RX-0931
`
`mv No 337-TA-825rr
`
`11
`
`Electronic Materials HandbookTM
`
`

`
`ELECTRONIC MATERIALS HANDBOOKTM
`
`Volume
`
`PACKAGINO
`
`under
`the direction
`Prepared
`ASM INTERNATIONAL Handbook Committee
`
`of the
`
`Merriil
`
`Minges
`
`Technical Chairman
`
`Cyril
`
`Mara
`
`Heather
`
`Dostal Senior Editor
`Woods Technical
`Lampman Editorial Supervisor
`Crankovic Editorial Coordinator
`
`Editor
`
`George
`Mice
`Ronke Assistant Editor
`Karen Lynn OKeefe Word Processing
`
`Specialist
`
`Robert
`
`Stedfeld
`
`Director
`
`of Reference
`
`Pubtications
`
`Joseph
`
`Davis Manager
`
`of Handbook Development
`
`Kathleen
`
`Mills Manager
`
`of Book Production
`
`Editorial Assistance
`
`Lois
`
`Abel
`
`Kelly Ferjutz
`Penelope Thomas
`Wheaton
`Nikki
`
`ASNiVrF4r4L
`
`MATERIALS PARK OH 44073
`
`

`
`Copyright
`
`1989
`
`by
`ASM INTERNATIONAL
`All
`reserved
`
`rights
`
`this book may be reproduced
`No part of
`mechanical photocopying
`form or by any nieans electronic
`owner
`of
`the copyright
`the written permission
`
`in
`
`retrieval
`
`stored
`
`First printing
`
`November
`
`1989
`
`system or transmitted
`
`in any
`or otherwise without
`
`recording
`
`Electronic
`
`Materials
`
`Handbook
`
`is
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`collective
`
`effort
`
`technical
`
`sources
`
`to
`
`hundreds of
`involving
`from world-wide
`and long-range
`problems
`this volume but
`
`specialists
`help scientists
`
`It brings
`
`Great
`
`care is
`
`taken
`
`in one book
`
`together
`and technicians
`
`engineers
`in the compilation
`
`clear
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`that no warranties
`
`express
`completeness of this publication
`
`wealth of information
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`solve current
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`thai may
`
`arise
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`Nothing contained
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`right
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`in the Electronic
`
`Materials
`
`Handbook
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`covered
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`Comments
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`INTERNATIONAL
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`forwarded
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`to ASM
`
`Library of Congress Cataloging-in
`
`Publication
`
`Data
`
`ASM INTERNATIONAL
`
`the direction
`
`chairman
`
`Electronic materials handbook/prepared under
`the ASM INTERNATIONAL
`Handbook
`Committee
`of
`Minges technical
`Merrill
`cm
`references
`
`includes
`
`and index
`
`bibliographical
`Contents
`Packaging
`ISBN 0-87170-285-I
`MaterialsHandbooks
`
`Electronics
`
`Electronic
`
`Ii
`
`packagingHandbooks
`Minges Merrill
`ASM INTERNATIONAL
`Handbook Committee
`TK7871.E44
`1989
`62l3810464e20
`
`manuals etc
`
`manuals etc
`
`89-17953
`CIP
`
`RX-0931
`
`.0003
`
`

`
`464 Packages
`
`Fig
`
`Filling
`
`vias
`
`in prepunched
`
`tape
`
`Topmost
`
`substrate
`
`layer
`
`Stencil
`
`Via paste
`
`Substrate
`
`layer
`
`Porous
`
`stone
`
`Access
`
`slot
`
`for
`
`laser
`
`trimming
`
`Resistor
`
`termination
`
`are designed
`rate of the dielectric
`slightly un
`appear
`or underfilled
`
`stage Complete filling of
`modified printing
`single printing pass is accom
`in
`the vias
`printing through
`plished by using on-contact
`stencil made of brass foil on
`polyester
`film carrier
`Via fill
`
`compositions
`
`to
`
`match the shrinkage
`should
`Ideally the via
`derfilled Grossly overfilled
`The
`vias are undesirable
`create problems when conductors
`them because
`paste
`sequently printed over
`shorts between closely
`spreading may cause
`can occasion
`vias Underfilled
`spaced
`ally open up forming
`hole
`coated
`After via filling the tape layers are dried in
`oven If defects are observed
`convection
`the layer
`be corrected or
`to lamination
`
`vias
`overfilled
`are sub
`
`vias
`
`the pattern can
`discarded
`
`special
`
`is
`
`is
`
`and
`
`registration
`
`Fig
`
`Two-step
`
`lamination
`
`process for
`
`laser-trimmable
`
`buried resistors
`
`substrate
`
`resistors
`
`tration
`
`stack of
`
`layer over
`
`also influences the absolute value of shrink
`laminating conditions can be used
`age local
`de
`in actual
`final dimensions
`to establish
`
`signs
`
`the green microstruCtUres of the
`Although
`spatial distribution
`substrate layer contain
`of porosity see the section Substrate Lay
`varies with the
`ers in this article that
`and the processing
`formulation
`of porosity
`
`parameters
`be
`
`can
`
`involves prelaminating
`step process
`laser-trimmable
`layers on which
`lami
`and subsequently
`are printed
`the stack
`nating the topmost
`and Registra
`Collation
`Inspection
`for
`tion After drying layers are inspected
`and via registration Regis
`line continuity
`of the substrate layers must be held
`to less than 0.1 mm 0.004 in tolerance
`printing
`via forming conductor
`through
`and lamination steps After inspection
`layers are collated and aligned so that
`holes are concentric
`corner
`pins in the
`of
`the registration
`placement
`in Fig 10
`lamination die as shown
`
`tape
`
`the
`
`for
`
`prior
`required for
`printing stage
`filling vias or printing conductors
`porous
`vacuum
`which
`through
`stone
`plate
`to hold down the tape
`drawn is used
`substrate for
`flat distortion-free
`The machine setup
`Fig
`for via
`to that
`printing is similar
`off-contact
`the conventional
`but
`printing mode is used as on an
`layer with the
`substrate
`substrate The
`print pattern is then dried
`conductor
`cofired process
`In the low-temperature
`can also be printed on
`formula
`If the resistor
`
`provide
`
`printing
`
`conductor
`
`filling
`
`thick-film
`
`resistors
`
`the substrate layer
`
`for
`
`Substrate Fabrication
`
`alumina
`
`tions
`
`are appropriately
`
`adjusted
`
`they can
`
`be cofired in buried configurations Ref 23
`be printed on any substrate
`Resistors can
`layer and terminated with appropriate met
`allization Resistors buried within the lami
`trimmed to precise
`be
`laser
`cannot
`nate
`formulations
`are
`values consequently such
`resistance tolerances of
`to have
`designed
`less than 25% Resistors requiring precise
`trimmed
`resistance values
`on the
`be printed either
`These resistors
`topmost substrate layer or one layer below
`slot 250
`or 10 mils wide and 2.5 mm or 0.1 in
`access
`long in the top layer provides
`printed below it
`trimming the resistor
`laser
`for
`two-step process
`illustrates
`buried resistors The two-
`
`need
`
`to be laser
`
`can
`
`it
`
`In the latter
`
`configuration
`
`for
`
`Figure
`
`laser-trimmable
`
`registered
`
`in
`
`Lamination Sets of collated
`pressing die
`having
`layers are placed
`the
`to those of
`identical
`cavity dimensions
`The confined die walls pre
`sheet
`blanked
`of the sheets during
`lateral distortion
`pins ensure
`and circuitry align
`mechanical
`registration
`the extent of metallization
`ment Because
`
`vent
`
`lamination
`
`and
`
`the registration
`
`Alignment
`
`fixture for substrate layer
`
`registra
`
`Fig 10
`tion
`
`used the distribution
`changed during the lamination process The
`function
`is often
`removal
`amount of pore
`of the lamination pressure used Figure 11
`decreasing mercury Hg intrusion
`shows
`tests associat
`volumes in Hg porosimetry
`volume of porosity in
`decreasing
`ed with
`increasing pressUres
`affects
`
`at
`laminated
`tapes
`of this porosity directly
`The removal
`that occurs during
`the amount of shrinkage
`
`firing
`relationship between
`The
`in the x-y plane of
`pressure and shrinkage
`011Cc k.
`in Fig 12
`shown
`laminate is
`is dete
`lot
`tape
`for
`shrinkage
`mined and lamination condit1oi
`
`specific
`
`are
`
`Mean pore diameter milS
`
`to
`
`lO 001
`
`0.1
`
`Mean pore
`
`diamet
`
`1rn
`
`ecreaSiflg
`
`Fig 11
`with increasing
`
`mercury
`
`pOr0S1fiCt
`
`lamination
`
`pressure
`
`RX-0931.0004