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Displaying 54-68 of
88 results
1-66-US-140097281JP1
Document
MODULAR BUILDING CONSTRUCTION SYSTEM, 14/9,728, No. 1-66-US-140097281JP1 (U.S. Pat. App. Jul. 24, 2019)
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JYJB4N23RXEAPX2
Document
VERTICAL INTERFACE MEMBER FOR ARCHITECTURAL DIVIDER ASSEMBLIES, 29/363,788, No. JYJB4N23RXEAPX2 (U.S. Pat. App. Jul. 24, 2019)
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JYJB3UBARXEAPX3
Document
RECTANGULAR-SHAPED INTERFACE MEMBER FOR ARCHITECTURAL DIVIDER ASSEMBLIES, 29/363,792, No. JYJB3UBARXEAPX3 (U.S. Pat. App. Jul. 24, 2019)
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JYJAUKTHRXEAPX1
Document
ELECTRICAL PANEL MANAGER, 29/430,113, No. JYJAUKTHRXEAPX1 (U.S. Pat. App. Jul. 24, 2019)
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JLDZEEBNRXEAPX5
Document
SYSTEM AND METHOD FOR USING A FLASH EVAPORATOR TO SEPARATE BITUMEN AND HYDROCARBON CONDENSATE, 62/723,608, No. JLDZEEBNRXEAPX5 (U.S. Pat. App. Aug. 28, 2...
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1-66-US-117425910TP1
Document
MOVABLE WALLS FOR ON-SITE CONSTRUCTION, 11/742,591, No. 1-66-US-117425910TP1 (U.S. Pat. App. Jul. 24, 2019)
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JYJAJT76RXEAPX1
Document
MODULAR WALL FLEX BRACKET WITH KNUCKLE, 29/473,239, No. JYJAJT76RXEAPX1 (U.S. Pat. App. Jul. 24, 2019)
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L24Q1JSBGREENX0
Document
METHOD AND APPARATUS FOR CHEMICAL MECHANICAL POLISHING, 08/939,689, No. L24Q1JSBGREENX0 (U.S. Pat. App. Apr. 15, 2022)
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L93LD7EHXBLUEX5
Document
METHOD OF FORMING AN ALIGNMENT FEATURE IN OR ON A MULTILAYERED SEMICONDUCTOR STRUCTURE, 09/456,224, No. L93LD7EHXBLUEX5 (U.S. Pat. App. Apr. 15, 2022)
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L25QAYMLGREENX1
Document
METHOD OF FORMING AN ALIGNMENT FEATURE IN OR ON A MULTILAYERED SEMICONDUCTOR STRUCTURE, 09/456,224, No. L25QAYMLGREENX1 (U.S. Pat. App. Apr. 14, 2022)
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L26VKTQTXBLUEX2
Document
METHOD AND STRUCTURE FOR REDUCING THE INCIDENCE OF VOIDING IN AN UNDERFILL LAYER OF AN ELECTRONIC COMPONENT PACKAGE, 09/465,425, No. L26VKTQTXBLUEX2 (U...
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L26N18MRXBLUEX5
Document
ASYMMETRIC ALIGNMENT OF SUBSTRATE INTERCONNECT TO SEMICONDUCTOR DIE, 12/139,185, No. L26N18MRXBLUEX5 (U.S. Pat. App. Apr. 15, 2022)
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L26Q767SGREENX0
Document
INTEGRATED CIRCUIT DEVICE HAVING A SWITCHED ROUTING NETWORK, 08/782,585, No. L26Q767SGREENX0 (U.S. Pat. App. Apr. 15, 2022)
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L938VUERGREENX0
Document
SEMICONDUCTOR DEVICE HAVING ALUMINUM CONTACTS OR VIAS AND METHOD OF MANUFACTURE THEREFOR, 08/820,063, No. L938VUERGREENX0 (U.S. Pat. App. Apr. 15, 2022)
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L3B55M7ZXBLUEX0
Document
SEMICONDUCTOR DEVICE HAVING ALUMINUM CONTACTS OR VIAS AND METHOD OF MANUFACTURE THEREFOR, 08/820,063, No. L3B55M7ZXBLUEX0 (U.S. Pat. App. Apr. 14, 2022)
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