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`Exhibit A
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`United States Patent No. 6,914,635
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`Case 2:20-cv-02640-NGG-SIL Document 1-4 Filed 06/14/20 Page 2 of 9 PageID #: 19
`I 1111111111111111 11111 111111111111111 IIIII IIIII IIIII IIIII lll111111111111111
`US006914635B2
`
`(12) United States Patent
`Ostergard
`
`(10) Patent No.:
`(45) Date of Patent:
`
`US 6,914,635 B2
`Jul. 5, 2005
`
`(54) MICROMINIATURE ZOOM SYSTEM FOR
`DIGITAL CAMERA
`
`(75)
`
`Inventor: Toni Ostergard, Turku (FI)
`
`(73) Assignee: Nokia Mobile Phones, Ltd., Espoo (FI)
`
`( *) Notice:
`
`Subject to any disclaimer, the term of this
`patent is extended or adjusted under 35
`U.S.C. 154(b) by 695 days.
`
`(21) Appl. No.: 09/779,416
`
`(22) Filed:
`
`Feb. 8,2001
`
`(65)
`
`Prior Publication Data
`
`US 2004/0201773 Al Oct. 14, 2004
`
`Int. Cl.7 ................................................ H04N 5/225
`(51)
`(52) U.S. Cl. ....................... 348/374; 348/340; 348/351;
`348/240.3
`(58) Field of Search ................................. 348/374, 340,
`348/240.3, 351, 357, 240.99
`
`(56)
`
`References Cited
`PUBLICATIONS
`"Electrostatic Linear Microactuator Mechanism for Focus(cid:173)
`ing a CCD Camera" by Koga, et al., Journal of Lightwave
`Technology, vol. 17, No. 1, Jan. 1999; p. 43-47.*
`* cited by examiner
`Primary Examiner-Wendy R. Garber
`Assistant Examiner-Gary C. Vieaux
`(74) Attorney, Agent, or Firm-Perman & Green, LLP
`ABSTRACT
`(57)
`
`A digital camera for use in a communication device in which
`the image sensor is formed on a substrate and is mounted on
`a micro-electromechanical system for movement relative to
`the camera lens to provide an autofocus capability. In
`addition the lens may be mounted on a micro(cid:173)
`electromechanical system for movement relative to the
`image sensor to provide both an autofocus and a zoom
`capability.
`
`12 Claims, 4 Drawing Sheets
`
`24
`
`28
`
`27
`
`26
`
`
`
`Case 2:20-cv-02640-NGG-SIL Document 1-4 Filed 06/14/20 Page 3 of 9 PageID #: 20
`
`U.S. Patent
`
`Jul. 5, 2005
`
`Sheet 1 of 4
`
`US 6,914,635 B2
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`Case 2:20-cv-02640-NGG-SIL Document 1-4 Filed 06/14/20 Page 4 of 9 PageID #: 21
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`U.S. Patent
`
`Jul. 5, 2005
`
`Sheet 2 of 4
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`US 6,914,635 B2
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`Case 2:20-cv-02640-NGG-SIL Document 1-4 Filed 06/14/20 Page 5 of 9 PageID #: 22
`
`U.S. Patent
`
`Jul. 5, 2005
`
`Sheet 3 of 4
`
`US 6,914,635 B2
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`2
`
`WIDE-ANGLE
`
`3
`
`5
`
`IMAGE
`PLANE
`
`FIG.4a
`
`2
`
`VARIATOR
`
`MIDDLE
`
`3
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`5
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`2
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`TELEPHOTO
`
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`Case 2:20-cv-02640-NGG-SIL Document 1-4 Filed 06/14/20 Page 6 of 9 PageID #: 23
`
`U.S. Patent
`
`Jul. 5, 2005
`
`Sheet 4 of 4
`
`US 6,914,635 B2
`
`2
`
`ZOOM
`
`4
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`Case 2:20-cv-02640-NGG-SIL Document 1-4 Filed 06/14/20 Page 7 of 9 PageID #: 24
`
`US 6,914,635 B2
`
`1
`MICROMINIATURE ZOOM SYSTEM FOR
`DIGITAL CAMERA
`
`BACKGROUND OF THE INVENTION
`
`2
`this coordinated movement one or both of these lens can be
`mounted for movement on the MEMS component in opera(cid:173)
`tive association with the sensor array. Since the position of
`the sensor array can be varied the movement of the lens-
`5 system/lenses could in some cases be reduced. With a
`suitable lens design and by moving the sensor array itself, it
`could e.g. be possible to reduce or completely omit the
`movement of one of the lenses, e.g. the compensator. In this
`manner a variety of configurations can be accomplished to
`10 provide the zoom and autofocus functions in a miniaturized
`version of the traditional system.
`
`Mobile communications devices are becoming more com(cid:173)
`pact while their functions and features are ever expanding.
`As a next step in this process of expanding applications, a
`digital camera may be installed. This requires a new cycle of
`development with respect to the digital camera in order to
`package the necessary functions within the compact profile
`of the mobile communications device. In order to miniatur-
`ize the camera for such use, the zoom feature is often
`eliminated or substantially reduced in functionality. This is
`because the apparatus needed to move the lens in a tradi(cid:173)
`tional zoom mechanism is cumbersome. The development is
`facilitated by the introduction of digital, semi-conductor,
`imaging sensors, such as CCD and C-MOS sensor arrays.
`In addition a new class of micro-miniature components
`have become available that provide the functionality of both
`electrical and mechanical components. These components
`are fabricated in a process similar to the manufacture of
`integrated circuit chips, namely the surface treatment of
`silicon wafers. These mechanisms can provide the function
`of sensors (resonators), actuators, transducers, motors, and
`gears to high tolerances. By micro-machining silicon wafers
`layered on a substrate, the components, of the so called
`micro-electromechanical system (MEMS), are constructed
`on a thin substrate. A description of MEMS components is 30
`contained in Philosophical Transactions of the Royal Soci(cid:173)
`ety: Physical Sciences and Engineering, Series A, Issue No.
`1703, Dec. 15, 1995, pp. 355-366, which is incorporated
`herein by reference.
`It is a purpose of this invention to provide an autofocus
`and zoom system for a compact electronic device. A further
`purpose of this invention is to provide these functions by
`using a sensor array, such as a C-MOS sensor array, and a
`lens actuation mechanism suitable for fabrication on a
`silicon wafer. It is a further purpose of this invention to
`utilize the advantages of micro-electromechanical system
`(MEMS) manufacturing techniques to obtain these goals.
`
`DESCRIPTION OF THE DRAWING
`
`The subject invention is described in more detail below
`15 with reference to the drawing in which:
`FIG. la is a schematic illustration of a traditional lens
`system with a fixed sensor array;
`FIG. lb is a schematic illustration of a lens system in
`20 which the sensor array is mounted for movement;
`FIG. 2 is a schematic illustration of the sensor array of this
`invention fabricated with the MEMS component for mul(cid:173)
`tiple positions;
`FIG. 3 is a schematic illustration of the sensor array and
`25 lens system fabricated and mounted for coordinated move(cid:173)
`ment on the MEMS component; and
`FIGS. 4a, 4b, 4c and 4d are schematic illustrations of a
`traditional lens system, showing the various relative posi(cid:173)
`tions of the lenses.
`
`DETAILED DESCRIPTION OF THE
`INVENTION
`A typical optical lens system 1 for a camera having
`35 autofocus and zoom capability is depicted schematically in
`FIGS. 4a-4d. It generally will consists of a primary lens 2,
`a variator lens 3, and a compensator lens 4 which are
`operatively associated to project a focused image on image
`plane 5. As shown, the lens has three "principal" positions,
`40 i.e., wide angle, middle and telephoto. The zoom function,
`as shown in FIG. 4d, can be a smooth movement between
`the two end positions (wide and tele), as indicated by arrow
`30, and do not necessary have to be a stepwise action with
`only three options. These variations in function are provided
`45 by moving the variator and compensator lens, 3 and 4
`respectively, as shown. Lens system 1 is used in a digital
`camera 6, as shown in FIG. 1, in which the lens system 1 is
`secured within a housing (not shown) to project an image on
`an image sensor 7 positioned at the image plane 5 of the
`50 camera 6. The assembly of lens are adjusted, as shown in
`FIGS. 4a-4d to obtain autofocus and zoom functions.
`In accordance with this invention, the mechanical move(cid:173)
`ment of the lens system 1 is constructed through the use of
`advanced micro-machining techniques. Through such
`techniques, a semi-conductor image sensor can be combined
`with a lens system in a unique manner to obtain substantially
`the same functions as described above. The resulting image
`generating system can be exceedingly small and therefore
`can be conveniently packaged within the confines of a
`mobile communications device, such as a cellular telephone.
`As shown in FIG. lb, a semi-conductor image sensor 9 is
`supported for movement by a micro-machined actuator
`assembly 10 in operative association with lens system 8 and
`positioned within the housing 11 of a digital camera or
`mobile communication device.
`The actuating assembly 10 of the digital camera is shown
`in more detail in FIG. 2. In the actuating assembly 10, an
`
`SUMMARY OF THE INVENTION
`
`A miniaturized digital camera is constructed for use with
`a mobile communication device or other compact appliance.
`The optical system of the camera consists of a small lens
`system having the traditional components of a primary lens,
`a variator lens, and a compensator lens. The lens system
`transmits the image received from an external source to a
`sensor array. The sensor array is constructed on a substrate
`using silicon wafer fabrication techniques and is positioned
`to receive the image from the lens system. The array is
`operatively associated with a micro-electro mechanical
`component for movement between at least two positions by 55
`actuation of the MEMS component. Both the array and the
`MEMS component are constructed on the same substrate
`utilizing similar techniques to create an extremely small
`fully functional imaging system for use with the lens system.
`Actuation of the MEMS component, will move the sensor 60
`array relative to the lens system. Such actuation of the
`MEMS component, can be accomplished in response to, for
`example, the sensed distance of the lens system from the
`subject of the image. In this manner an autofocus function
`can be accomplished. The movement of the sensor is com- 65
`bined with a coordinated movement of the variator and/or
`compensator lenses to provide a zoom function. To facilitate
`
`
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`Case 2:20-cv-02640-NGG-SIL Document 1-4 Filed 06/14/20 Page 8 of 9 PageID #: 25
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`US 6,914,635 B2
`
`10
`
`15
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`3
`image sensor 13 is constructed with its associated electron(cid:173)
`ics on a semi-conductor chip 14. Terminal 15 provides the
`sensor 13 with appropriate electrical contact to power the
`sensor 13. A micro-electrical mechanical system (MEMS)
`16 is formed on substrate 17 to support the sensor 13. 5
`MEMS 16 may take many different forms depending on the
`function of the camera and the fabricating technique used.
`For the purpose of illustration, a series of electrostatic
`resonators 18 are schematically shown. Electrostatic reso(cid:173)
`nator 18 is an example of a linear actuator which can be used
`as a precise positioner, among other things. Actuator 18
`consists of a pair of bases 19 which are fixed to the substrate
`17 and moveable supports 20. Supports 20 are connected to
`bases 19 by means of electrostatic fingers 21. Sensor chip 13
`is connected to movable supports 20 by a further pair of
`electrostatic fingers 22. The moveable supports 20 and the
`sensor chip 13 can be moved by applying a voltage between
`the moveable structure and its immediately adjacent sup(cid:173)
`porting structure. For this purpose contacts 23 are provided
`on moveable support 20 and contacts 24 are provided on
`bases 19. The actuating assembly 10, as shown in FIG. 2,
`provides a two position motion utilizing the movement of
`moveable supports 20 on their associated bases 19 and the
`movement of the sensor 13 on supports 20. Further infor(cid:173)
`mation with respect to MEMS is available from several
`sources, in particular, the MEMS and Nanotechnology
`Exchange, 1895 Preston White Drive, Suite 100, Reston,
`Va., 20191 and the University of Wisconsin Engineering
`Department.
`Since, as shown in FIG. 2, the sensor 13 is shown 30
`mounted on the substrate 17, this particular embodiment
`could be adapted to provide autofocus, if used within a
`conventional lens system. If however the sensor 13 was
`mounted on the substrate 17 (see phantom lines 12) and
`replaced by a lens mounted on the illustrated support 35
`assembly, a zoom mechanism could be provided.
`In the alternate embodiment shown in FIG. 3, a MEMS
`support assembly is shown which may be adapted to provide
`both autofocus and zoom functions. In this embodiment, a
`lens 24 is mounted on a three position ( or smoothly variable) 40
`MEMS support assembly 25 to the substrate 26 through base
`element 27. An image sensor 28 is also mounted for inde(cid:173)
`pendent motion on a two position MEMS support 29. This
`system may be adapted to provide both an autofocus and a
`zoom capability.
`The image sensor used herein is a semiconductor C-MOS
`sensor array constructed using standard silicon processing
`techniques which are compatible with the MEMS fabrica(cid:173)
`tion process. In addition appropriate electronic or manual
`systems would be connected to initiate operation of the 50
`functions provided. Ideally the sensor array is constructed
`on a chip with imbedded control circuitry including sensors,
`memory, and other functions.
`The MEMS technique used may be surface micro(cid:173)
`machining. This method is an additive fabrication technique 55
`which involves the building of the device on top of the
`supporting substrate. The substrate would be constructed
`with the necessary imbedded control circuitry, for example
`as an application specific semi-conductor integrated circuit.
`In this way the digital image sensor and the micro- 60
`electromechanical zoom are manufactured on the same chip
`using silicon based microelectronics for the sensor and
`micromachining technology for
`the micro(cid:173)
`electromechanical support.
`In this manner a micro-miniature digital camera having a 65
`variety of basic functions can be fabricated in a cost effective
`manner for use with a mobile communication device.
`
`20
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`25
`
`45
`
`4
`
`I claim:
`1. A digital camera system comprising:
`a lens assembly mounted for receiving an image and
`projecting said image on an image plane;
`a micro-electromechanical (MEMS) system support
`mechanism for providing at least two positions of
`movement to a supported element, said MEMS support
`mechanism being fabricated integrally with said sup(cid:173)
`ported element; and
`a semi-conductor image sensor mounted at said image
`plane for movement on said MEMS system support
`mechanism and being operatively associated with said
`lens assembly to generate a digital image.
`2. A digital camera system, according to claim 1, wherein
`said MEMS system support mechanism is an electrostatic
`resonator.
`3. A digital camera system, according to claim 1, wherein
`the image sensor is fabricated on a silicon chip in which is
`imbedded control circuitry and said MEMS system support
`mechanism is integrally fabricated therewith.
`4. A digital camera system, according to claim 1, wherein
`said movement of said image sensor provides an auto focus
`function.
`5. A digital camera system, according to claim 1, wherein
`said lens assembly is mounted for movement on said MEMS
`system support mechanism for movement relative to said
`image sensor and said image sensor is fixed, said movement
`adapted to provide a zoom function.
`6. A digital camera system, according to claim 1, further
`comprising:
`a substrate for supporting said digital camera system;
`a first MEMS fabricated on said substrate and connected
`to said lens assembly for providing movement of said
`lens assembly between at least two positions;
`a second MEMS fabricated on said substrate and con(cid:173)
`nected to said image sensor for providing movement of
`said image sensor between at least two positions; and
`wherein said movement of said lens system and said
`image sensor is relative to each other to provide both an
`autofocus and zoom function.
`7. A mobile communication device including a system to
`transmit data over a communication network comprising:
`a housing containing said system to transmit data;
`a lens assembly mounted within said housing for receiv(cid:173)
`ing an image and projecting said image on an image
`plane;
`a micro-electromechanical (MEMS) system support
`mechanism for providing at least two positions of
`movement to a supported element, said MEMS system
`support mechanism being fabricated integrally with
`said supported element; said MEMS system support
`mechanism mounted within said housing; and
`a semi-conductor image sensor mounted at said image
`plane for movement on said MEMS system support
`mechanism and being operatively associated with said
`lens assembly to generate a digital image.
`8. A mobile communication device including a system to
`transmit data over a communication network, according to
`claim 7, wherein said MEMS system support mechanism is
`an electrostatic resonator.
`9. A mobile communication device including a system to
`transmit data over a communication network, according to
`claim 7, wherein the image sensor is fabricated on a silicon
`chip in which is imbedded control circuitry and said MEMS
`system support mechanism is integrally fabricated there(cid:173)
`with.
`
`
`
`Case 2:20-cv-02640-NGG-SIL Document 1-4 Filed 06/14/20 Page 9 of 9 PageID #: 26
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`US 6,914,635 B2
`
`5
`10. A mobile communication device including a system to
`transmit data over a communication network, according to
`claim 7, wherein said movement of said image sensor
`provides an auto focus function.
`11. A mobile communication device including a system to s
`transmit data over a communication network, according to
`claim 7, wherein said lens assembly is mounted for move(cid:173)
`ment on said MEMS system support mechanism for move(cid:173)
`ment relative to said image sensor and said image sensor is
`fixed, said movement adapted to provide a zoom function. 10
`12. A mobile communication device including a system to
`transmit data over a communication network, according to
`claim 7, further comprising:
`
`6
`a substrate for supporting said digital camera system;
`a first MEMS fabricated on said substrate and connected
`to said lens system for providing movement of said lens
`system between at least two positions;
`a second MEMS fabricated on said substrate and con(cid:173)
`nected to said image sensor for providing movement of
`said image sensor between at least two positions; and
`wherein said movement of said lens assembly and said
`image sensor is relative to each other to provide both an
`autofocus and zoom function.
`
`* * * * *
`
`