Case 2:19-cv-06573-PSG-RAO Document 89-23 Filed 11/05/20 Page 1 of 34 Page ID
`#:4161
`
`EXHIBIT U
`
`

`

`(19) United States
`(12) Patent Application Publication (10) Pub. No.: US 2004/0257797 A1
`(43) Pub. Date:
`Dec. 23, 2004
`Suehiro et al.
`
`US 2004O257797A1
`
`(54) LIGHT EMITTING DEVICE
`(76) Inventors: Yoshinobu Suehiro, Nishikasugai-gun
`(JP); Ryoichi Tohmon,
`Nishikasugai-gun (JP); Hideaki Kato,
`Nishikasugai-gun (JP); Satoshi Wada,
`Nishikasugai-gun (JP)
`Correspondence Address:
`POSZ & BETHARDS, PLC
`11250 ROGER BACON DRIVE
`SUTE 10
`RESTON, VA 20190 (US)
`(21) Appl. No.:
`10/869,036
`(22) Filed:
`Jun. 17, 2004
`(30)
`Foreign Application Priority Data
`
`Jun. 18, 2003 (JP)...................................... 2003-173650
`Sep. 17, 2003 (JP)...................................... 2003-324,570
`
`Publication Classification
`
`(51) Int. Cl." ....................................................... F21K 2700
`(52) U.S. Cl. ................................................................ 362/34
`
`(57)
`
`ABSTRACT
`
`A light emitting device has a light emitting element portion
`that radiates light with a predetermined wavelength, and a
`wavelength conversion portion that Surrounds a phosphor to
`be excited by the light with the predetermined wavelength
`with a transparent and non-moisture permeability material in
`the form of laminae. Further, a light emitting device has a
`plurality of LED elements disposed on a Same plane, and a
`wavelength conversion portion that comprises a flat trans
`parent base member that is disposed opposite to the plurality
`of LED elements and a phosphor layer that is of a phosphor
`to be excited by light emitted from the LED element and is
`formed like a film on the base member. The phosphor layer
`includes part with no phosphor in plane.
`
`1.
`LIGHT
`EMITTING
`DEVICE
`
`29 HO
`
`SPHOR
`
`5A
`STEP
`PORTION
`
`
`
`
`
`
`
`5
`LEAD
`FRAME
`
`WAVELENGTH
`CONVERSION
`PORTION
`2A
`PHOSPHOR
`LAYER 5A
`
`Case 2:19-cv-06573-PSG-RAO Document 89-23 Filed 11/05/20 Page 2 of 34 Page ID
`#:4162
`
`SUBMOUNT GLASS
`LED
`SEALING ELEMENT
`ELEMENT
`PORTION
`
`

`

`Patent Application Publication Dec. 23, 2004 Sheet 1 of 22
`
`US 2004/0257797 A1
`
`A/G f PRIOR ART
`
`30
`LIGHT
`EMITTING
`DEVICE
`
`\
`
`
`
`35
`WERE
`
`36A
`PHOSPHOR
`
`3A S
`S
`LAYER
`
`37
`
`SEALING
`RESIN
`35
`WIRE
`33
`CUP
`PORTION
`33A
`BOTTOM
`PORTION
`34
`LED
`ELEMENT
`
`
`
`31
`
`32
`
`Case 2:19-cv-06573-PSG-RAO Document 89-23 Filed 11/05/20 Page 3 of 34 Page ID
`#:4163
`
`

`

`Patent Application Publication Dec. 23, 2004 Sheet 2 of 22
`
`US 2004/0257797 A1
`
`
`
`H10NETE/\\/M
`NOISHBANOO
`
`| BEHS
`
`LHOIT]
`
`ÕG
`
`
`
`Case 2:19-cv-06573-PSG-RAO Document 89-23 Filed 11/05/20 Page 4 of 34 Page ID
`#:4164
`
`
`
`NISEH SSBOEH
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`
`

`

`Patent Application Publication Dec. 23, 2004 Sheet 3 of 22
`
`US 2004/0257797 A1
`
`F/G, 3
`
`1.
`LIGHT
`EMITTING
`DEVICE
`
`2 Y WAVELENGTH
`
`-
`
`200
`PHOSPHOR
`
`CONVERSION
`PORTION
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`
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`PORTION <2
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`--
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`FRAME
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`
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`4
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`ELEMENT
`SEALING ELEMENT
`PORTION
`
`Case 2:19-cv-06573-PSG-RAO Document 89-23 Filed 11/05/20 Page 5 of 34 Page ID
`#:4165
`
`

`

`Patent Application Publication Dec. 23, 2004 Sheet 4 of 22
`
`US 2004/0257797 A1
`
`F1 G. 4A
`
`2O1
`GLASS
`SHEET
`
`F1 G. 4B ÉhosPHOR
`LAYER
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`
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`
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`
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`WAVELENGTH GLASS
`F/G, 4D g3NVERSION
`SHEET
`PORTION
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`
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`GLASS
`SHEET 2A
`
`F/ G. 4.E.
`
`2
`
`2A
`
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`GLASS
`SHEET
`
`Case 2:19-cv-06573-PSG-RAO Document 89-23 Filed 11/05/20 Page 6 of 34 Page ID
`#:4166
`
`201
`GLASS
`SHEET
`
`2A
`
`2A
`PHOSPHOR
`LAYER
`
`202
`GLASS
`SHEET
`
`

`

`Patent Application Publication Dec. 23, 2004 Sheet 5 of 22
`
`US 2004/0257797 A1
`
`F/G, 5A
`
`4
`3
`SUBMOUNT
`LED
`ELEMENT ELEMENT
`
`---
`
`PHOSPHOR
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`2
`WAVELENGTH ELEMENT
`CONVERSION
`PORTION
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`
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`
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`
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`ELEMENT
`
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`
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`
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`FRAME STEP
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`
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`
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`
`2
`WAVELENGTH
`CONVERSION O.
`PORTION
`
`3
`
`YE/
`A 2A
`SE-7
`52
`
`Case 2:19-cv-06573-PSG-RAO Document 89-23 Filed 11/05/20 Page 7 of 34 Page ID
`#:4167
`
`

`

`Patent Application Publication Dec. 23, 2004 Sheet 6 of 22
`
`US 2004/0257797 A1
`
`FIG.6A
`
`70A
`DOME-SHAPED
`200 PORTION
`4
`
`2
`
`70
`UPPER
`MOLD
`
`Y. S.
`
`YNN N.
`SZC3a S22.
`Zeya tax /-/
`
`5A
`
`
`
`80A
`-SA
`ESF SHAPED
`
`3
`
`F1 G. 6B
`
`
`
`6
`GLASS
`80
`LOWER SEALING
`MOLD PORTION
`a
`fin
`
`PORTION
`
`Case 2:19-cv-06573-PSG-RAO Document 89-23 Filed 11/05/20 Page 8 of 34 Page ID
`#:4168
`
`
`
`1.
`
`1.
`
`l
`
`204
`THIN
`2 PORTION
`
`

`

`Patent Application Publication Dec. 23, 2004 Sheet 7 of 22
`
`US 2004/0257797 A1
`
`F1 G. 7
`
`1.
`LIGHT
`EMITTING
`DEVICE
`
`200
`PHOSPHOR
`
`A
`STEP
`PORTION
`
`
`
`4:y
`
`
`
`2
`WAVELENGTH
`CONVERSION
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`PHOSPHOR
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`
`* 12 (NZ)
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`6
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`ELEMENT
`SEALING ELEMENT
`PORTION
`
`N
`
`N
`
`--
`
`5
`LEAD
`
`Case 2:19-cv-06573-PSG-RAO Document 89-23 Filed 11/05/20 Page 9 of 34 Page ID
`#:4169
`
`

`

`Patent Application Publication Dec. 23, 2004 Sheet 8 of 22
`
`US 2004/0257797 A1
`
`F1 G. 8
`
`1.
`LIGHT
`EMITTING
`DEVICE
`
`200
`PHOSPHOR
`
`5A
`STEP
`
`Port
`FRAME 7\ (7
`2//X
`
`
`
`2
`WAVELENGTH
`CONVERSION
`PORTION
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`PHOSPHOR
`5A
`
`Stion
`
`
`
`3
`6
`4.
`SUBMOUNT GLASS LED
`ELEMENT
`SEALING ELEMENT
`PORTION
`
`Case 2:19-cv-06573-PSG-RAO Document 89-23 Filed 11/05/20 Page 10 of 34 Page ID
`#:4170
`
`

`

`Patent Application Publication Dec. 23, 2004 Sheet 9 of 22
`
`US 2004/0257797 A1
`
`F/G, 9
`
`1.
`LIGHT
`EMITTING
`DEVICE
`
`5A
`STEP
`PORTION
`
`5
`
`200
`PHOSPHOR
`(7
`4.
`
`
`
`
`
`2
`WAVELENGTH
`CONVERSION
`PORTION
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`STEP
`PORTION
`
`he CT3 EZ).
`Y(X2N 25,
`
`
`
`/V
`
`SUBMOUNT GLASS LED
`ELEMENT
`SEALING ELEMENT
`PORTION
`
`Case 2:19-cv-06573-PSG-RAO Document 89-23 Filed 11/05/20 Page 11 of 34 Page ID
`#:4171
`
`

`

`Patent Application Publication Dec. 23, 2004 Sheet 10 of 22
`
`US 2004/0257797 A1
`
`1.
`LIGHT
`EMITTING
`DEVICE
`
`200
`
`2
`WAVELENGTH
`CONVERSION
`PORTION
`ÉAoSPHOR
`PHOSPHOR
`LAYER
`A.
`STEP
`7
`PORTION- ? %) STEP
`f7N PORTION
`23-YZZY is
`FRAME 7 ZX K. 2 5
`1.(XZ2TZ24/7 RARE
`
`LEAD
`
`
`
`
`
`3
`6
`4.
`SUBMOUNT GLASS LED
`ELEMENT
`SEAL ING ELEMENT
`PORTION
`
`Case 2:19-cv-06573-PSG-RAO Document 89-23 Filed 11/05/20 Page 12 of 34 Page ID
`#:4172
`
`

`

`Patent Application Publication Dec. 23, 2004 Sheet 11 of 22
`
`US 2004/0257797 A1
`
`F/G 11
`
`1.
`LIGHT
`EMITTING
`DEVICE
`
`200
`PHOSPHOR
`
`,
`
`
`
`WAVELENGTH
`CONVERSION
`PORTION
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`2A
`PHOSPHOR
`LAYER
`
`91
`
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`2. St. 2\ &MP
`ESEN
`55.2/21/1.3/2.
`
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`
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`
`9A
`9A
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`THROUGH-HOLE 91A
`THROUGH-HOLE
`LED
`SPACING ELEMENT
`
`PATTERN
`
`Case 2:19-cv-06573-PSG-RAO Document 89-23 Filed 11/05/20 Page 13 of 34 Page ID
`#:4173
`
`

`

`Patent Application Publication Dec. 23, 2004 Sheet 12 of 22
`
`US 2004/0257797 A1
`
`F1 G, 12A
`
`9.
`WIRING
`PATTERN
`
`9A
`THROUGH-HOLE
`
`3
`LED
`ELEMENT
`
`91A
`SPACING
`
`CERAMIC
`BOARD
`
`F/G, 12B
`
`
`
`2A
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`9A
`
`fin
`
`PORTION 204
`
`R
`)
`
`N
`R
`
`Case 2:19-cv-06573-PSG-RAO Document 89-23 Filed 11/05/20 Page 14 of 34 Page ID
`#:4174
`
`saveLength
`g3NYESION
`
`
`
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`s 1.
`
`

`

`Patent Application Publication Dec. 23, 2004 Sheet 13 of 22
`
`US 2004/0257797 A1
`
`F/G, 13
`
`
`
`2A
`PHOSPHOR
`LAYER
`
`
`
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`LIGHT
`SOURCE
`
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`WAVELENGTH
`CONVERSION
`PORTION
`
`is
`
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`
`GLASS
`SHEET
`
`Case 2:19-cv-06573-PSG-RAO Document 89-23 Filed 11/05/20 Page 15 of 34 Page ID
`#:4175
`
`

`

`Patent Application Publication Dec. 23, 2004 Sheet 14 of 22
`F/G, 14
`
`US 2004/0257797 A1
`
`1.
`LIGHT
`EMITTING
`DEVICE
`
`10A
`REFLECTION
`PORTION
`
`2 WAVELENGTH
`CONVERSION 2A
`PORTION
`PHOSPHOR
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`YY Y-SA S-S Y S S2 NY
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`PORTION
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`N-N-N
`
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`9
`CERAMIC
`BOARD
`
`Case 2:19-cv-06573-PSG-RAO Document 89-23 Filed 11/05/20 Page 16 of 34 Page ID
`#:4176
`
`

`

`Patent Application Publication Dec. 23, 2004 Sheet 15 of 22
`
`US 2004/0257797 A1
`
`F1 G. 75A
`110
`EMISSION
`PORTION
`
`101
`LIGHT
`EMITTING
`DEVICE
`
`120a
`PHOSPHOR
`LAYER
`
`S5
`
`29 H
`PHOSPHOR
`LAYER
`
`12
`GLASS
`MEMBER
`
`102
`WAVELENGTH
`CONVERSION
`PORTION
`
`F1 G. 15B
`
`101
`EMITTING
`LIGHT
`DEVICE
`
`120a
`12Ob
`PHOSPHOR
`110
`PHOSPHOR LAYER
`EMission 8
`LAYER
`120c
`SSI
`WAVELENGTH
`10
`GAP 110 111 120a 120b P9RTION CONVERSION
`N
`PORTION
`121
`44A4A 4-4-2-4A 4-4-4 4-4-Y-X-4-2
`MERSERYS-S-SNNS4CNS, gray
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`104
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`BASE
`PORTION
`
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`
`140
`130 140 130 111
`140
`LED
`WERING
`PATTERN
`ELEMENT
`
`
`
`Case 2:19-cv-06573-PSG-RAO Document 89-23 Filed 11/05/20 Page 17 of 34 Page ID
`#:4177
`
`
`
`v
`
`

`

`Patent Application Publication Dec. 23, 2004 Sheet 16 of 22
`
`US 2004/0257797 A1
`
`F/G, 16A
`
`121
`GLASS
`MEMBER
`
`P/G 16B
`12Ob
`120a
`PHOSPHOR PHOSPHOR
`LAYER
`LAYER
`
`120c
`121 GAP
`
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`
`YYYa Cavalasa Ayaavam Asaaaawaaaaayaa Naraya
`
`130
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`REFLECTION
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`130
`130
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`F/G, 16D
`103
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`
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`
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`
`l 30
`
`130
`
`F1 G. 16E
`
`
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`
`
`Case 2:19-cv-06573-PSG-RAO Document 89-23 Filed 11/05/20 Page 18 of 34 Page ID
`#:4178
`
`F/G. 16F
`
`
`
`
`
`I,
`111 130
`ELEMENT 130.
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`103
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`110
`EMISSION
`PORTION
`
`111 130 1 20b 120c 111 120a
`
`AYNXNE 2SY
`777, 774 KZNZ
`1 1 0 140
`110 40
`30
`
`102
`103
`104
`
`

`

`Patent Application Publication Dec. 23, 2004 Sheet 17 of 22
`
`US 2004/0257797 A1
`
`F1 G. 17
`
`PREPARING STEP
`
`(a)
`
`WAVELENGTHCONVERSION PORTION |
`FOMING STEP
`
`(b)
`
`BASE, REFLECTION PORTIONS
`POSITIONG STEP
`
`BONDING STEP
`
`(c)
`
`(d)
`
`LED ELEMENT MOUNTING STEP
`
`(e)
`
`Case 2:19-cv-06573-PSG-RAO Document 89-23 Filed 11/05/20 Page 19 of 34 Page ID
`
`#:4179
`
`WAVELENGTHQNyERSION PORTION
`
`BONDING STEP
`
`(f)
`
`.
`
`

`

`Patent Application Publication Dec. 23, 2004 Sheet 18 of 22
`
`US 2004/0257797 A1
`
`F1 G. 18
`
`102
`103
`104
`
`-
`
`101
`
`120a
`PHOSPHOR
`LAYER
`45 120C
`120a 110
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`GLASSYZ 2N2 ZYZZ 424AZZZZZZZZZZ 4
`
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`140
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`
`
`
`Case 2:19-cv-06573-PSG-RAO Document 89-23 Filed 11/05/20 Page 20 of 34 Page ID
`#:4180
`
`

`

`Patent Application Publication Dec. 23, 2004 Sheet 19 of 22
`
`US 2004/0257797 A1
`
`F/G, 19A
`
`111
`LED
`ELEMENT
`
`120
`PHOSPHOR
`LAYER
`
`102
`WAVELENGTH
`CONVERSION
`PORTION
`
`110
`EMISSION
`PORTION
`F / G O f 9B 101
`
`130
`REFLECTION
`SURFACE
`
`.
`
`101
`LIGHT
`EMITTING
`
`DEVICE
`
`Case 2:19-cv-06573-PSG-RAO Document 89-23 Filed 11/05/20 Page 21 of 34 Page ID
`#:4181
`
`a NANCY
`
`NMAYYYA
`
`120
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`121 PHOSPHOR
`LED
`LAYER
`120 120 120 110 120 ELEMENT 120 120
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`ZA 423 / / 7(4 / / A4 4 /RELECTION
`130
`11
`140
`140
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`140
`PORTION
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`WIRING
`104
`SURFACE
`PATTERN
`BASE
`PORTION
`
`y \ w, xx x
`
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`
`02
`
`
`
`

`

`Case 2:19-cv-06573-PSG-RAO Document 89-23 Filed 11/05/20 Page 22 of 34 Page ID
`#:4182
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`

`

`Patent Application Publication Dec. 23, 2004 Sheet 21 of 22
`
`US 2004/0257797 A1
`
`F1 G. 21
`
`120
`111
`N PHOSPHOR
`LED
`120
`LAYER
`120 120 120 ELEMENT 120
`Narsalsa lar Asah-28N
`Z/V/ZZK/ / /ZZ ZAZZY/ / /
`
`130 111 140
`
`111
`
`140 1 0
`
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`104
`
`140
`
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`GLASS
`MEMBER
`
`Case 2:19-cv-06573-PSG-RAO Document 89-23 Filed 11/05/20 Page 23 of 34 Page ID
`#:4183
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`

`

`Patent Application Publication Dec. 23, 2004 Sheet 22 of 22
`F1 G.22
`
`US 2004/0257797 A1
`
`101
`
`122
`LIGHT
`DIFFUSION
`120
`PORTION
`PGSPHOR
`120 120
`EAss
`YF 120 120 120
`111
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`444 ZZZZZYV/Z 23.7 K. 44 4-104
`30 111 140
`111
`140
`1 1 0 140
`LED
`ELEMENT
`
`
`
`
`
`
`
`Case 2:19-cv-06573-PSG-RAO Document 89-23 Filed 11/05/20 Page 24 of 34 Page ID
`#:4184
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`

`

`US 2004/0257797 A1
`
`Dec. 23, 2004
`
`LIGHT EMITTING DEVICE
`0001. The present application is based on Japanese patent
`application Nos. 2003-173650 and 2003-324570, the entire
`contents of which are incorporated herein by reference.
`
`BACKGROUND OF THE INVENTION
`0002) 1. Field of the Invention
`0003. The invention relates to a light emitting device
`where light emitted from a light emitting diode (hereinafter
`referred to as LED) is absorbed and wavelength-converted
`by phosphor and then the wavelength-converted light with a
`different wavelength is radiated therefrom.
`0004 2. Description of the Related Art
`0005 Light emitting devices that allow light emitted
`from an LED element to be wavelength-converted by phos
`phor are known. For example, Some of the light emitting
`devices are composed Such that phosphors are contained in
`a Sealing resin, Such as epoxy resin, to Seal the LED element.
`0006 By sealing the LED element with sealing resin, a
`high degree of freedom in designing the light emitting
`device and an enhanced productivity can be obtained. How
`ever, due to the light radiated from the LED element, the
`optical and chemical characteristics of Sealing resin deterio
`rate and, thereby, the emission efficiency of light emitting
`device lowers.
`0007 Also, there is a problem that the emission efficiency
`of phosphor lowers. When the device is used under high
`humidity conditions, the epoxy resin absorbs moisture Since
`it has a moisture absorption property. The moisture absorbed
`there into causes a deterioration or decomposition in phos
`phor. As a result, the emission efficiency of phosphor lowers.
`0008 Further, it is known that, due to intensive light
`emitted from the LED element, the epoxy resin becomes
`colored with time. When the resin is colored, part of light to
`be emitted from the LED element is absorbed by the resin
`and, thereby, the optical output of light emitting device
`lowers.
`0009 Japanese patent application laid-open No. 11
`204838 (hereinafter referred to as prior art 1) discloses a
`light emitting device that an LED element is Sealed with a
`glass layer which contains phosphor (See FIG. 1 described
`ibid.).
`FIG. 1 is a cross sectional view showing the light
`0.010
`emitting device disclosed in prior art 1.
`0.011 The light emitting device 30 is composed of: leads
`31, 32; a cup portion 33 formed in the lead 33; the LED
`element 34 bonded onto a bottom portion 33A in the cup
`portion 33; wires 35 that connects between the electrodes of
`LED element 34 and the leads 31, 32; a glass layer 36 that
`seals the LED element 34 filled in the cup portion 33;
`phosphor 36A contained in the glass layer 36; and transpar
`ent Sealing resin 37 that is formed into a lamp shape and
`Seals the entire device.
`0012. In this composition, since the glass layer 36 with no
`moisture absorption property is used in place of the epoxy
`resin, moisture is not penetrated through the glass layer 36
`and, therefore, the phosphor does not deteriorate. Further,
`
`because of using no epoxy resin, the optical output of light
`emitting device does not lower.
`0013 Japanese patent application laid-open No.2000
`31547 (hereinafter referred to as prior art 2) discloses a light
`emitting device that multiple LED elements are arrayed like
`a matrix (plane matrix) and light to be emitted from the
`LEDs is wavelength-converted to offer light with a desired
`color (See FIG. 2 described ibid.).
`0014 FIG. 2 is a cross sectional view showing the light
`emitting device disclosed in prior art 2.
`0015 The light emitting device 50 is composed of: a base
`51; a reflection frame 52; recesses 53 provided in the
`reflection frame 52; a lead 54; LED elements 55; a wave
`length conversion sheet 56 that includes a transparent sheet
`board 56A and a wavelength conversion material layer 56B;
`and a diffusion plate 57. The interior of recess 53 is filled
`with mold resin 58. The base 51, reflection frame 52,
`wavelength conversion sheet 56 and diffusion plate 57 are
`integrally sealed with the mold resin 58.
`0016. The multiple LED elements 55 arrayed in plane are
`mounted on the base 51, and electric power is Supplied to the
`LED elements 55 through the lead 54 from a power source
`(not shown). The reflection frame 52 attached to the base 51
`allows light emitted from the LED elements 55 to be
`reflected in the recess 53 and to be radiated upward.
`0017. The wavelength conversion sheet 56 is disposed
`over the reflection frame 52. The wavelength conversion
`sheet 56 is made such that the wavelength conversion
`material layer 56B prepared by uniformly mixing a wave
`length conversion material into resin binder is coated on the
`transparent sheet board 56a of sheet resin film, glass etc. and
`is cured. The wavelength conversion material is excited by
`light to be emitted from the LED element 55 and radiates
`excited light. Light with a predetermined wavelength is
`generated when the excited light is mixed with light to be
`directly emitted from the LED element 55.
`0018. Since light to be emitted from the LED elements 55
`arrayed in plane is wavelength-converted by the wavelength
`conversion sheet 56, the light emitting device 50 can offer a
`good wavelength conversion efficiency and an even emis
`Sion color. Therefore, unevenneSS in emission color can be
`reduced.
`0019 However, the light emitting device in prior art 1 has
`problems described below.
`0020 (1) When the glass layer 36 is filled in the cup
`portion 33 to seal the LED element 34, the phosphor 36A is
`deposited collected at a region around the LED element 34.
`Thereby, emitted light is confined or absorbed by the phos
`phor-collected region and, therefore, the external radiation
`efficiency of LED element lowers significantly.
`0021 (2) It is very difficult to make the wavelength
`conversion characteristic even Since the disposition of phos
`phor depends on the filling process of glass material. To
`prevent this, it is necessary to Severely control the mixing
`State of phosphor to be contained in the glass layer 36.
`0022. On the other hand, the light emitting device in prior
`art 2 has problems described below.
`0023 (1) Since light emitted from the LED element 55
`cannot be externally radiated without passing through the
`
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`
`wavelength conversion material layer 56B, the external
`radiation efficiency of light emitting device lowers that
`much.
`0024 (2) Since the reflection frame 52, wavelength con
`version sheet 56 and diffusion plate 57 are integrally sealed
`with the mold resin 58, the entire light emitting device must
`have an increased thickness.
`
`SUMMARY OF THE INVENTION
`0.025. It is an object of the invention to provide a light
`emitting device that can offer an even wavelength conver
`Sion characteristic while avoiding the lowering of external
`radiation efficiency of LED element.
`0026. It is a further object of the invention to provide a
`light emitting device that can be low-profile while offering
`good external radiation efficiency.
`0.027 According to one aspect of the invention, a light
`emitting device comprises:
`0028 a light emitting element portion that radiates
`light with a predetermined wavelength; and
`0029 a wavelength conversion portion that Sur
`rounds a phosphor to be excited by the light with the
`predetermined wavelength with a transparent and
`non-moisture permeability material in the form of
`laminae.
`0.030. It is preferable that the transparent and non-mois
`ture permeability material in the form of laminae to Surround
`the phosphor is of glass. Low-melting glass that is easy to
`mold at a low temperature can be employed as the glass.
`0031. It is preferable that the wavelength conversion
`portion Surrounds and Seals the light emitting element por
`tion, and the phosphor is shaped like a thin film and disposed
`around the light emitting element portion.
`0.032 The wavelength conversion portion may have an
`optical shape to radiate the light according to a desired light
`distribution characteristic from the light emitting element
`portion.
`0033. Further, the wavelength conversion portion may be
`integrally formed Such that the phosphor formed like a thin
`film on a Surface of a first glass material is Sandwiched with
`a Second glass material and then thermally fused.
`0034.
`In the above composition, the deterioration of
`Sealing material caused by light to be irradiated thereto from
`the light emitting element portion, or the deterioration or
`decomposition in phosphor caused by moisture absorbed can
`be prevented. As a result, degradation in wavelength con
`version characteristic can be prevented.
`0035. According to another aspect of the invention, a
`light emitting device comprises:
`0036) a plurality of LED elements disposed on a
`Same plane; and
`0037 a wavelength conversion portion that com
`prises a flat transparent base member that is disposed
`opposite to the plurality of LED elements and a
`phosphor layer that is of a phosphor to be excited by
`light emitted from the LED element and is formed
`like a film on the base member;
`
`0038 wherein the phosphor layer includes part with
`no phosphor in plane.
`0039. It is preferable that the part is located at a region
`where light component emitted from the LED element and
`Subjected to no reflection in the light emitting device is not
`allowed to be transmitted through outside the light emitting
`device.
`0040. The light emitting device may further comprise: a
`plurality of cone-shaped reflection Surfaces that are provided
`corresponding to the plurality of LED elements, wherein the
`reflection Surfaces may be provided with a phosphor layer to
`be excited by light emitted from the LED element.
`0041. The wavelength conversion portion may be struc
`tured Such that the phosphor layer is Sealed in the interior of
`the base member of transparent glass while being in the form
`of a film.
`0042. The phosphor layer may be partially located cor
`responding to the LED element.
`0043. The base member may be provided with an uneven
`Surface to give a light diffusion property.
`0044) In the above composition, since the wavelength
`conversion portion is structured Such that the phosphor layer
`is disposed directly over the LED element while providing
`a gap (light-transmitting window) around the phosphor
`layer, the light emitting device can offer a good wavelength
`conversion characteristic, a low-profile body and good light
`extraction efficiency.
`
`BRIEF DESCRIPTION OF THE DRAWINGS
`004.5 The preferred embodiments according to the inven
`tion will be explained below referring to the drawings,
`wherein:
`0046 FIG. 1 is a cross sectional view showing the light
`emitting device disclosed in prior art 1;
`0047 FIG. 2 is a cross sectional view showing the light
`emitting device disclosed in prior art 2;
`0048 FIG. 3 is a cross sectional view showing central
`part of a light emitting device in a first preferred embodi
`ment of the invention;
`0049 FIGS. 4A to 4E show a method of making a
`wavelength conversion portion of the first embodiment,
`wherein FIG. 4A is a side view showing a glass sheet in
`preparing Step, FIG. 4B is a Side view showing the glass
`sheet in printing step, FIG. 4C is a side view showing the
`glass sheet in bonding preparation Step, FIG. 4D is a side
`view showing the glass sheet in bonding step, and FIG. 4E
`is a top view showing the wavelength conversion portion;
`0050 FIGS. 5A to 5C show a method of assembling the
`light emitting device with the wavelength conversion por
`tion, wherein FIG. 5A is a top view showing a lead frame
`in element mounting step, FIG. 5B is a side view showing
`the lead frame in sealing preparation step, and FIG. 5C is a
`top view showing the lead frame in positioning Step;
`0051 FIGS. 6A to 6C show a method of assembling the
`light emitting device with the wavelength conversion por
`tion, wherein FIG. 6A is a cross sectional view showing
`molds in the molding Step of wavelength conversion portion,
`
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`
`FIG. 6B is a top view showing the lead frame after molding,
`and FIG. 6C is a cross sectional view cut along the line A-A
`in FIG. 6B;
`0.052
`FIG. 7 is a cross sectional view showing central
`part of a light emitting device in a Second preferred embodi
`ment of the invention;
`0.053
`FIG. 8 is a cross sectional view showing central
`part of a light emitting device in a third preferred embodi
`ment of the invention;
`0.054
`FIG. 9 is a cross sectional view showing central
`part of a light emitting device in a fourth preferred embodi
`ment of the invention;
`0.055
`FIG. 10 is a cross sectional view showing central
`part of a light emitting device in a fifth preferred embodi
`ment of the invention;
`0056 FIG. 11 is a cross sectional view showing central
`part of a light emitting device in a sixth preferred embodi
`ment of the invention;
`0057 FIGS. 12A to 12C show a method of making the
`light emitting device of the sixth embodiment, wherein FIG.
`12A is a top view showing a ceramic substrate with an LED
`element mounted thereon, FIG. 12B is a top view showing
`the ceramic Substrate with a wavelength conversion portion
`heat-pressed thereon, and FIG. 12C is a side view showing
`the ceramic Substrate;
`0.058
`FIG. 13 is an illustration showing the operation
`principle of a wavelength conversion member in a Seventh
`preferred embodiment of the invention;
`0059 FIG. 14 is a cross sectional view showing a light
`emitting device with a transparent wavelength conversion
`portion in an eighth preferred embodiment of the invention;
`0060 FIGS. 15A and 15B show a light emitting device
`in a ninth preferred embodiment of the invention, wherein
`FIG. 15A is a top view thereof and FIG. 15B is a cross
`sectional view cut along the line B-B in FIG. 15A;
`0061 FIGS. 16A to 16F are cross sectional views show
`ing a method of making the light emitting device of the ninth
`embodiment;
`0062 FIG. 17 is a flow chart showing the method of
`making the light emitting device of the ninth embodiment;
`0.063
`FIG. 18 is a cross sectional view showing a modi
`fication of the ninth embodiment;
`0064 FIGS. 19A and 19B show a light emitting device
`in a tenth preferred embodiment of the invention, wherein
`FIG. 19A is a top view thereof and FIG. 19B is a cross
`sectional view cut along the line C-C in FIG. 19A;
`0065 FIG. 20 is a cross sectional view showing a light
`emitting device in an eleventh preferred embodiment of the
`invention;
`0.066
`FIG. 21 is a cross sectional view showing a light
`emitting device in a twelfth preferred embodiment of the
`invention; and
`0067 FIG. 22 is a cross sectional view showing a light
`emitting device in a thirteenth preferred embodiment of the
`invention.
`
`DETAILED DESCRIPTION OF THE
`PREFERRED EMBODIMENTS
`0068 FIG. 3 is a cross sectional view showing central
`part of the light emitting device in the first preferred embodi
`ment of the invention.
`0069. The light emitting device 1 is composed of: a
`wavelength conversion portion 2 that is of transparent glass
`material and includes a phosphor layer 2A having a phos
`phor 200; an LED element 3 that is operable to emit light
`with a predetermined wavelength; a Submount element 4 on
`which the LED element 3 is mounted; a lead frame 5 that is
`a wiring conductor to Supply electric power to the LED
`element 3; and a glass Sealing portion 6 to protect the bottom
`Surface of lead frame 5.
`0070 The wavelength conversion portion 2 is composed
`such that a thin-film phosphor layer 2A is laid between two
`layers of transparent low-melting glass with a refractive
`index of 1.5 and the two glass layers are thermally fused to
`be integrated with the phosphor layer 2A. Further, the
`wavelength conversion portion 2 is formed into a dome-like
`optical shape according to a desired light distribution char
`acteristic by hot pressing, and it Seals the LED element 3
`while being thermally fused and bonded onto the lead frame
`5. The phosphor layer 2A is shaped like a convex polygon
`to cover the emission observation Surface of LED element 3
`in accordance with the formation of wavelength conversion
`portion 2.
`0071. The LED element 3 is a flip-chip type light emit
`ting element with an Al-O. Substrate, and it has an emission
`wavelength of 380 nm. The LED element 3 has electrodes
`that are electrically connected through Au bumps (not
`shown) to a wiring pattern which is formed on the Submount
`element 4.
`0072 The submount element 4 is of AIN and has the
`copper-foil wiring pattern (not shown) formed on its Surface.
`The wiring pattern is electrically connected to the electrodes
`of LED element 3 and is solder-bonded to the lead frame 5.
`0073. The lead frame 5 is of copper or copper alloy and
`has a Au plating formed on its Surface. Its tip portion to be
`bonded to the Submount element 4 is provided with a step 5A
`in accordance with the thickness of Submount element 4.
`The upper surface of Submount element 4 solder-bonded to
`the step 5A and the upper surface of lead frame 5 have a flat
`face.
`0074 The glass sealing portion 6 is of the same glass
`material as the low-melting glass to compose the wavelength
`conversion portion 2. It protects the bottom Surface of lead
`frame 5 while being integrated with the wavelength conver
`Sion portion 2 by the hot pressing mentioned above.
`0075 FIGS. 4A to 4E show a method of making the
`wavelength conversion portion 2.
`0.076
`(1) Preparing Step
`0077 FIG. 4A is a side view showing a glass sheet in
`preparing Step.
`0078. At first, the glass sheet 201 which is a sheet of
`low-melting glass is provided. The glass sheet 201 has a
`length that allows multiple LED elements 3 to be disposed
`in the longitudinal direction.
`
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`0079 (2) Printing Step
`0080 FIG. 4B is a side view showing the glass sheet in
`printing step.
`0081. A phosphor solution is prepared that phosphor 200
`is dissolved in n-butylacetate containing around 1% nitro
`cellulose as a Viscosity improver. The Solution is deposited
`like a thin film on the surface of glass sheet 201 by
`Screen-printing at a pitch according to a disposition interval
`of LED element 3. Then, the glass sheet 201 with the
`phosphor Solution printed thereon is thermally treated to
`remove the solvent to form the phosphor layer 2A. The
`thermal treatment may be conducted in reduced-pressure
`atmosphere.
`0082 (3) Bonding Preparation Step
`0.083
`FIG. 4C is a side view showing the glass sheet in
`bonding preparation Step.
`0084. A glass sheet 202 is prepared that is of the same
`low-melting glass as the glass sheet 201. It is disposed on the
`glass sheet 201 prepared in the printing Step to Sandwich the
`phosphor layer 2A. Although it is preferable that the glass
`sheets 201 and 202 have the same shape, they may have a
`shape different from each other.
`0085 (4) Boding Step
`0.086
`FIG. 4D is a side view showing the glass sheet in
`bonding step.
`0087. The glass sheets 201 and 202 with the phosphor
`layer sandwiched therebetween are thermally fused and
`bonded by hot pressing in reduced-pressure atmosphere. The
`phosphor layer 2A is shaped like a layer Such that it is
`located at the boundary of the thermally bonded glass sheets
`201 and 202.
`0088 FIG. 4E is a top view showing the wavelength
`conversion portion.
`0089. The wavelength conversion portion 2 is composed
`Such that the phosphor layer 2A shaped by the Screen
`printing is sandwiched by the glass sheets 201 and 202.
`Although the phosphor layer 2A is shaped like a Square in
`FIG. 4E, it may be shaped into various shapes that can be
`formed by the Screen printing. For example, it may be
`formed circular.
`0090 FIGS. 5A to 5C show a method of assembling the
`light emitting device with the wavelength conversion por
`tion.
`0091 (1) LED Element Mounting Step
`0092 FIG. 5A is a top view showing the lead frame 5 in
`element mounting Step.
`0093. The lead frame 5 is formed by press-stamping a
`strip of copper alloy. Then, the submount element 4 of AlN
`is solder-bonded to the lead frame 5. Then, the electrodes of
`LED element 3 are electrically connected through Aubumps
`to the wiring patter