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PLANARIZED SEMICONDUCTOR INTERCONNECT TOPOGRAPHY AND METHOD FOR POLISHING A METAL LAYER TO FORM INTERCONNECT

09/143,723 | U.S. Patent Application

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Location FILE REPOSITORY (FRANCONIA)
Filed Aug. 31, 1998
Examiner HSIEN MING LEE
Class 438
Art Group 2823
Patent No. 6,232,231
Case Type Utility - 438/691000
Status Patented Case
Child 09/779,123 Patented
Last Updated: 3 months ago
Date # Transaction