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A NEW CONSOLIDATION METHOD OF JUNCTION CONTACT ETCH FOR BELOW 150 NANOMETER DEEP TRENCH-BASED DRAM DEVICES

09/993,749 | U.S. Patent Application

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Location FILE REPOSITORY (FRANCONIA)
Filed Nov. 6, 2001
Examiner DUNG ANH LE
Class 438
Art Group 2818
Patent No. 6,562,714
Case Type Utility - 438/637000
Status Application Involved in Court Proceedings
Last Updated: 3 years, 9 months ago
Date # Transaction