`incorporating Such Semiconductor devices. Reducing
`defects in the manufacture of these devices lowers the cost
`of the devices themselves. Accordingly, the cost of the final
`product incorporating these devices is also reduced, thus
`providing inherent monetary benefits to both the consumer
`and manufacturer.
`Although there has been an improvement in detecting
`faults associated with Semiconductor manufacturing
`processes, one problem currently encountered by the Semi
`conductor manufacturing industry is the delay in reporting
`these faults such that corrective measures can be imple
`mented in a more expedient manner. As a result of this delay,
`Several faulty devices are produced, which undesirably
`increases costs for the manufacturer and consumer.
`The present invention is directed to overcoming, or at
`least reducing the effects of, one or more of the problems Set
`forth above.
`SUMMARY OF THE INVENTION
`In one aspect of the present invention, a method is
`provided for fault detection in a manufacturing process. The
`method includes receiving at a first interface operational
`State data of a processing tool related to the manufacture of
`a processing piece. The State data is Sent from the first
`interface to a fault detection unit. It is determined if a fault
`condition exists with the processing tool based upon the
`State data, and a predetermined action is performed on the
`processing tool in response to the presence of a fault
`condition.
`In another aspect of the present invention, a System is
`provided for fault detection in a manufacturing process. The
`System includes a processing tool adapted to manufacture a
`processing piece and a first interface, coupled to the pro
`cessing tool, which is adapted to receive operational State
`data of the processing tool related to the manufacture of the
`processing piece. The System further includes a fault detec
`tion unit adapted to determine if a fault condition exists with
`the processing tool based on the operational State data, and
`a framework adapted to perform a predetermined action on
`the processing tool in response to the presence of a fault
`condition.
`BRIEF DESCRIPTION OF THE DRAWINGS
`The invention may be understood by reference to the
`following description taken in conjunction with the accom
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`2
`panying drawings, in which like reference numerals identify
`like elements, and in which:
`FIG. 1. illustrates a manufacturing System that includes a
`fault detection system and Advanced Process Control (APC)
`framework for providing fault detection and control of a
`processing tool in accordance with one embodiment;
`FIG. 2 depicts the detail of the fault detection system of
`FIG. 1;
`FIG. 3 shows a more detailed perspective of the APC
`framework of FIG. 1 for controlling the operation of the
`processing tool; and
`FIGS. 4A and B show a process for providing fault
`detection capability for the manufacturing system of FIG. 1
`and control thereof.
`While the invention is susceptible to various modifica
`tions and alternative forms, specific embodiments thereof
`have been shown by way of example in the drawings and are
`herein described in detail. It should be understood, however,
`that the description herein of Specific embodiments is not
`intended to limit the invention to the particular forms
`disclosed, but on the contrary, the intention is to cover all
`modifications, equivalents, and alternatives falling within
`the Spirit and Scope of the invention as defined by the
`appended claims.
`
`DETAILED DESCRIPTION OF SPECIFIC
`EMBODIMENTS
`
`Illustrative embodiments of the invention are described
`below. In the interest of clarity, not all features of an actual
`implementation are described in this specification. It will of
`course be appreciated that in the development of any Such
`actual embodiment, numerous implementation-specific
`decisions must be made to achieve the developerS Specific
`goals, Such as compliance with System-related and busineSS
`related constraints, which will vary from one implementa
`tion to another. Moreover, it will be appreciated that Such a
`development effort might be complex and time-consuming,
`but would nevertheless be a routine undertaking for those of
`ordinary skill in the art having the benefit of this disclosure.
`Turning now to the drawings, and Specifically referring to
`FIG. 1, a system 100 for determining fault detection in a
`Semiconductor fabrication proceSS based on process tool
`operational state data is provided. The system 100 includes
`a processing tool 105, which in the illustrated embodiment,
`is in the form of Semiconductor fabrication equipment used
`to produce a processing piece, Such as a Silicon wafer. The
`processing tool 105, in accordance with one embodiment, is
`an Applied Materials (AMAT) Rapid Thermal Processing
`(RTP) tool. It will be appreciated, however, that the pro
`cessing tool 105 need not necessarily be limited to an AMAT
`RTP tool, or even to a tool for processing silicon wafers, but
`could include other types of manufacturing equipment for
`producing a variety of different types of commercial prod
`ucts without departing from the Spirit and Scope of the
`present invention.
`The processing tool 105 is coupled to an equipment
`interface (El) 110, which retrieves various tool state data
`from the tool 105, and communicates this data to a fault
`detection system 120 via the data collection unit 130 to
`determine whether the tool 105 is experiencing a faulty
`operation. The tool State data may include, but is not
`necessarily limited to, temperature, preSSure, and gas flow
`measurements of the processing tool 105.
`An add-on Sensor 115 may also be coupled to the pro
`cessing tool 105 to measure additional tool state data that is
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`3
`not ascertained by the tool 105 itself. For example, the
`add-on sensor 115 may be used to determine whether the
`Silicon wafer was produced within acceptable operational
`limits by the tool 105. Such acceptable operational limits of
`the tool 105 may be to produce the wafer within a certain
`temperature range, for example. It will be appreciated,
`however, that the add-on sensor 115 may be used to record
`various other operational State parameters, and, thus, need
`not be limited to the aforementioned example.
`The sensor 115 may be embodied as a simple data
`acquisition program, Such as a C++ Standalone program
`acquiring data from a thermocouple wire, for example.
`Alternatively, the sensor 115 may be embodied as a full
`fledged LABVIEWE) application, acquiring data through
`multiple transducers (not shown). It will further be appre
`ciated that the sensor 115 need not be used at all, and the
`fault detection system 120 could rely solely upon the tool
`state data forwarded from the equipment interface 110. If
`used, however, the sensor 115 forwards the additional tool
`state data to the fault detection system 120 for analysis.
`A factory control system 125, such as WorkStream, for
`example, provides overall program control of the Semicon
`ductor fabrication process performed by the system 100. The
`control System 125 provides Signals to the equipment inter
`face 110 to control the processing tool 105, such as starting
`and Stopping the operation of the tool 105, for example.
`When the tool 105 is operating and processing a given wafer,
`the tool state data is received by the equipment interface 110
`and collected by a data collection unit 130 as the data is sent
`from the processing tool 105 while the particular wafer is
`being processed. The data collection unit 130 converts the
`tool State data into a tool data file for the particular wafer
`being processed, and forwards the file to the fault detection
`System 120 for analysis in near real-time. In one
`embodiment, if the proceSS is long, the proceSS may be
`broken up into parts. The data collection unit 130, when
`converting the tool State data into a tool data file, translates
`this data from a first communications protocol used by the
`equipment interface 110 to a Second communications pro
`tocol compatible with a Software running on the fault
`detection system 120. The process for translating the tool
`State data into tool data files is specific to the particular fault
`detection Software that is operating on the fault detection
`system 120.
`Referring now to FIG. 2, a more detailed representation of
`the fault detection system 120 is provided. The fault detec
`tion system 120 receives the tool data files as converted from
`the data collection unit 130 at a server 205. In accordance
`with one embodiment, the server 205 runs Model Ware(E), a
`commercially available Software package that provides fault
`detection analysis of the processing tool 105 based upon the
`tool data files that are derived from the tool state data for
`each wafer processed by the tool 105. It will be appreciated,
`however, that other types of fault detection Software may
`also be used in lieu of Model Ware(R) without departing from
`the Spirit and Scope of the present invention.
`For each wafer processed by the tool 105, a model
`reference file (MRF) 210 is constructed from the tool data
`file that was forwarded from the data collection unit 130.
`The model reference file (MRF) 210 provides the current
`state of the tool 105 on a near real-time basis for each wafer
`that is being processed. When a lot of wafers is finished
`being processed by the tool 105, the model reference file
`(MRF) 210 for each wafer of the lot is compiled into a model
`archive file (MAF) 215 by the server 205. The server 205
`also constructs a tool alarm file 220 by comparing the model
`reference file (MRF) 210 of the wafer currently being
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`processed by the tool 105 to fault model data, provided that
`the data of the model reference file differs from the fault
`model data by a predetermined amount. The fault model data
`includes model reference files (MRFs) derived from the tool
`State data of other similar-type wafers, where it was previ
`ously known that Such wafers that were processed by the
`tool within acceptable operational limits.
`The types of faults that may be detected by the fault
`detection System 120 include processing and/or operational
`faults in Silicon wafer fabrication. Examples of processing
`faults may include, but are not necessarily limited to,
`non-optimal preheating of the chamber, catastrophic failure
`where a broken wafer is detected, abnormal processed gas
`flow rate, temperature errors, temperature measurement
`drifts, etc. Some examples of operational faults detected by
`the fault detection system 120 may include interrupted/
`resumed processing, no wafer Sleuth or improper wafer
`sleuth prior to Rapid Thermal Anneal (RTA), etc.
`The fault detection system 120, upon evaluating the
`model reference file (MRF) 210 for the wafer currently
`being processed by the tool 105, sends the results of poten
`tial faults and/or proper operation of the tool 105 in the form
`of tool “health” data to the Advanced Process Control (APC)
`framework 135 (see FIGS. 1 and 2). The APC framework
`135, in turn, may send control Signals to the equipment
`interface 110 to control the processing tool 105 based upon
`the tool health data results forwarded from the fault detec
`tion system 120. For example, the signal sent from the APC
`framework 135 may be to shut down the tool 105 to prevent
`any additional faulty production of wafers. Data could also
`be sent from the APC framework 135 to inform a technician
`on how to rectify a faulty condition of the tool 105, if so
`desired. In accordance with another embodiment, the APC
`framework 135 may also forward a copy of the tool health
`data to the equipment interface 110, and the equipment
`interface 110 could forward the copy of the tool health data
`to the factory control System 125, which may average the
`tool health data and plot a chart of the data or averaged data
`for Viewing by a fab technician.
`Turning now to FIG. 3, a more detailed representation of
`the APC framework 135 is provided. The APC framework
`135 is a component-based architecture comprised of
`interchangeable, Standardized Software components
`enabling run-to-run control of the processing tool 105. The
`APC framework 135 includes a machine interface (MI) 310
`for interfacing the tool 105 through the equipment interface
`110 to the framework 135 for providing control of the tool
`105. The APC framework 135 further includes a Sensor
`interface (SI) 320 for interfacing the add-on sensor 115 with
`the framework 135. In accordance with one embodiment, the
`sensor interface 320 may be adapted to collect the tool state
`data of the processing tool 105 through the sensor 115 as
`opposed to having the data Sent directly to the fault detection
`system 120. In this embodiment, the tool state data from the
`sensor 115 is sent to the fault detection system 120 via the
`APC framework 135. Furthermore, although only one sensor
`interface 320 is shown in FIG. 3, it will be appreciated that
`Several Sensor interfaces may be included within the frame
`work 135 without departing from the spirit and scope of the
`present invention.
`A plan executor (PE) 330 (i.e., a process controller)
`manages the APC framework 135 and provides possible
`solutions to problems found with the tool health data that
`was forwarded by the fault detection system 120. The
`framework 135 further includes an applications interface
`(AI) 340 for interfacing with third-party applications that
`run on the fault detection system 120. In the illustrated
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`embodiment, the third-party application is the Model Ware
`Software package running on the fault detection Server 205.
`A data channel 350 is further provided to allow for com
`munication between the machine and Sensor interfaces 310,
`320, the plan executor 330, and the applications interface
`340 of the APC framework 135.
`The machine interface 310 couples to the equipment
`interface 110 to Serve as an interface between the processing
`tool 105 and the APC framework 135. The machine interface
`310 Supports the Setup, activation, and monitoring of the tool
`105. It receives commands and status events from the
`equipment interface 110 and forwards this information to
`other components of the APC framework 135, namely the
`plan executor 330 and applications interface 340. Any
`responses that are received by the machine interface 310
`from the other components of the APC framework 135 are
`routed to the equipment interface 110 for delivery to the
`processing tool 105. AS previously discussed, this may
`include a signal from the plan executor 330 to manipulate
`the tool 105 if a faulty condition is detected.
`The machine interface 310 also reformats and restructures
`the messages between the Specific communications protocol
`utilized by the equipment interface 110 and the Common
`Object Request Broker Architecture Interface Definition
`25
`Language (CORBAIDL) communications protocol used by
`the components of the APC framework 135. The manner in
`which the machine interface 310 performs such translation
`between the equipment interface-specific communications
`protocol and the CORBA IDL protocol of the APC frame
`work 135 is well known to those of ordinary skill in the art.
`Accordingly, the Specific translation process between these
`two formats will not be discussed herein to avoid unneces
`Sarily obscuring the present invention.
`The sensor interface 320 serves as an interface between
`the add-on sensor 115 and the APC framework 135. The
`Sensor interface 320 provides Setup, activation, monitoring,
`and data collection for the add-on sensor 115. Similar to the
`machine interface 310, the sensor interface 320 also refor
`mats and restructures the messages between the Specific
`40
`communications protocol utilized by the sensor 115 and the
`CORBA IDL protocol used by the components of the APC
`framework 135.
`The applications interface 340 Supports the integration of
`third-party tools (e.g., commercial Software packages, Such
`as Model Ware, Matlab, and Mathematica, for example) to
`the APC framework 135. Typically, these third-party tools
`do not provide the standard CORBAIDL protocol known to
`the APC framework 135. Accordingly, the applications
`interface 340 provides the necessary translation between the
`communications protocol utilized by the third-party tool and
`the CORBA protocol used by the APC framework 135. In
`the illustrated embodiment, the third-party tool is the fault
`detection system 120 for analyzing the tool state data of the
`processing tool 105 that is supplied via the data collection
`unit 130 and the sensor 115. As previously discussed, the
`fault detection system 120 includes Model Ware(R) software
`for providing fault detection in the illustrated embodiment.
`The plan executor 330 performs a predetermined action
`based upon the tool health data results that are Supplied by
`the fault detection system 120. When the applications inter
`face 340 receives the results from the fault detection system
`120, it forwards a copy of the results to the plan executor
`330. Upon inspection of the results, the plan executor 330
`attempts to rectify the fault condition found with the tool 105
`by performing a predetermined action. In accordance with
`one embodiment of the present invention, the Solution to a
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`fault condition may be for the plan executor 330 to send a
`control Signal to the machine interface 310 and equipment
`interface 110 to shut down the tool 105 so as to prevent
`further manufacturing of faulty Silicon wafers. The plan
`executor 330, in addition to shutting down the tool 105, may
`also apprise a technician of any potential Solutions to rectify
`the fault condition through an operator interface (not shown)
`Such as a graphical user interface (GUI), for example, before
`the tool 105 may commence operation once again.
`Alternatively, the predetermined action performed by the
`plan executor 330 may be to forward a copy of the tool
`health data to the equipment interface 110, and then to
`forward the health data to the workstream 125.
`Turning now to FIGS. 4A and 4B, a process 400 for fault
`detection based upon tool State operational parameters is
`provided. The process 400 commences at block 410 where
`the tool state data of the processing tool 105 is obtained. The
`tool state data may be obtained from the tool 105 itself or
`through an add-on Sensor 115. In accordance with one
`embodiment, the tool State data may include temperature,
`preSSure, and gas flow measurements from the processing
`tool 105.
`Once the tool State data is obtained through the processing
`tool 105, the data is received at the equipment interface 110,
`and is accumulated in the data collection unit 130 at block
`420. At block 430, the data collection unit 130 converts the
`tool State data received for each wafer processed by the tool
`105 from a first communications protocol used by the
`equipment interface 110 to a Second communications pro
`tocol in the form of a tool data file. The data collection unit
`130, when converting the tool state data into a tool data file,
`translates this data into the Second communications protocol
`that is compatible with the Software package running on the
`fault detection system 120, which is the Model Ware soft
`ware package in the illustrated embodiment. Subsequent to
`creating the tool data file for each wafer currently being
`processed by the tool 105, the data collection unit 130
`forwards the tool data file to the fault detection system 120
`at block 440. The fault detection server 205 of the fault
`detection system 120 generates a model reference file 210,
`adds the model reference file (MRF) to the model archive
`file (MAF) 215 for the lot of wafers processed, and generates
`a tool alarm file 220 based on the tool data file received from
`the data collection unit 130. The fault detection server 205
`further compares the model reference file 210 for the wafer
`currently being processed by the tool 105 to fault model
`data, and generates tool health data for the wafer at block
`450.
`At block 460, the fault detection system 120 forwards the
`tool health data to the plan executor 330 of the APC
`framework 135 via the applications interface 340. At block
`470, the plan executor 330 inspects the tool health data for
`the particular wafer being processed by the tool 105. At
`block 480, the plan executor 330 performs a predetermined
`action based upon the inspection. In accordance with one
`embodiment, the predetermined action may be to Send a
`control signal to shut down the processing tool 105 if the
`tool health data is deemed faulty. In an alternative
`embodiment, the plan executor 330 may forward the tool
`health data of the tool 105 to the equipment interface 110.
`The equipment interface 110 would then forward the tool
`health data to the workstream 125, where the tool health data
`may be averaged and plotted on a chart for viewing by a fab
`technician, if So desired.
`The particular embodiments disclosed above are illustra
`tive only, as the invention may be modified and practiced in
`different but equivalent manners apparent to those skilled in
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`the art having the benefit of the teachings herein.
`Furthermore, no limitations are intended to the details of
`construction or design herein shown, other than as described
`in the claims below. It is therefore evident that the particular
`embodiments disclosed above may be altered or modified
`and all Such variations are considered within the Scope and
`Spirit of the invention. Accordingly, the protection Sought
`herein is as set forth in the claims below.
`What is claimed is:
`1. A method comprising:
`receiving at a first interface operational State data of a
`processing tool related to the manufacture of a process
`ing piece,
`Sending the State data from the first interface to a fault
`detection unit, wherein the act of Sending comprises:
`Sending the State data from the first interface to a data
`collection unit;
`accumulating the State data at the data collection unit;
`translating the State data from a first communications
`protocol to a Second communications protocol com
`patible with the fault detection unit; and
`Sending the translated State data from the data collec
`tion unit to the fault detection unit;
`determining if a fault condition exists with the processing
`tool based upon the state data received by the fault
`detection unit;
`performing a predetermined action on the processing tool
`in response to the presence of a fault condition; and
`Sending an alarm Signal indicative of the fault condition to
`an advanced process control framework from the fault
`detection unit providing that a fault condition of the
`processing tool was determined by the fault detection
`unit,
`35
`wherein performing a predetermined action further com
`prises Sending a Signal by the framework to the first
`interface reflective of the predetermined action.
`2. The method of claim 1, wherein performing a prede
`termined action further comprises:
`shutting down the processing tool providing that a faulty
`condition exists.
`3. The method of claim 1, further comprising:
`receiving additional State data of the processing tool from
`a Sensor that is coupled to the processing tool; and
`Sending the additional State data to the fault detection unit.
`4. The method of claim 3, further comprising:
`translating the State data from the Sensor from a first
`communications protocol used by the Sensor to a Sec
`ond communications protocol used by the fault detec
`tion unit.
`5. The method of claim 1, wherein determining if the fault
`condition exists, further comprises:
`comparing the State data received at the first interface to
`predetermined State data at the fault detection unit.
`6. The method of claim 5, wherein comparing comprises
`comparing the State data received to fault model data that is
`derived from other Similar-type wafers, where it was previ
`ously known that Such wafers were processed within accept
`able operational limits.
`7. The method of claim 1, wherein sending the accumu
`lated State data from the data collection unit to the fault
`detection unit, further comprises:
`Sending the accumulated State data from the data collec
`tion unit to the fault detection unit while a processing
`piece is being processed by the tool.
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`US 6,725,402 B1
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`8. A System comprising:
`a processing tool adapted to manufacture a processing
`piece,
`a first interface, coupled to the processing tool, the first
`interface adapted to receive operational State data of the
`processing tool related to the manufacture of the pro
`cessing piece;
`a fault detection unit adapted to determine if a fault
`condition exists with the processing tool based on Said
`operational State data;
`a framework adapted to perform a predetermined action
`on the processing tool in response to the presence of a
`fault condition;
`wherein the first interface comprises a data collection unit
`adapted to receive and accumulate the State data as the
`data is received by the first interface, translate the State
`data from a first communications protocol to a Second
`communications protocol compatible with the fault
`detection unit, and to Send the translated State data from
`the data collection unit to the fault detection unit;
`wherein the fault detection unit is further adapted to send
`an alarm Signal indicative of the fault condition to the
`framework from the fault detection unit providing that
`a fault condition of the processing tool was determined
`by the fault detection unit; and
`wherein the framework is further adapted to Send a
`control signal to the first interface reflective of the
`predetermined action providing that a fault condition
`exists.
`9. The system of claim 8, further comprising:
`a Sensor, coupled to the processing tool, the Sensor
`adapted to receive additional State data from the pro
`cessing tool, and to Send the data to the fault detection
`unit.
`10. The system of claim 8, wherein the fault detection unit
`is further adapted to compare the State data of the processing
`tool to predetermined State data to dete