Improved-Legibility
`Copy of U.S. Patent No. 8,018,049
`
`JX-001
`
`JX-001.001
`
`

`
`US008018049B2
`
`(12) United States Patent
`Minervini
`
`(10) Patent No.:
`
`(45) Date of Patent:
`
`US 8,018,049 B2
`*Sep. 13, 2011
`
`(54) SILICON CONDENSER MICROPHONE AND
`MANUFACTURING METHOD
`
`(56)
`
`References Cited
`
`U.S. PATENT DOCUMENTS
`
`(75)
`
`Inventor: Anthony D. Minervini, Palos Hills, IL
`(US)
`
`(73) Assignee: Knowles Electronics LLC, Itasca, IL
`(US)
`
`( * ) Notice:
`
`Subject to any disclaimer, the term of this
`patent is extended or adjusted under 35
`U.S.C. 154(b) by 1136 days.
`
`This patent is subject to a terminal dis-
`claimer.
`
`(21) Appl.No.: 11/741,881
`
`(22)
`
`Filed:
`
`Apr. 30, 2007
`
`(65)
`
`Prior Publication Data
`
`US 2007/0201715 A1
`
`Aug. 30, 2007
`
`Related U.S. Application Data
`
`(60) Division of application No. 10/921,747, filed on Aug.
`19, 2004, now Pat. No. 7,434,305, which is a
`continuation-in-part of application No. 09/886,854,
`filed on Jun. 21, 2001, now Pat. No. 7,166,910.
`
`(60) Provisional application No. 60/253,543, filed on Nov.
`28, 2000.
`
`(51)
`
`Int. Cl.
`(2006.01)
`H01L 23/12
`(2006.01)
`H01L 21/00
`(2006.01)
`H04R 9/08
`(52) U.S. Cl.
`...... .. 257/704; 257/724; 257/729; 257/730;
`381/369; 438/26; 438/121
`(58) Field of Classification Search ...................... .. None
`See application file for complete search history.
`
`3,735,211 A
`4,127,840 A
`4,222,277 A
`4,277,814 A
`4,314,226 A
`4,456,796 A
`4,533,795 A
`4,558,184 A
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`(Continued)
`
`CA
`
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`
`(Continued)
`OTHER PUBLICATIONS
`
`Scheeper, P.R. et al., “A Review of Silicon Microphones”, Sensor and
`Actuators Actuators, A 44 (1994) pp. 1-11.
`
`(Continued)
`
`Primary Examiner — Alonzo Chambliss
`(74) Attorney, Agent, or Firm — Dykema Gossett PLLC
`
`ABSTRACT
`(57)
`A silicon condenser microphone package and method for
`manufacture are disclosed. The silicon condenser micro-
`
`phone package includes a silicon condenser microphone die,
`a substrate comprising a conductive layer, and a cover having
`a conductive layer, where the conductive layers of the sub-
`strate and cover are electrically connected to form an electro-
`magnetic interference shield for the silicon condenser micro-
`phone die. The method for manufacturing the silicon
`condenser microphone package involves placement of a plu-
`rality of silicon condenser microphone dies on a panel of
`printed circuit board material, placement of covers over each
`ofthe silicon condenser microphone dies, and then separating
`the panel into individual packages.
`
`26 Claims, 19 Drawing Sheets
`
`
`
`JX-001.002
`
`JX-001.002
`
`

`
`US 8,018,049 B2
`Page 2
`
`>>D>>>>>D>>>>>>D>>>>>>D>>>>>D>D>>D>D>D>D>D>D>>D>D>D>D>>>D>D>D>D>D>D>D>D>D>
`
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`5,889,872
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`
`******
`
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`
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`7/2006 Minervini
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`
`JX-001.003
`
`JX-001.003
`
`

`
`US 8,018,049 B2
`Page 3
`
`Notice of Commission Determination to Review in Part an Initial
`Determination, In the Matter of Certain Silicon Microphone Pack-
`ages and Products Containing the Same, ITC InV. No. 337-TA-695
`(Jan. 21, 2011).
`Initial Determination on Violation of Section 337 and Recommended
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`Microphone Packages and Products Containing the Same, ITC InV.
`No. 337-TA-629 (Jan. 12, 2009).
`
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`V International Trade Commission and Knowles Electronics LLC,
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`
`* cited by examiner
`
`JX-001.004
`
`JX-001.004
`
`

`
`U.S. Patent
`
`Sep. 13, 2011
`
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`US 8,018,049 B2
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`

`
`U.S. Patent
`
`Sep. 13, 2011
`
`Sheet 12 of 19
`
`US 8,018,049 B2
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`U.S. Patent
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`Sep. 13, 2011
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`Sheet 13 of 19
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`US 8,018,049 B2
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`U.S. Patent
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`Sep. 13, 2011
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`US 8,018,049 B2
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`JX-001.018
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`

`
`U.S. Patent
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`Sep. 13, 2011
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`Sheet 15 of 19
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`US 8,018,049 B2
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`JX-001.019
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`JX-001.019
`
`

`
`U.S. Patent
`
`Sep. 13, 2011
`
`Sheet 16 of 19
`
`US 8,018,049 B2
`
`FIGURE 26
`
`JX-001.020
`
`JX-001.020
`
`

`
`U.S. Patent
`
`Sep. 13, 2011
`
`Sheet 17 of 19
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`US 8,018,049 B2
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`JX-001.021
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`

`
`U.S. Patent
`
`Sep. 13, 2011
`
`Sheet 18 of 19
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`US 8,018,049 B2
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`JX-001.022
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`

`
`U.S. Patent
`
`Sep. 13, 2011
`
`Sheet 19 of 19
`
`US 8,018,049 B2
`
`FIGURE 31
`
`JX-001.023
`
`JX-001.023
`
`

`
`US 8,018,049 B2
`
`1
`SILICON CONDENSER MICROPHONE AND
`MANUFACTURING METHOD
`
`RELATED APPLICATION
`
`This application is a divisional ofU.S. application Ser. No.
`10/921,747 filedAug. 18, 2004, now U.S. Pat. No. 7,434,305,
`which is a continuation-in-part of U.S. application Ser. No.
`09/886,854, filed Jun. 21, 2001, now U.S. Pat. No. 7,166,910,
`which claims the benefit ofprovisional patent application Ser.
`No. 60/253,543 filed Nov. 28, 2000. These applications are
`hereby incorporated by reference herein in their entireties for
`all purposes.
`
`TECHNICAL FIELD
`
`This patent relates generally to a housing for a transducer.
`More particularly, this patent relates to a silicon condenser
`microphone including a housing for shielding a transducer.
`
`BACKGROUND OF THE INVENTION
`
`There have been a number of disclosures related to build-
`
`ing microphone elements on the surface of a silicon die.
`Certain ofthese disclosures have come in connection with the
`
`hearing aid field for the purpose of reducing the size of the
`hearing aid unit. While these disclosures have reduced the
`size of the hearing aid, they have not disclosed how to protect
`the transducer from outside interferences. For instance, trans-
`ducers of this type are fragile and susceptible to physical
`damage. Furthermore, they must be protected from light and
`electromagnetic interferences. Moreover,
`they require an
`acoustic pressure reference to function properly. For these
`reasons, the silicon die must be shielded.
`Some shielding practices have been used to house these
`devices. For instance, insulated metal cans or discs have been
`provided. Additionally, DIPs and small outline integrated
`circuit (SOIC) packages have been utilized. However, the
`drawbacks associated with manufacturing these housings,
`such as lead time, cost, and tooling, make these options unde-
`sirable.
`
`SUMMARY OF THE INVENTION
`
`The present invention is directed to a silicon condenser
`microphone package that allows acoustic energy to contact a
`transducer disposed within a housing. The housing provides
`the necessary pressure reference while at the same time pro-
`tects the transducer from light, electromagnetic interference,
`and physical damage. In accordance with an embodiment of
`the invention a silicon condenser microphone includes a
`transducer and a substrate and a cover forming the housing.
`The substrate may have an upper surface with a recess formed
`therein allowing the transducer to be attached to the upper
`surface and to overlap at least a portion of the recess thus
`forming a back volume. The cover is placed over the trans-
`ducer and includes an aperture adapted for allowing sound
`waves to reach the transducer.
`
`Other features and advantages of the invention will be
`apparent from the following specification taken in conjunc-
`tion with the following drawings.
`
`BRIEF DESCRIPTION OF THE DRAWINGS
`
`FIG. 1 is a cross-sectional view of a first embodiment of a
`
`silicon condenser microphone of the present invention;
`
`10
`
`15
`
`20
`
`25
`
`30
`
`35
`
`40
`
`45
`
`50
`
`55
`
`60
`
`65
`
`2
`FIG. 2 is a cross-sectional view of a second embodiment of
`
`a silicon condenser microphone of the present invention;
`FIG. 3 is a cross-sectional view of a third embodiment of a
`
`silicon condenser microphone of the present invention;
`FIG. 4 is a cross-sectional view ofthe third embodiment of
`
`the present invention afiixed to an end user circuit board;
`FIG. 5 is a cross-sectional view ofthe third embodiment of
`
`the present invention afiixed to an end user circuit board in an
`altemate fashion; and
`FIG. 6 is a plan view of a substrate to which a silicon
`condenser microphone is fixed;
`FIG. 7 is a longitudinal cross-sectional view of a micro-
`phone package of the present invention;
`FIG. 8 is a lateral cross-sectional view of a microphone
`package of the present invention;
`FIG. 9 is a longitudinal cross-sectional view of a micro-
`phone package of the present invention;
`FIG. 10 is a lateral cross-sectional view of a microphone
`package of the present invention;
`FIG. 11 is a cross-sectional view of a top portion for a
`microphone package of the present invention;
`FIG. 12 is a cross-sectional view of a top portion for a
`microphone package of the present invention;
`FIG. 13 is a cross-sectional view of a top portion for a
`microphone package of the present invention;
`FIG. 14a is a cross-sectional view of a laminated bottom
`
`portion of a housing for a microphone package of the present
`invention;
`FIG. 14b is a plan view of a layer of the laminated bottom
`portion of FIG. 1411;
`FIG. 14c is a plan view of a layer of the laminated bottom
`portion of FIG. 1411;
`FIG. 14d is a plan view of a layer of the laminated bottom
`portion of FIG. 1411;
`FIG. 15 is a cross-sectional view of a bottom portion for a
`microphone package of the present invention;
`FIG. 16 is a cross-sectional view of a bottom portion for a
`microphone package of the present invention;
`FIG. 17 is a cross-sectional view of a bottom portion for a
`microphone package of the present invention;
`FIG. 18 is a cross-sectional view of a bottom portion for a
`microphone package of the present invention;
`FIG. 19 is a plan view of a side portion for a microphone
`package of the present invention;
`FIG. 20 is a cross-sectional view of a side portion for a
`microphone package of the present invention;
`FIG. 21 is a cross-sectional view of a side portion for a
`microphone package of the present invention;
`FIG. 22 is a cross-sectional view of a side portion for a
`microphone package of the present invention;
`FIG. 23 is a cross-sectional view of a microphone package
`of the present invention;
`FIG. 24 is a cross-sectional view of a microphone package
`of the present invention;
`FIG. 25 is a cross-sectional view of a microphone package
`of the present invention;
`FIG. 26 is a cross-sectional view of a microphone package
`of the present invention;
`FIG. 27 is a cross-sectional view of a microphone package
`of the present invention with a retaining ring;
`FIG. 28 is a cross-sectional view of a microphone package
`of the present invention with a retaining wing;
`FIG. 29 is a cross-sectional view of a microphone package
`of the present invention with a retaining ring;
`FIG. 30 is a plan view of a panel ofa plurality of micro-
`phone packages; and
`FIG. 31 is a plan view of a microphone pair.
`
`JX-O01 .024
`
`JX-001.024
`
`

`
`3
`DETAILED DESCRIPTION
`
`US 8,018,049 B2
`
`4
`
`While the invention is susceptible of embodiments in many
`different forms, there is shown in the drawings and will herein
`be described in detail several possible embodiments of the
`invention with the understanding that the present disclosure is
`to be considered as an exemplification ofthe principles of the
`invention and is not intended to limit the broad aspect of the
`invention to the embodiments illustrated.
`
`The present invention is directed to microphone packages.
`The benefits of the microphone packages disclosed herein
`over microphone packaging utilizing plastic body/lead
`frames include the ability to process packages in panel form
`allowing more units to be formed per operation and at much
`lower cost. The typical lead frame for a similarly functioning
`package would contain between 40 and 100 devices con-
`nected together. The present disclosure would have approxi-
`mately 14,000 devices connected together (as a panel). Also,
`the embodiments disclosed herein require minimal “hard-
`tooling” This allows the process to adjust to custom layout
`requirements without having to redesign mold, lead frame,
`and trim/form tooling.
`Moreover, many of the described embodiments have a
`better match ofthermal coefiicients of expansion with the end
`user’s PCB, typically made of FR-4, since the microphone
`package is also made primarily of FR-4. These embodiments
`ofthe invention may also eliminate the need for wire bonding
`that is required in plastic body/lead frame packages. The
`footprint is typically smaller than that would be required for
`a plastic body/lead frame design since the leads may be
`formed by plating a through-hole in a circuit board to form the
`pathway to the solder pad. In a typical plastic body/lead frame
`design, a (gull wing configuration would be used in which the
`leads widen the overall foot print.
`Now, referring to FIGS. 1-3, three embodiments of a sili-
`con condenser microphone package 10 of the present inven-
`tion are illustrated. Included within silicon microphone pack-
`age 10 is a transducer 12, e.g. a silicon condenser microphone
`as disclosed in U.S. Pat. No. 5,870,482 which is hereby incor-
`porated by reference and an amplifier 16. The package itself
`includes a substrate 14, a back volume or air cavity 18, which
`provides a pressure reference for the transducer 12, and a
`cover 20. The substrate 14 may be formed of FR-4 material
`allowing processing in circuit board panel form, thus taking
`advantage of economies of scale in manufacturing. FIG. 6 is
`a plan view of the substrate 14 showing the back volume 18
`surrounded a plurality of terminal pads.
`The back volume 18 may be formed by a number of meth-
`ods, including controlled depth drilling of an upper surface 19
`of the substrate 14 to form a recess over which the transducer
`
`12 is mounted (FIG. 1); drilling and routing of several indi-
`vidual sheets of FR-4 and laminating the individual sheets to
`form the back volume 18, which may or may not have internal
`support posts (FIG. 2); or drilling completely through the
`substrate 14 and providing a sealing ring 22 on the bottom of
`the device that will seal the back volume 18 during surface
`mounting to a user’s “board” 28 (FIGS. 3-5). In this example,
`the combination of the substrate and the user’s board 28
`
`creates the back volume 18. The back volume 18 is covered by
`the transducer 12 (e.g., a MEMS device) which may be
`“bumpbonded” and mounted face down. The boundary is
`sealed such that the back volume 18 is operably “air-tight”.
`The cover 20 is attached for protection and processability.
`The cover 20 contains an aperture 24 which may contain a
`sintered metal insert 26 to prevent water, particles and/or light
`from entering the package and damaging the internal compo-
`nents inside; i.e. semiconductor chips. The aperture 24 is
`
`5
`
`10
`
`15
`
`20
`
`25
`
`30
`
`35
`
`40
`
`45
`
`50
`
`55
`
`60
`
`65
`
`adapted for allowing sound waves to reach the transducer 12.
`The sintered metal insert 26 will also have certain acoustic
`
`properties, e.g. acoustic damping or resistance. The sintered
`metal insert 26 may therefore be selected such that its acoustic
`properties enhance the functional capability of the transducer
`12 and/or the overall performance of the silicon microphone
`10.
`
`Referring to FIGS. 4 and 5 the final form of the product is
`a silicon condenser microphone package 10 which would
`most likely be attached to an end user’s PCB 28 via a solder
`reflow process. FIG. 5 illustrates a method of enlarging the
`back volume 18 by including a chamber 32 within the end
`user’s circuit board 28.
`
`Another embodiment of a silicon condenser microphone
`package 40 of the present invention is illustrated in FIGS.
`7-10. In this embodiment, a housing 42 is formed from layers
`of materials, such as those used in providing circuit boards.
`Accordingly, the housing 42 generally comprises alternating
`layers of conductive and non-conductive materials 44, 46.
`The non-conductive layers 46 are typically FR-4 board. The
`conductive layers 44 are typically copper. This multi-layer
`housing construction advantageously permits the inclusion of
`circuitry, power and ground planes, solder pads, ground pads,
`capacitance layers and plated through holes pads within the
`structure of the housing itself. The conductive layers provide
`EMI shielding while also allowing configuration as capaci-
`tors and/or inductors to filter input/output signals and/or the
`input power supply.
`In the embodiment illustrated, the housing 42 includes a
`top portion 48 and a bottom portion 50 spaced by a side
`portion 52. The housing 42 further includes an aperture or
`acoustic port 54 for receiving an acoustic signal and an inner
`chamber 56 which is adapted for housing a transducer unit 58,
`typically a silicon die microphone or a ball grid array package
`(BGA). The top, bottom, and side portions 48, 50, 52 are
`electrically connected, for example with a conductive adhe-
`sive 60. The conductive adhesive may be provided conve-
`niently in the form of suitably configured sheets of dry adhe-
`sive disposed between the top, bottom and side portions 48,
`50 and 52. The sheet of dry adhesive may be activated by
`pressure, heat or other suitable means after the portions are
`brought together during assembly. Each portion may com-
`prise altemating conductive and non-conductive layers of 44,
`46.
`
`The chamber 56 may include an inner lining 61. The inner
`lining 61 is primarily formed by conductive material. It
`should be understood that the inner lining may include por-
`tions of non-conductive material, as the conductive material
`may not fully cover the non-conductive material. The inner
`lining 61 protects the transducer 58 against electromagnetic
`interference and the like, much like a faraday cage. The inner
`lining 61 may also be provided by suitable electrically cou-
`pling together ofthe various conductive layers within the top,
`bottom and side portions 48, 50 and 52 of the housing.
`In the various embodiments illustrated in FIGS. 7-10 and
`
`23-26, the portions ofthe housing 42 that include the aperture
`or acoustic port 54 further include a layer of material that
`forms an environmental barrier 62 over or within the aperture
`54. This environmental barrier 62 is typically a polymeric
`material formed to a film, such as a polytetrafluoroethylene
`(PTFE) or a sintered metal. The environmental barrier 62 is
`supplied for protecting the chamber 56 ofthe housing 42, and,
`consequently, the transducer unit 58 within the housing 42,
`from environmental elements such as sunlight, moisture, oil,
`dirt, and/or dust. The environmental barrier 62 will also have
`inherent acoustic properties, e.g. acoustic damping/resis-
`tance. Therefore the environmental barrier 62 is chosen such
`
`JX-001.025
`
`JX-001.025
`
`

`
`US 8,018,049 B2
`
`5
`that its acoustic properties cooperate with the transducer unit
`58 to enhance the performance of the microphone. This is
`particularly true in connection with the embodiments illus-
`trated in FIGS. 24 and 25, which may be configured to operate
`as directional microphones.
`The environmental barrier layer 62 is generally sealed
`between layers of the portion, top 48 or bottom 50 in which
`the acoustic port 54 is formed. For example, the environmen-
`tal barrier may be securedbetween layers ofconductive mate-
`rial 44 thereby permitting the layers of conductive material 44
`to act as a capacitor (with electrodes defined by the metal) that
`can be used to filter input and output signals or the input
`power. The environmental barrier layer 62 may further serve
`as a dielectric protective layer when in contact with the con-
`ductive layers 44 in the event that the conductive layers also
`contain thin film passive devices such as resistors and capaci-
`tors.
`
`In addition to protecting the chamber 56 from environmen-
`tal elements, the barrier layer 62 allows subsequent wet pro-
`ces sing, board washing ofthe extemal portions ofthe housing
`42, and electrical connection to ground from the walls via thru
`hole plating. The environmental barrier layer 62 also allows
`the order of manufacturing steps in the fabrication of the
`printed circuit board-based package to be modified. This
`advantage can be used to accommodate different termination
`styles. For example, a double sided package can be fabricated
`having a pair of apertures 54 (see FIG. 25), both including an
`environmental barrier layer 62. The package would look and
`act the same whether it is mounted face up or face down, or the
`package could be mounted to provide directional microphone
`characteristics. Moreover, the environmental barrier layer 62
`may also be selected so that its acoustic properties enhance
`the directional performance of the microphone.
`Referring to FIGS. 7, 8, and 11-13 the transducer unit 58 is
`generally not mounted to the top portion 48 of the housing.
`This definition is independent of the final mounti