`2;1
`Release
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`Contents ~CL~VfLAND PUBLiCUB
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`LIST
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`Of TABLES ..CJ£dCE&TECHNOLOGy~i:~*
`JUL28 199/Ji
`L.ISlof Tables 'm................. ............................. ....................:.............;................ ..............:r.... ......... ............1)(
`.m'W.£
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`1.iGENERAL
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`1.1'lntroduetion ...........,;...........................,....................................................................,.........................1.3
`1.2 Relationship to Other Stândal,d..SetlngSoqles..........................;..................;.........,.................1.3
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`1.aHlstory......... ...... ........ ............................................................................................,......... ...............,;;..1-'
`t.4iStandardlzatlon Goals ........ ............................................................................................ ..................A.a
`and 2.0 ............................,..........................,..............................., 1-4
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`Releasè
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`1.0
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`1.5 Differences Betweèn
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`2..SSÐPE
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`2.1 ElementsoftheSlandard:Physlcal,lnterfce, Software...............................................................2.3
`2.2;Card'Physlcal ........................................................................................................;.........................:..2"3
`2.3 Card' Inteiface .....................;....;..;......;.;...............;..;..........................................;.................................2.3
`2.4 Card Software ......................................................;............................:.;.............,..................;..............2-3
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`3.~ CARDPI-VSlCAL
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`Card Dimensions................................................;.....................................;.........................................3.3
`3.1.1 Write Protec Switch (WPS).......................................................................................................................... 3.3
`3:1.2Batler locon ......... .... .......;.,;...... ~..... ,.....,. .,......... ...., ........ ........ .... .,....... .......... ..'.. 'c.. ....... .,......... ........... ".~3,3
`3.1.3 Label.............. ................;..............,.............;......;.................,.....,.......................:......................................,,..,3.4
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`Cónneetor ...............................................................,..........................................................;,;................3-4
`3:.2.1 . Card Conneor .............................................................................................................................................3-4
`3.2,2 Host Connector..... ......................................... ....... ...... ............. .................................... .......... ........................ 3-4
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`3.3 PC Card Guidance .........;................................. .................................................. ....... ..........................3.5
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`3.4 Connector Reliabilty ....................................................................................;;...................................3-
`3.4.1 Mechanica Performance .....~..............,....................;......;.........................................................................;,...3-6
`3.4.1.1 Offce EnvirOhmenL;.........................;.....;......................,.........,..........................................................3.6
`........................ ..................................3-6
`3.4.1.2 Harsh Environmenl...................................................................
`3.4.1.3 Toiailnserjon Force..............................................................;....,~.................;.....,............;................. 3.6
`3.'.104 Tolal Pullng Force......................................................................................................;.......................3-6
`3.4.1 .5 Single Pin PullhgForce ....... .................. ..... ...... ...................................... .. ....... ...... ...... ............. ......... 3c6
`3.4.1.6 Single Pin HoldingForw,...................................................................................................................3-
`3.4.1.7 Single SoetHoIdingFoft:....." ....... ....... ..... ........ .... ...... ......... .... ............... ........;. ...... :..................... 3-7
`.......................,.,.................3.7
`Frequency.....;...........................................................
`3.4. 1.BVibration and High
`3.4.1.9 Srioc..............................................................................................................................c................... 3-7
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`July,t99:'.
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`SANDISK Exhibit 1009, Page 1 of 550
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`,......:~tifdbIA ReGAD STANDARÒ
`ReIease2.1 ........ '.' .... .... ." '.i.ii. ..hi; .......... .... ..... ............ .'. ..... . . . ./. ".
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`3.4.~.3Insulatìon Resistan........................................... .......................,.,....................... ..............................3.8
`3.4,ZACurrent Gapacì..........................................................................................................:........c..............3-8
`3.4.2.51nsulajion Material ..................................................................................................c............................ 3-8
`3.4.3 Envirçnmen1a ?erormanee..........................................,...c............................................................................. 3-8
`3.4.3.1 Operating ËnvironfYt......................................................;......;.;.~..............................................."c.. 3-S
`Envonment ............. ......................... ........ ....... ................... .......... ....... ". ........;... .....';...........3-8.
`3. 4.3.2
`$torage
`3.4.4 Environmental Re$$taiCf ....................;........................................................ ...........;;...........;....."................ 3c8
`3.4.4.1 Moiture Resistance ..................................................................................................".... ..................3-8
`3.4.4.2 Theral Shoc.....................................;........;..............;.........................................~......;....................... S.s
`3.4.43 Durabilit (High Tempeatue) ..... .......;..........;..........................................:.,.......................................3-8
`3.4.4.4 Cold Resistánce.......;..,........................;.;....;......................................;.......:.................................."....3.9
`3.4.4.5 Humidity (Noral Conctition)..........................................................................................................;..c. 3.9
`3.4.4.6 Hydrogen Sulfide ...........................................................".,.....;..............................................~............. 3.9
`3.4,4.7 Sall Water Spray............."............................................;...;......................................;;..~,....................., 3-9
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`3.5:Connecor DurablUty ...............;..;................. .......................;;.........................,..................................3~9
`3.5.1 Ofice Environment .................................................;....................................................................................,..3-9
`3.5,2 Ha.'S Envifonment.................;....................................................................................................................3.10
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`3.5 PC Card Eniiironmentai.............................;...............................................;,.....................................3-10
`3.6.1 Enllormental Perlprmar..........,..................................;........".....;...........................................................3-10
`3.6.1.1 Operating Envirçnment...................................,................................................................................ 3.10
`3.6.1..2 Stórage EnvlronmenL......... ....................;................ ........... ...... ....................................................... 3.1 0
`.t62Ellvironmenlal ResiSlance...;......................................................;....,.,;...........................................;............3.11
`3;6.2.1 High Storage Temperatwe......................,.....................................,...................;...;...;.....,................3.11
`3.6.2.2lów SlorageTemperalùre ........................................... ....... ...............,;.c.~.................. .................... "..3- t 1
`3.K;2.3 High Oprating Temperature.;............................................;....;,.......,.......,.........;...................;......;....3-11
`low Operaling Temperalure............................................,............................................................,...3.11
`3.6.2.4
`3.6.2.5 Thermal Shock.....,...................................................,..;......,;....L....;.,...................................L.:.;....... 3-11
`3.6.2.6 Moisture Resstce...........,.....................,........................;...........................,..........;.....;................. 3.12-
`3.6;2.7 Elecrostatic DiSchatge .....................c.;..................................... .......................,.................................3.12
`3.6.2.8 X-ray Exposure ................. ................... ................ ............................,.......... ..................................... .3-12
`3.6.2.9 Ultraviolet Ught ExpO$ure:..;.;..............................................,..;.....~....;.,................................;...;.;,;..,3.12
`Field.lntetference...'..... ... ..... ............ ...;......;. ......... ............ ........... .... ..., ..;... .....;. .;..3.12
`3.6.2. to Electromagnetic
`3.6.2.11 Card Inverse iriirton;........c....................................................................................,......................3.12
`Frequency ................;................................................................;......................3.13
`3.6.2.12 Vibralìonand High
`3Æ.2.13 Shock...........................................................,...................................................................................3c:13
`3.6.2.14 Bend Test .............................................................................................................;..;...................,.~3-13
`3.6.2.15 Drop Test........................_..............................................................................................................3.13
`3.6.2.16 Torque Test ...........................................................................................,....,.......................;......,...... 3-13
`3.6.2.17 PC Card Warpage .....................................,.........................................................,................;......... 3-13
`3.6:2.18 SAAM Data Retention .............."..........................................................".......................................3-14
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`4..
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`CARD
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`INTERFACE
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`4.'1 'PIn Assfgnments................................................................................................................................4.2
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`4.2 Me-mory Ci:rd Features .....,...........,..~.........................i.......................................:............;.,...............4.-4
`42.1 Memory Types and Speed Version ......................................................... .......................,............__..............., 4-4
`4.2.2 M13mpr Address Space .........................;............"................,.......................................,...............................4-4
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`. 4.2;3/veirClry drily interface ...............................................,,,...,............,,,,........,..............................,..._.......,,,...:.:.4~5
`4,2.4 1/0 Address Space. ................ ........................ .......... ....,.... ............... .......,............... ..... ........................ ...... ...... 4.5
`4.2~5IJO Interace............ .............................................................. ...:............,..,..................;................................ 4-5'
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`July.~f993
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`..... PCMtiA@1g92','19$3'
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`SANDISK Exhibit 1009, Page 2 of 550
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`4.2.6 Custom lnteriaces................................,.................................,........,.............. .......".............. .............4-6
`4.2.7 Corfigurable Cards.....,..,.................................,.,........................;.........................................'......................,.. 4-6
`4.2,8 COlpatibilty Between Revision Levels 01 this Slandard,...........................,.......,............."........................... 4-6
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`PCMCIAPC CARD STANDARD
`2.1
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`Release
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`4.3SlgnaIOesc;rlptlon ...... ............................. ........................................................ .....;.. ......;........ ...........4-7
`4.3.1 Address BUS (AD-A25j,..............,.................,.....,......,..,.........,.........,......'.........................."...,....,...........,..., 4c7
`4.3.2 Data BUS (00:015).........,...................................,...........................:....................................................,..,.....4-8
`'L3.3 Card Enable (cCE1 & .CE2),..."..,......_,..,...................,...,...,.:...,;..............,....................."........;",.."...;".....,..4-8
`4-:3.4 Output Enable (-OE) .,...........,...,..........,.................................,.......,.;..................................,..,.............;....;.....4'8
`4.3.5 Wrile Enable!Program(-WEI-PGM).,.......................,.,....,....................."....... ..........................,..................,.:4-8
`(+RDY/-BSY) ..,...,............:.......;..;.........................................................."..................................4-8
`4.3.6 Ready/Busy
`4.37 Card Delee (.001 & -C02) ..........................................................;......".".;,.;.~...,.............."..............,......... 4-.10
`4.3.8 Write Protect (+WP).,..............................;.............................,....;;..;..."....:.....................................,.......;.....4-10
`"...............,......".....................................................................................,.4-10
`4.3.9 Attribute Memoiy Select (-REG) .
`4.3.10 Battery VoitageOeiec (BVD1 & 8VD2) ;,;............................................................"...ó...............................4.10
`4.3.11 Program and Periptieral VOltage(Vppl&Vpp2) .....................;..........,....;...;....,..........................,........... 4-11
`& GNDl..............................,.............,............................................~....,...;.4~11
`4.3.12 Card VOltage and Ground (Vee
`4.3.13 Ref,ésh (RFSH).................................................;.......................................................................................4-11
`4.3.14 Reserved Pins (RFU)....................,....:.............,..........................................,...................................,...........4.-11
`4.4 Release 2 Signals Affectingß()lh(\èmoryOnly and I¡Olnterfaces....;;;..,..,.;.............................4.11
`En .......,............;.............................,..............,......,;..,...........;........"..............................,.4'11
`.......;....,....;........................................................;..4.12
`(-WAIT).......,.......,...........................;...
`4.51fOlnterface Signals Replacing RFUs;lns...............................................................,.........,......~.....4.1?
`4.5.1 líO Read HORDJ;........,..~,...."..............".,..................................................................;.........,.:....~.....;....;.....4;12
`4.5.2110 W,íie HOWR) ................................,................................................................................,..........,............4-12
`4.5.3 lnput Acknowledge i-INPACK) WO Operation) ......"......................................,......................,...................... 4-12
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`4.4.2 Extend Bus Cycle
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`4.4.1 Card Reset (RES
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`4.6 ItO Interface Signals Replacing MetnorylntêrfaceSignal$.....~...;.¡u............................................4-13
`4;6.1 lIO IS 16 BitPort(-IQlS1ôlJreplacesWPJ.,..........................................................................,...........;....;....;4c13
`-4_6.2 in~erfUpt Request (-IREQ) (replaces +RDYJ-BSYJ ........................................,..,.......................;......:...:.......4-13
`4.6.2.1 Interrupt Request Routing .........................'.....................................................,............................;...4-13
`46.2.2 Pulsed' . andLeVel~¥()EttnlerruptSuppo.. ......... ......... ............................... ............................ ."":.. 4.13
`4.6.2.3 Pu!sedcModelnterrupt SignaL...... .... ............................................................. ."..... ..... ........... .0... ,.......4-14
`4.6.2.4 Level.Modelnterrupt Signaf......................................"......................,...............................;...".....,:..4-14
`4.6.2.5 Interrupts and +RDY/-BSY ..................,............,.....;............,..............,............;..;..,....;..,;;..,..........".4.14
`463 AudioDigital Waveform (-SPKeHrepl~cTs~VD21.,...".. ......c.........................,.................,....,............ 4.14
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`4_8.2 C-ommon Memory
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`4.6.4 Status Changed
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`(-STSCHG) freplacèsBVDtl....... ........ ...~..... .,.........., ...., ................. ........ ........... .............. 4.14
`4.70peraUng Condilions.......................................................................................................................4-15
`4.7.1 Oeault Conditions and Card Identication ................................................................................................. 4-15
`4.8 Memory Function ...................................................................".....................................;....;........,..;..4-15
`4.a.1Common Memory Function ...........................................................,......................................,...................;..4-15
`Head Futictìon.......,..............................................................,.......,.................................4-15
`and Single.Supply Fiash Cards. ..........................4.16
`4.8.3 Common Memory Write Functiör for SRAM. EEPROM
`4.B.4 Common Memory Write Functioo lor OTPROM. EPROM and Flash-Memory ......................................,..... 4.16
`4.8.5 Attribute Memory Functiol1........................,............,.....................................................................................4-16
`4.8.6 Attribute Memory Read Function ............................................................................................................,....4-17
`4.8.7 Attribute Memory Write Function lor SRAM, EEPAOMandSingJe.Suppfy Flash Cards.. ...................... ...,4-17
`4.8.8 Atribute Memory Write Fuoction for DualSuppìy OTPROM, EPROM and Flash Cards ......................;..... 4-17
`4.8.S Write Protect Function ...................,............................................................................................................. 4.18
`4.9 Tlmlng Functions ................................................................,...................;........................................4-19
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`PCMCIA@1992, 1993
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`July,
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`19$3
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`SANDISK Exhibit 1009, Page 3 of 550
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`4.9.5Attribfiinhémory Read Timing SMfigaflan......m
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`4.9.8 Aflrib'fité'Memory wrné"1_1ming'spwhcahm'..
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`4.10Electrical
`4.1111 smug:
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`4.1024 Cam Gonfigmatimflagisim Address
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`4.10.3 #0 AddrésLsi'SfiéfifDe'éQd'mg
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`- 74.153" Pin "Replacemem negistéqjdrganizatmn _
`4.15.4 Socks! and Copy-3991.513?
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`SANDISK Exhibit 1009, Page 4 of 550
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`SANDISK Exhibit 1009, Page 4 of 550
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`SANDISK Exhibit 1009, Page 5 of 550
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`SANDISK Exhibit 1009, Page 5 of 550
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`6.5.4 lOCTL Reati (Get CurrenlXIP API Eniry Point)
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`SANDISK Exhibit 1009, Page 6 of 550
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`SANDISK Exhibit 1009, Page 7 of 550
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`SANDISK Exhibit 1009, Page 8 of 550
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`SANDISK Exhibit 1009, Page 8 of 550
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`List (lfrTaibles
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`List of Tables
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`SCOPE
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`Table 3-1 :PC. Card Dimensions.. ... .............'?...... ...... 'd' ...........d............... ......d....,......,............. .....,,,..................3-3
`Cönnector Pin COnfiLlration.............,...,.....,.......................,...,...,........."...-...,........................,..,..3.4
`Table 3.2: Host
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`CAflDI.NTERFACI;........................... ... ........i........................ ............ ....i.......... .......i./............................. .'i
`Table 4-1: PCMCIA BS99l4i?ín1. T0f4n34~ìgninents.....7.'.................~.'.....2.'.'............,...........................-+2
`Pin 35 To PÍI1ô8Assignments......................:.....................................d.........~...A.3
`PC
`cad
`Table4.2: PCMClA
`Tabie. 4-3: Features of PCMCIA Memry Card ..... ..............'d.....:..........................,............. ..............................4.4
`Types and SpeedVersion......,...........d.............................,......................................'7........~-4 .
`Table 4-4: Memory
`Table 4.5: PC Card logic Levels .......................~................,..;..................................................'7...,.................4.7
`Table 4-6: Common MemorRaad. Function.tofa.UtyPesof Mem()I).:................. ...............,......??7...........,4--ie
`Table 4-7: Common MemoryWritaFuncion for SRA;EEPROMandSing!e.SuppI0f=lj"~hßli(lS..............4d16
`TableA-8:Atribute Memory Read Function..,.......:........ ..:.........."......... .,.............. .........,.,.., .......... .:..,.".......4-11
`Table.4-9: Attribute Memory Function.for$ìngleSuppIYS~~1'c:...EEPROM .... ,.. ...........,.......::..:......,.:........4.17..
`4.1 0: Wrie Protect Functíol'..................................................~...........................................,..-...........,....4.18
`Table
`Table 4-11: Common MenoryRead Timing Speíçationfor all ty~ottyamory ............... ..................... ...,.., .A-19
`Table 4.12: ('.ommon Memory WfiteTjini9~~.~Çjr¡çatjon SflAM~........... ......... .......... .... ................d..d....d.....(.4c-29
`Table 4.13: Attribute MemOry.Rea~Jimi(lgSP~klsuty of MemQI.. ,........... ...,......,.................4.21
`Table 4-14: Electrical Interfce....,............ ;.:..:.........d.................."................. ...................... .............................4.25
`Table 4.15: Battery Voltage' Detec ...... .............. ......................d.:............. .... "" ................ .................. ...............4-28
`up/Power-down Timing...................................?".............................................................o...4..?S
`Table 4-16: Power.
`Input Functn for..¡/pÇias..............,..~....7.."........................................,..............,...............4.31
`Table4-17: i/O
`Table 4-18: I/O Output Fun~iljftorl/QÇÇlrds.............,....,..d........,......,................................................."......A-31
`Table 4.19: i/O Read (Input)Timing~fJcífjcalíon1Q(f\I5VJloCards.......................................... ...,........"A-32
`T3bla4-20: VOWrite(Ouiput) Timing spejfcati?RfQrAllsVVR~rcls..d......;...................................;..........Ad3~
`Spaces ..........,...............................~.~.........,....................................................,......A-34
`Table
`4-21 : Card Memory
`Table 4-22: Card Configuration Regist6rs.............................,............................... ...........d...,'.............d.,....7......~-:J4
`Table 4.24: Card Configurcnion and Staus.. R~gisterorgan~atrp...................... .." ... ......,..,........ ~'. ........:.......4-35
`T able 4-23: Configura1ionOptionHegister. .......... ............... ......; ...... ...... .... .......... ....... ...,........,...,.. .., ................4-35
`Table 4-25: Pin Replacemènt Register Organizlllion..,........:..............................,..................................,..........4.36
`Table 4-26: Socket and Coy Register OrganizàtÎOjt...~.......;,....;.:..................................................................4-36
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`CARD.METAfORMAT
`Forat .. .................................,................................................. .............................................:....5.5
`Table 5-1: Tuple
`Table .5-2: Tupleçodes. .........................;...................................,.................. ...... ........................'.-.:..........._..,...5.7
`Table 5-3: The Null Control Tuple .........,..ò........................................................................................................5.9
`5-4: Long 1.io\o Tuple .......,..,.......,..,...,.;...............................,......................~................:,........;."..,..........:....;..5.9
`Table
`5-5: Link Targel Tuple ..................;;.................................................;;......ò...............................................5.1 0
`Table
`Table 5--: No.Unk Tuple...................................................;.......................;......................................................5-10
`Table .5-7: The End-of.Uôt.9RlltretTuple.... ...... .........:.......y............... ... ..._..............,.,.:._........:...:.....~...:............:...5-1()
`Table 5-8: Checksum Tuple ................................................;.......................................:..............:....:..............:5-11
`TableS,S: AlternateLanguageString. Tupla . ..... ..... ....... ..:........ ....... ....."... ........ .,........,., ...... '.....' ....~... . ..... ...:.~.... S..l?
`Table S-10: Device Information Tuples ...... ............. ................. ............, ~.. ..... ....................... ..... .....:...... ....... ...5.13
`5-11: Device ID......................................................................................................................................5-14
`Table
`Table 5-12: Dé..ice Speed Codes .......................,..................,..i...................................;............................;....5~14
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`JUlY..leea,.
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`SANDISK Exhibit 1009, Page 9 of 550
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`. I.PanamaIPG-cAfiBSTANDAHD-a I
`' _:--'i "'Rélease 2.1-
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`Tablé 5-135Efierided D'ew'ce..-S'pe‘ed codes
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`’ Tabla 5.3.14.
`. vice Type Codes..."
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`Table'.5-1-5:;D§Vice Sig}; _By1_é_-.;;-.L...-
`Tabiej 516: Level 1 Vefs'idh {Piecing nférmal
`Tamas-17:.The dense-Manning;
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`.' Tahiti 5-1.8;01h‘er Conditions Dé‘vi‘ce Infants-nation Tuple
`.:.I'."_.'.‘I'.able 5.1"_9':i';01h:er Condi‘lip‘n§3_'loforrnafidh Field
`Tables-1932: PC Card Eufiaions;,..;~...-..;li
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`' Table-5-.1.9b-: System Inffigfizatfon'flfie .............
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`.Table':5._-.1.9c: TPLFEATYPE: Evan'san Tupie Typefiode;
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`59¢!le 10.19496: Fans??? Wensimrupmu
`.. -- Table"
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`" "173.1319
`___19__ TPLFE_UA' UARirldengfficath Haida“;
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`-_Tabia'5_'§19_1:' TPL‘FE_UC: UAR? capabffifieé Herd
`Tabla .5_+_:199: Modgm interface Furidion Extqnfiiap Tuple -
`Ta'bjfi 5.3911: TPLFEfC: Flaw-Contra! Megiadé-‘ii -'
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`ens'v‘ch'fupa-
`. Table 5:19l: Diana Functqan
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`Tabla 5~1_9m: ragga-us: Dam m‘radacejfierd .
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`_.T'ab1e'5-1-9n:;-TELFE_MS: madman: Standards Held?........
`3Tabie 5-190:'-‘_-TP&FE_EM: Error Corracn'onfpgtgction Framers and 'on
`Tamas-49p: TPLFE_DC;' Dela Comb'rérssk‘dniPmrbch'SL"
`Table 5_:'1'-9q:;--.TPLFE_ M‘- Cammand-Pmtocois......,...
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`_ Table] 53-:119rz' TPLFEgEX: Escape Mechénisms Hard”
`'._ :-_;T_abiia 5495': IPLEELDY‘ Standardféad Data'xEnqr'prtiqn
`'. “Table 5-191: ‘TPLFELEF: .Mfs'cétfanaous-Edgflse'r Eeam__ _
`Table 5:131;;_TPLFE_CD ccm' Country
`Tame 5;)Big'i-.-TPCID_FE_DacUmem Faqfiimife-E
`T'ab‘lg'fidsw: TPLFgmrs Extendeqfacsfmae
`'1."_"Tahie*5-19x: TPLFE-‘UF‘ UAHTmterfa'ce Fiej'd
`" . Tania 5495:: TPLEE‘FM CCITT-ModuJafioQSISn a 0‘5 ..
`Table_5.-_19z:' TPLFE_FY Standarflked Data'fincnrpfion..-“
`Tame 5-1932}. ."TPLFE_FS chumamfacfimfle Fearq’r'gzsgmb
`Tame..5_-,1gab; ‘FPLFEflCF CCiTT Swath/Cindi:
`_._Tabie 5-129é¢i'-._voice'Funcfion‘fifiensian' TUp!e...-.........
`_ 1 Table 5493a; TPLFE_ TYPE Type orchTPgFI-JNCE
`' Table -5_—1"Qaé: TPLFEiW‘ UAFI'T mrerraae Heid-
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`Tahlé'Sé-waf: .TPLFEfiR: swingefia'te Herd...
`__ Tablé.5-19ag_:_ 7FLFE_SSE SampleiSke_Fie{d...L.
`"_"T-__able 5-193hj-"TRLFE45G' Vfiiq'e_.;Comprsss'ioh
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`-"Table 5-203C0hfi98ration Tuplei
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`Table _5.-_2-1:'$ize of Fields Byte .....
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`Table 5—22: Card Con