`
`
`
`WINSTON & STRAWN LLP
`DAVID S. BLOCH (SBN: 184530)
`dbloch@winston.com
`AMANDA L. GROVES (SBN: 187216)
`agroves@winston.com
`101 California Street
`San Francisco, CA 94111-5840
`Telephone:
`(415) 591-1000
`Facsimile:
`(415) 591-1400
`
`JAMES C. LIN (SBN: 271673)
`jalin@winston.com
`275 Middlefield Rd., Suite 205
`Menlo Park, CA 94025
`Telephone:
`(650) 858-6500
`Facsimile:
`(650) 858-6550
`
`LOWELL D. JACOBSON (Pro Hac Vice)
`ljacobson@winston.com
`35 W. Wacker Dr.
`Chicago IL 60601
`Telephone:
`(312) 558-5600
`Facsimile:
`(312) 558-5700
`
`Attorneys for Plaintiff
`INTERNATIONAL TEST SOLUTIONS, INC.
`
`
`
`UNITED STATES DISTRICT COURT
`
`
`
`NORTHERN DISTRICT OF CALIFORNIA
`
`SAN FRANCISCO DIVISION
`
`
`Case No.: 3:16-cv-00791-RS
`
`
`PLAINTIFF INTERNATIONAL TEST
`SOLUTIONS, INC.’S OPENING CLAIM
`CONSTRUCTION BRIEF
`
`
`
`Action Filed: February 17, 2016
`Before: Hon. Judge Richard Seeborg
`
`
`INTERNATIONAL TEST SOLUTIONS,
`INC.
`
`
`
`
`
`MIPOX INTERNATIONAL CORPORATION
`and MGN INTERNATIONAL, INC.
`
`
`
`
`Plaintiff,
`
`
`
`v.
`
`
`
`Defendants.
`
`
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`Case 3:16-cv-00791-RS Document 62 Filed 12/05/16 Page 2 of 30
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`TABLE OF CONTENTS
`
`Page
`
`INTRODUCTION .................................................................................................................... 1
`
`BRIEF OVERVIEW OF THE CLAIMED INVENTIONS ...................................................... 2
`
`APPLICABLE LAW ................................................................................................................ 3
`
`ASSERTED CLAIMS AND PROPOSED CONSTRUCTIONS ............................................. 4
`
`ARGUMENT ............................................................................................................................ 9
`
`A.
`
`Disputed terms from the `869 patent ............................................................................ 9
`
`1.
`
`2.
`
`3.
`
`4.
`
`5.
`
`6.
`
`Substrate .......................................................................................................... 10
`
`Micro-features ................................................................................................. 10
`A plurality of geometric microfeatures that extend above a surface of
`the cleaning layer with predetermined geometrical and dimensional
`properties......................................................................................................... 11
`
`Predetermined characteristics that clean debris from the pin contact
`elements and support hardware when the pin contact elements and
`support hardware contact the cleaning layer so that the pin contact
`elements and support hardware are cleaned during a normal operation
`of the testing machine ..................................................................................... 13
`A plurality of geometric microfeatures that extend above a surface of
`the cleaning layer with geometrical and dimensional properties so that
`a contact area and surrounding support hardware are cleaned without
`modification or damage .................................................................................. 14
`
`Having characteristics that clean debris from the pin contact elements
`and support hardware when the pin contact elements and support
`hardware contact the cleaning layer so that the pin contact elements
`and support hardware are cleaned ................................................................... 14
`
`B.
`
`Disputed terms from the `683 patent .......................................................................... 14
`
`1.
`
`2.
`
`Release liner layer ........................................................................................... 14
`
`Cleaning pad layer .......................................................................................... 15
`
`3.
`
`4.
`
`Forming a cleaning device having a working surface by forming a first
`release liner layer ........................................................................................... 16
`Forming a cleaning pad layer having a working surface on the first
`release liner layer ........................................................................................... 17
`Forming an adhesive layer on the cleaning pad layer .................................... 17
`Forming a second release liner layer on the adhesive layer wherein the
`first release liner layer is removed to create the matte finish of the
`i
`PLAINTIFF’S OPENING CLAIM CONSTRUCTION BRIEF - CASE NO.: 3:16-CV-00791-RS
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`5.
`
`6.
`
`
`
`
`I.
`
`II.
`
`III.
`
`IV.
`
`V.
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`Case 3:16-cv-00791-RS Document 62 Filed 12/05/16 Page 3 of 30
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`
`
`working surface ............................................................................................... 18
`
`7.
`
`Matte finish ..................................................................................................... 19
`
`C.
`
`Disputed terms from the `966 patent .......................................................................... 20
`
`1.
`
`2.
`
`3.
`
`4.
`
`5.
`
`Substrate .......................................................................................................... 20
`
`Microroughness which burnishes the probe elements .................................... 21
`
`Predetermined characteristics that cause the pad to clean debris from
`the probe elements when the probe elements contact the pad so that the
`probe elements are cleaned ............................................................................. 22
`
`Predetermined characteristics that cause the pad to clean debris from
`the probe elements when the probe elements contact the pad so that the
`probe elements are cleaned, without modification or damage ........................ 23
`
`A predetermined configuration appropriate for the particular probe
`elements .......................................................................................................... 24
`
`VI.
`
`CONCLUSION ....................................................................................................................... 24
`
`
`
`
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`Case 3:16-cv-00791-RS Document 62 Filed 12/05/16 Page 4 of 30
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`
`
`Cases
`
`TABLE OF AUTHORITIES
`
`
`
`Page(s)
`
`Accent Packaging, Inc. v. Leggett & Platt, Inc.,
`707 F.3d 1318 (Fed. Cir. 2013)......................................................................................................12
`
`Accumed LLC v. Stryker Corp.,
`483 F.3d. 800 (Fed. Cir. 2007).......................................................................................................16
`
`ACTV, Inc. v. Walt Disney Co.,
`346 F.3d 1082 (Fed. Cir. 2003)........................................................................................................3
`
`Cent. Admixture Pharmacy Servs., Inc. v. Advanced Cardiac Sols., P.C.,
`482 F.3d 1347 (Fed. Cir. 2007)................................................................................................11, 12
`
`CIAS, Inc. v. Alliance Gaming Corp.,
`504 F.3d 1356 (Fed. Cir. 2007)......................................................................................................10
`
`Dealertrack, Inc. v. Huber,
`674 F.3d 1315 (Fed. Cir. 2012)......................................................................................................17
`
`Fonar Corp. v. Johnson & Johnson,
`821 F.2d 627 (Fed. Cir. 1987)........................................................................................................23
`
`Harris Corp. v. Ixys Corp.,
`114 F.3d 1149 (Fed. Cir. 1997)......................................................................................................16
`
`IGT v. Bally Gaming Int’l, Inc.,
`659 F.3d 1109 (Fed. Cir. 2011)......................................................................................................13
`
`Imaginal Systematic, LLC v. Leggett & Platt, Inc.,
`805 F.3d 1102 (Fed. Cir. 2015)......................................................................................................10
`
`Interactive Gift Express, Inc. v. Compuserve Inc.,
`256 F.3d 1323 (Fed. Cir. 2001)......................................................................................................16
`
`Laitram Corp. v. NEC Corp.,
`163 F.3d 1342 (Fed. Cir. 1998)......................................................................................................16
`
`Liebel-Flarsheim Co. v. Medrad, Inc.,
`358 F.3d 898 (Fed. Cir. 2004)..................................................................................................15, 19
`
`Maxwell v. J. Baker, Inc.,
`86 F.3d 1098 (Fed. Cir. 1996)........................................................................................................21
`
`Minton v. Nat’l Ass’n of Securities Dealers, Inc.,
`336 F.3d 1373 (Fed. Cir. 2003)......................................................................................................18
`
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`Case 3:16-cv-00791-RS Document 62 Filed 12/05/16 Page 5 of 30
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`
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`Nautilus, Inc. v. Biosig Instruments, Inc.,
`134 S. Ct. 2120 (2014) ...................................................................................................................11
`
`Phillips v. AWH Corp.,
`415 F.3d 1303 (Fed. Cir. 2005)............................................................................................3, 12, 13
`
`Pitney Bowes, Inc. v. Hewlett-Packard Co.,
`182 F.3d 1298 (Fed. Cir. 1999)........................................................................................................4
`
`Rexnord Corp. v. Laitram Corp.,
`274 F.3d 1336 (Fed. Cir. 2001)........................................................................................................4
`
`Teleflex Inc. v. Ficosa N Am. Corp.,
`299 F.3d 1313 (Fed. Cir. 2002)........................................................................................................4
`
`Texas Instruments Inc. v. U.S. ITC,
`988 F.2d 1165 (Fed. Cir. 1993)......................................................................................................18
`
`Other Authorities
`
`Webster’s Collegiate Dictionary (10th ed. 2002) ................................................................................18
`
`Random House Webster’s College Dictionary (2nd ed. 1997) ............................................................22
`
`
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`Case 3:16-cv-00791-RS Document 62 Filed 12/05/16 Page 6 of 30
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`
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`I.
`
`
`INTRODUCTION
`
`This is a patent infringement case involving cleaning sheets for semiconductor test
`
`equipment. Semiconductor chips are manufactured on silicon wafers, which contain hundreds of
`
`individual integrated circuits:
`
`
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`Before the wafers are diced into individual chips, it is important to test the integrated circuits. To do
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`so, semiconductor manufacturers employ test equipment specially designed to be integrated into the
`
`microchip manufacturing assembly line. These test devices use tiny probes to ensure the operation
`
`of each individual integrated circuit:
`
`
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`With repeated use, however, the tips of these probes become blunted and corroded. To clean them,
`
`ITS conceived and developed a series of multi-layer substrates that adhere to the same base as a
`
`silicon wafer, and thus can be inserted into the semiconductor manufacturing assembly line. When
`
`test equipment probes the cleaning sheets, the probe tips are cleaned without the need to take the
`
`entire probe device offline:
`
`
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`Case 3:16-cv-00791-RS Document 62 Filed 12/05/16 Page 7 of 30
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`ITS is a pioneer in this industry and owns fundamental patents on probe card cleaning sheets.
`
`It has for the last 17 years enjoyed a dominant position in the marketplace. In late 2015, however,
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`ITS became aware of copies of ITS cleaning sheets in the Far East and the United States. When ITS
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`ascertained the source of these copycat cleaning sheets in February 2016, it sued Mipox and MGN
`
`(together, “Mipox”) for infringement of U.S. Patent Nos. 6,777,966 (the “’966 patent”), 7,202,683
`
`(the “’683 patent”) and 8,801,869 (the “’869 patent”).
`
`ITS’s patents are simple and straightforward, and very few claim terms here in fact require
`
`construction. The defendants nevertheless ask the Court to construe eighteen different claims over
`
`the three asserted patents. In their proposed constructions, they consistently fall into one of two
`
`errors: either they read limitations into the claims—limitations that are found in particular
`
`embodiments or at times are not found in the patent at all—or they assert that the term is indefinite.
`
`But claim construction begins with the words of the claim, and the specification is the single best
`
`guide to the meaning of those claims. When viewed in context, the claims are clear, and
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`Defendants’ arguments cannot be supported. In each instance, Defendants’ proposals should be
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`rejected, its expert’s unsupported opinions should be ignored, and either plain meaning or ITS’s
`
`proposed construction should be adopted.
`
`II.
`
`BRIEF OVERVIEW OF THE CLAIMED INVENTIONS
`The ’966, ’683, and ’869 patents relate to the semiconductor industry, and in particular, to
`
`methods and devices for cleaning integrated circuit (IC) testing devices. As part of the IC
`
`manufacturing process, each device undergoes electrical testing to ensure that it was manufactured
`
`properly and will perform correctly. Electrical testing is accomplished by using automatic test
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`equipment (ATE). ATE includes contact pins or probes that contact the IC devices to run pre-
`
`determined test routines on them. A major challenge encountered with testing IC devices is ensuring
`
`optimal electrical contact between the contact pin elements of the ATE and the surfaces of the IC
`
`devices. Over time, debris and other residuals accumulate on the pin contact elements,
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`contaminating the contact area. This can result in erroneous readings, thereby decreasing the
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`reliability of the tests.
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`Further, high performance demands for contactor technology associated with this testing has
`
`led to the development of uniquely shaped contact elements with predetermined and customized
`
`mechanical performance and elastic properties. These new contact elements have specialized
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`contact geometries and mechanical behavior to provide for consistent and stable electrical contact.
`
`Thus, cleaning devices need to take into account the various shapes and behaviors of the contact pin
`
`elements. The patents here claim different configurations and characteristics to clean contact
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`elements, depending on the type and shape of contact, the composition and the quantity of debris to
`
`be removed, and the affinity of the debris to the contact surface. The asserted patents solve many of
`
`the problems and obstacles faced by the industry previously, including a need to stop the machine so
`
`that debris could be removed manually.
`
`III. APPLICABLE LAW
`Claim construction seeks to ascribe the “ordinary and customary meaning” to claim terms as
`
`they would be understood to a person of ordinary skill in the art at the time of invention. Phillips v.
`
`AWH Corp., 415 F.3d 1303, 1312 (Fed. Cir. 2005) (en banc). “[T]he claims themselves provide
`
`substantial guidance as to the meaning of particular claim terms,” id. at 1314, and therefore “the
`
`context of the surrounding words of the claim also must be considered in determining the ordinary
`
`and customary meaning of those terms,” ACTV, Inc. v. Walt Disney Co., 346 F.3d 1082, 1088 (Fed.
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`Cir. 2003). But “the person of ordinary skill in the art is deemed to read the claim term not only in
`
`the context of the particular claim in which the disputed term appears, but in the context of the entire
`
`patent, including the specification.” Phillips, 415 F.3d at 1313. Indeed, the specification is “the
`
`single best guide to the meaning of a disputed term,” and “[u]sually, it is dispositive.” Id. at 1315.
`
`Thus, claims “must be read in view of the specification, of which they are a part.” Id. “[U]nless
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`compelled to do otherwise, a court will give a claim term the full range of its ordinary meaning as
`
`understood by an artisan of ordinary skill.” Rexnord Corp. v. Laitram Corp., 274 F.3d 1336, 1342
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`(Fed. Cir. 2001). Where the intrinsic record unambiguously describes the scope of the patented
`
`invention, reliance on extrinsic evidence is improper. Pitney Bowes, Inc. v. Hewlett-Packard Co.,
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`182 F.3d 1298, 1308 (Fed. Cir. 1999). There is a “‘heavy presumption’ that a claim term carries its
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`ordinary and customary meaning” “[i]n the absence of an express intent to impart a novel meaning to
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`claim terms.” Teleflex Inc. v. Ficosa N Am. Corp., 299 F.3d 1313, 1325 (Fed. Cir. 2002).
`
`IV. ASSERTED CLAIMS AND PROPOSED CONSTRUCTIONS
`
`A.
`The `869 patent: “Apparatuses, device, and methods for cleaning tester interface
`contact elements and support hardware”
`
`The disputed terms of the `869 patent appear in independent claims 1 and 4. Claim 1 reads:
`
`1. A cleaning device for cleaning pin contact elements and support hardware in a
`semiconductor testing apparatus, the cleaning device comprising:
`
`
`a cleaning layer with a configuration for the pin contact elements, the cleaning
`layer having a plurality of geometric micro-features that extend above a
`surface of the cleaning layer with predetermined geometrical and
`dimensional properties;
`
`
`a substrate having a configuration to be introduced into the testing apparatus
`during the normal testing operating of the testing apparatus, wherein the
`substrate comprises a surrogate semiconductor wafer or packaged IC device;
`
`
`the cleaning layer, secured to the substrate, having predetermined
`characteristics that clean debris from the pin contact elements and
`support hardware when the pin contact elements and support hardware
`contact the cleaning layer so that the pin contact elements and support
`hardware are cleaned during a normal operation of the testing machine.
`
`
`Claim 4 covers:
`
`4. A cleaning device for cleaning pin contact elements and support hardware in a
`semiconductor testing apparatus, the cleaning device comprising:
`
`a cleaning layer with a configuration for the pin contact elements, the cleaning
`layer having a plurality of geometric micro-features that extend above a
`surface of the cleaning layer with geometrical and dimensional properties
`so that a contact area and surrounding support hardware are cleaned
`without modification or damage and wherein the cleaning layer further
`comprises a plurality of abrasive particles having a Mohs Hardness of 7 or
`greater for cleaning contact elements and support structures of testing
`interfaces;
`
`
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`a substrate having a configuration to be introduced into the testing apparatus
`during normal testing operating of the testing apparatus, wherein the substrate
`comprises a surrogate semiconductor wafer or packaged IC device; and
`the cleaning layer, secured to the substrate, having characteristics that clean
`debris from the pin contact elements and support hardware when the pin
`contact elements and support hardware contact the cleaning layer so that
`the pin contact elements and support hardware are cleaned, without
`modification to normal operation of the testing machine.
`The boldfaced terms have been identified by one or both parties as requiring construction; a term in
`bold italics is claimed to require separate construction even within a disputed phrase.
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`The parties agree that the `869 patent phrases “wherein the substrate comprises a surrogate
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`semiconductor wafer or packaged IC device,” “a plurality of abrasive particles having a Mohs
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`Hardness of 7 or greater for cleaning contact elements and support structures of testing interfaces,”
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`and “without modification to normal operation of the testing machine” should be given their plain
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`and ordinary meanings. They disagree on the proper construction of the following 6 words and
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`Mipox construction
`a substitute
`semiconductor wafer or
`substitute packaged IC
`device
`microscopic geometric
`structures
`
`phrases in that patent:
`
`Claim term
`1. substrate
`
`2. micro-features
`
`3. a plurality of
`geometric micro-
`features that extend
`above a surface of the
`cleaning layer with
`predetermined
`geometrical and
`dimensional properties
`
`4. predetermined
`characteristics that
`clean debris from the
`pin contact elements
`and support hardware
`when the pin contact
`
`Where found ITS construction
``869 pat. cl. 1
`Plain meaning
``869 pat. cl. 4
`
``869 pat. cl. 1
``869 pat. cl. 4
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`structures or features with
`micron-scale dimensions
`and/or spacing
``869 pat. cl. 1 Plain meaning
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``869 pat. cl. 1 Plain meaning
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`Indefinite
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`or
`a plurality of
`microscopic structures
`having a preselected
`pattern to be uniformly
`and regularly spaced
`apart and not randomly
`oriented for removing
`and collecting debris
`built upon the working
`surface of the cleaning
`layer
`Indefinite
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`or
`a preselected size, shape
`and/or composition that
`has been selected based
`on a specific
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`elements and support
`hardware contact the
`cleaning layer so that
`the pin contact
`elements and support
`hardware are cleaned
`during a normal
`operation of the testing
`machine
`
`5. a plurality of
`geometric micro-
`features that extend
`above a surface of the
`cleaning layer with
`geometrical and
`dimensional properties
`so that a contact area
`and surrounding
`support hardware are
`cleaned without
`modification or
`damage
`
`6. having
`characteristics that
`clean debris from the
`pin contact elements
`and support hardware
`when the pin contact
`elements and support
`hardware contact the
`cleaning layer so that
`the pin contact
`elements and support
`hardware are cleaned
`
``869 pat. cl. 4 Plain meaning
`
``869 pat. cl. 4 Plain meaning
`
`configuration of pin
`contact elements and
`support hardware to
`clean debris from the pin
`contact elements and
`support hardware when
`the pin contact elements
`and support hardware
`contact the cleaning
`layer so that the pin
`contact elements and
`support hardware are
`cleaned during a normal
`operation of the testing
`machine
`Indefinite
`
`or
`a plurality of
`microscopic structures
`having a preselected
`pattern to be uniformly
`and regularly spaced
`apart and not randomly
`oriented built upon the
`surface of the cleaning
`layer so that a contact
`area and surrounding
`support hardware are
`cleaned by the
`microscopic structures
`without modification or
`damage to the contact
`area or surrounding
`support hardware
`Indefinite (no alternative
`construction)
`
`With the exception of micro-features, ITS proposes that all terms and phrases be given their
`
`plain and ordinary meaning. Mipox, relying on expert testimony, claims that 4 of these phrases are
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`indefinite. As discussed below, contrary testimony from Prof. Darran Cairns rebuts this proposition.
`
`The `683 patent: “Cleaning system, device and method”
`B.
`All of the disputed terms of the `683 patent appear in claim 1, which reads:
`
`1. A method for fabricating a cleaning device whose working surface is capable
`of being detected by a prober device, the method comprising:
`
`
`forming a cleaning device having a working surface by forming a first
`release liner layer, forming a cleaning pad layer having a working surface
`on the first release liner layer, forming an adhesive layer on the cleaning
`pad layer, and forming a second release liner layer on the adhesive layer
`wherein the first release liner layer is removed to create the matte finish of
`the working surface; and
`
`removing a layer from the working surface wherein the removal of the layer
`imparts a matte finish to the working surface of the cleaning device.
`Again, boldfaced terms have been identified by one or both parties as requiring construction; a term
`in bold italics is claimed to require separate construction even within a disputed phrase. The parties
`
`offer competing constructions for the following 7 claims:
`
`Claim term
`1. release liner layer
`
`Where found ITS construction
``683 pat. cl. 1 a layer that, when
`removed, exposes another
`layer or surface
`
`2. cleaning pad layer
`
`3. forming a cleaning
`device having a
`working surface by
`forming a first release
`liner layer
`4. forming a cleaning
`pad layer having a
`working surface on the
`first release liner
`layer
`
`5. forming an adhesive
`layer on the cleaning
`pad layer
`6. forming a second
`release liner layer on
`the adhesive layer
`
``683 pat. cl. 1 a layer that cleans probe or
`testing elements by contact
`with and/or penetration
`into its surface
``683 pat. cl. 1 Plain meaning
`
``683 pat. cl. 1 Plain meaning
`
``683 pat. cl. 1 Plain meaning
`
``638 pat. cl. 1 Plain meaning
`
`Mipox construction
`a release layer comprising
`polymeric film that is easily
`separable from an adjacent
`layer contacting the release
`layer
`a layer adapted to clean
`probes that come in contact
`therewith
`
`producing a cleaning device
`having a working surface by
`first producing a first release
`liner layer comprising a
`textured polymeric film
`producing a cleaning pad
`layer having a working
`surface adopting the texture
`of the first release liner layer
`comprising textured
`polymeric film
`producing a layer of
`adhesive on the cleaning
`pad layer
`Indefinite
`
`or
`producing a second release
`
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`wherein the first
`release liner layer is
`removed to create the
`matte finish of the
`working surface
`
`liner layer comprising a
`polymeric film on the
`previously produced
`adhesive layer wherein the
`first release liner layer
`comprising a textured
`polymeric film is removed
`to create the matte finish of
`the working surface
`Indefinite
`
`7. matte finish
`
``683 pat. cl. 1 Plain meaning
`
`or
`another textured
`substantially non-reflective
`and non-glossy surface.
`Other than release liner layer and cleaning pad layer, ITS proposes that all terms and
`
`phrases be given their plain and ordinary meaning. Mipox, relying on expert testimony, claims that
`
`2 of these phrases are indefinite. ITS submits contrary testimony from Prof. Darran Cairns rebutting
`
`this proposition.
`
`C.
`
`The `966 patent: “Cleaning system, device and method”
`
`The disputed terms of the `966 patent appear in claims 26 and 28. Claim 26 reads:
`
`26. A cleaning device for cleaning the probe elements in a semiconductor testing
`apparatus, the cleaning device comprising:
`
` a
`
` substrate having a configuration to be introduce into the testing apparatus
`during the normal testing operation of the testing apparatus, wherein the
`substrate comprises a semiconductor wafer having a surface; and
`
` a
`
` pad, secured to the substrate, the pad having predetermined
`characteristics that cause the pad to clean debris from the probe elements
`when the probe elements contact the pad so that the probe elements are
`cleaned without modification or damage, during the normal operation of the
`testing machine, wherein the semiconductor wafer surface has
`microroughness which burnishes the probe elements.
`Claim 28 reads:
`
`28. A cleaning device for cleaning probe elements comprising:
`
` a
`
` substrate having a predetermined configuration appropriate for the
`particular probe elements, wherein the substrate comprises a semiconductor
`wafer having a surface; and
`
` a
`
` pad, secured to the substrate, the pad having predetermined characteristics
`that cause the pad to clean debris from the probe elements when the probe
`elements are cleaned, wherein the semiconductor wafer surface has
`microroughness which burnishes the probe elements.
`
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`As before, boldfaced terms have been identified by one or both parties as requiring construction.
`
`The parties offer competing constructions for the following 6 claim terms:
`
`Claim term
`1. substrate
`
`Where found
``966 pat. cl. 26
``966 pat. cl. 28
`
`
`ITS construction
`Plain meaning
`
`2. secured to the
`substrate
`3. which burnishes the
`probe elements
`
``966 pat. cl. 26
``966 pat. cl. 28
`’966 pat. cl. 26
``966 pat. cl. 28
`
`Plain meaning
`
`Plain meaning
`
``966 pat. cl. 26 Plain meaning
`
`Mipox construction
`the substrate comprises a slice of
`semiconductor material, such as a
`crystalline silicon, used in
`electronics for the fabrication of
`integrated circuits
`attached to the substrate so it does
`not move relative to the substrate
`abrasive surface that abrades the
`probe elements by contacting the
`probe elements
`Indefinite
`
`or
`characteristics preselected
`specifically for the specific probe
`elements that cause the pad to
`clean debris from the probe
`elements when the probe elements
`touch the pad so that the probe
`elements are cleaned, without
`modification or damage
`
`Indefinite
`
`or
`characteristics preselected
`specifically for the specific probe
`elements that cause the pad to
`clean debris from the probe
`elements when the probe elements
`touch the pad so that the probe
`elements are cleaned.
`Indefinite (no alternative
`construction)
`
`4. predetermined
`characteristics that
`cause the pad to cle