(12) United States Patent
`Yagi et al.
`
`US006942817B2
`US 6,942,817 B2
`Sep. 13, 2005
`
`(10) Patent No.:
`(45) Date of Patent:
`
`(54) METHOD OF MANUFACTURING WIRELESS
`SUSPENSION BLANK
`
`(75) Inventors: Hiroshi Yagi, Tokyo (JP); Shigeki
`Kawano, Tokyo (JP); Kazuo Umeda,
`Tokyo (JP); Jiro Takei, Tokyo (JP);
`Yukio Iimura, Tokyo (JP); Satoshi
`Sasaki, Tokyo (JP); Katsuya Sakayori,
`Tokyo (JP), Hiroko Amasaki, Tokyo
`(JP)
`(73) Assignee: Dainippon Printing Co., Ltd., Tokyo
`(JP)
`Subject to any disclaimer, the term of this
`patent is extended or adjusted under 35
`U.S.C. 154(b) by 0 days.
`
`(*) Notice:
`
`(21) Appl. No.: 09/813,759
`(22) Filed:
`Mar. 21, 2001
`(65)
`Prior Publication Data
`US 2002/0027127 A1 Mar. 7, 2002
`Foreign Application Priority Data
`(30)
`(JP) “…. 2000–08:5045
`Mar. 24, 2000
`Jul. 7, 2000 (JP) ....................................... 2000–206195
`Jul. 7, 2000 (JP) ....................................... 2000–206196
`(51) Int. Cl." ........................... B44C 1/22; CO3C 15/00;
`CO3C 25/68; C23H 1/00; G11B 21/16
`(52) U.S. Cl. ....................... 216/57; 216/13; 118/723 E;
`438/108; 360/244.3; 360/245.9; 360/245.4;
`360/294.7
`(58) Field of Search ................. 216/57, 13; 118/723 E;
`438/108; 360/244.3, 245.9, 245.4, 294.7
`
`(56)
`
`References Cited
`U.S. PATENT DOCUMENTS
`
`5,839,193 A * 11/1998 Bennin et al. ............. 29/895.9
`5,970,319 A * 10/1999 Banks et al. ................ 438/108
`6,093,476 A * 7/2000 Horiuchi et al. ............ 428/209
`
`FOREIGN PATENT DOCUMENTS
`
`JP
`
`2000–49195
`
`2/2000
`
`* cited by examiner
`
`Primary Examiner—Rudy Zervigon
`(74) Attorney, Agent, or Firm—Flynn, Thiel, Boutell &
`Tanis, P.C.
`(57)
`
`ABSTRACT
`
`A wireless suspension blank is made using a two-layer
`laminate composed of a metallic layer with the spring
`property and an electrically insulating layer. The first
`method includes a first step for working the metallic layer by
`the photo etching method, a second step for forming a wiring
`part on the insulating layer by the semi-additive method and
`a third step for working the insulating layer by the wet
`etching method. The second method includes a first step for
`working the metallic layer by the photo etching method, a
`second step for forming a wiring part on the insulating layer
`by the semi-additive method and a third step for working the
`insulating layer by the plasma etching method. The third
`method includes a first step for forming a wiring part on the
`metallic layer by the semi-additive method, a second step for
`working the metallic layer by the wet-etching method and a
`third step for working the insulating layer by the dry-etching
`method or the wet-etching method. The use of a two-layer
`laminate makes possible a low cost production. Further, the
`forming of a wiring part by the semi-additive method makes
`possible to working very accurately a fine wiring part.
`
`5,628,869 A * 5/1997 Mallon ................... 118/723 E
`
`17 Claims, 9 Drawing Sheets
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`
`
`{ b )
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`(c)
`
`• SSSI.
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`HUTCHINSON EXHIBIT 1009
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`U.S. Patent
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`Sep. 13, 2005
`Sheet 1 of 9
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`~26 22
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`2 =tº
`sº
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`AAE /06 A 6'7
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`F|G. 2
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`U.S. Patent
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`Sep. 13, 2005
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`Sheet 2 of 9
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`US 6,942,817 B2
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`FIG. 3
`
`(S1)
`
`STEP FOR PROCESSING
`METALLIC LAYER
`
`(S2)
`
`STEP FOR FORMING
`WIRING PART
`
`(S3)
`
`STEP FOR PROCESSING
`INSULATING LAYER
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`U.S. Patent
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`Sep. 13, 2005
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`Sheet 3 of 9
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`F|G. 4
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`(a )
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`3
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`2
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`ZZZZZZZZZZZZZZZZO
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`o, N-3 Z-2
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`NS NNNNN
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`NNNN
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`zº a
`(d) N-3
`Z Z Z-2
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`U.S. Patent
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`Sep. 13, 2005
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`Sheet 4 of 9
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`F|G. 5
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`Soºn NäNæ
`NNN
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`(a )
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`8
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`(b)
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`3
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`U.S. Patent
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`Sep. 13, 2005
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`U.S. Patent
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`Sep. 13, 2005
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`Sheet 6 of 9
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`US 6,942,817 B2
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`F|G, 8
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`(sl) | SºFMING
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`_WIRING PART -
`
`(S2)
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`STEP FOR PROCESSING
`_METALLIC LAYER
`
`(S3) | STER FOR PROCESSING
`INSULATING LAYER
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`U.S. Patent
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`Sep. 13, 2005
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`(a) [ZZZZZZZZZZZZ-12
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`NYNNNNNNNNNNS-13
`(c) DZZZZZZZZZZZz iz
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`ºzziºzzºl-14
`(d) NNNNNNS-13
`ZZZZZZZZZZZZ-12
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`(e)
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`16
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`2– 14
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`12
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`Sheet 8 of 9
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`( b ) NSSSSSSSS-N-3
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`U.S. Patent
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`Sep. 13, 2005
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`Sheet 9 of 9
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`fºrzil Z.
`(a) Rººsékº is
`WZZZZZZZ 12
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`

`

`1
`METHOD OF MANUFACTURING WIRELESS
`SUSPENSION BLANK
`
`The present invention relates to a method of manufac
`turing a wireless suspension blank used in a hard disc drive
`(hereafter called “HDD”) as a data storage device and the
`like.
`
`BACKGROUND OF THE INVENTION
`Prior art concerning such a method of manufacturing the
`above-mentioned member for electric parts is mentioned in
`Japanese Patent Laid-open 2000-49195 (Title of Invention:
`“Process for making a member for electric parts”), in which
`a method of manufacturing a wireless suspension blank used
`for HDD is not concretely explained on a method of manu
`facturing a wireless suspension blank. However, a method of
`manufacturing a member for electric parts is disclosed as
`follows.
`In the method, a three-layered laminate composed of a
`polyimide resin film and metallic foils laminated on both
`sides of the polyimide resin film is used as a laminate. In the
`process, resist patterns are formed on the metallic foils
`laminated on both sides of the polyimide, respectively, and
`the two metallic foils are treated at the same time by etching
`solution. Thereafter, resist patterns are removed from the
`two metallic foils, and then plasma etching of the polyimide
`resin film is made through one metallic foil etched as a mask
`to form the polyimide resin film into a pattern. Thereafter,
`the metallic foil used as a mask is removed from the
`polyimide resin film. As a result, a member for an electronic
`part can be obtained which is composed of a laminate of the
`polyimide resin film formed into a pattern and the metallic
`foil formed into a pattern. This effect is that the low-cost
`production is possible since reproduction occurs only once
`and high quality product can be obtained in which a pattern
`of polyimide resin film is laminated on a pattern of metallic
`foil with a high positioning accuracy.
`However, the above-mentioned process has a first prob
`lem in that the three-layered laminate used is high-priced.
`Further, the above-mentioned process has a second prob
`lem in that working of metallic foil is difficult where finer
`working accuracy is required, since wet etching is made to
`the metallic foils laminated on both sides of polyimide resin
`film of three-layered laminates.
`Further, the above-mentioned process has another prob
`lem in that flying leads used in checking the action of a
`magnetic head cannot be formed in a state wherein both
`sides thereof are exposed to the air.
`Further, working of polyimide resin film of the insulating
`layer is carried out by the dry etching method such as the
`plasma etching method. However, dry etching has the fol
`lowing basic problem.
`FIG. 1 is a schematic illustration of a plasma etching
`system used for dry etching. The conventional plasma
`etching system has a flat-plate type of cathode electrode 23,
`in which cooling pipe 22 is passed. The cathode electrode is
`secured to a vacuum chamber 21 through RF electrode
`material 24, and the cathode electrode 23 is connected with
`power supply 27 through RF introducing pipe 25 and
`blocking condenser 26. Further, a flat-plate type of anode
`electrode 28 is arranged parallel with the cathode electrode
`23 above the cathode electrode, in which working gas is
`introduced from the whole surface of the anode electrode 28
`and through a gas introducing pipe 29. Further, anode
`electrode 28 and vacuum chamber 21 are grounded electri
`cally.
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`In the above-mentioned conventional plasma etching
`system, dry etching is carried out at a state that a laminate
`is put on the flat-plate type of cathode electrode 23. In case
`of polyimide resin film being dry-etched, usually, working
`of polyimide resin film at high temperature enables higher
`working speed and high throughput. Therefore, working of
`polyimide resin film is carried out generally at a temperature
`in the region of glass transition temperature (Tg) of poly
`imide resin. However, the laminate of the wireless suspen
`sion blank has different metallic materials on both sides.
`Therefore, if working temperature is in the region of Tg of
`polyimide resin, curving of the laminate is caused by the
`very small difference between thermal expansion coeffi
`cients of metals so that working efficiency is lowered by
`local thermal distribution caused by curving of the laminate.
`Namely, there is a problem that as shown in FIG. 2, a center
`of the laminate S goes up, in such an extent that the laminate
`S does not come into contact with cathode electrode 23, and
`therefore high throughput working becomes impossible.
`DISCLOSURE OF INVENTION
`The present invention was made considering the above
`mentioned technical problems. An object of the present
`invention is to provide a method of manufacturing a wireless
`suspension blank in which a highly accurate method is
`possible.
`In order to achieve this object, a first method of the
`present invention is a method of manufacturing a wireless
`suspension blank using a two-layered laminate composed of
`a metallic layer with a spring property and an electrically
`insulating layer, wherein the method comprises a first step
`for making the metallic layer by the photo etching method,
`a second step for making a wiring part on the insulating layer
`by the semi-additive method, and, a third step for working
`an insulating layer by the wet etching method.
`In the first method of the present invention, it is desirable
`to use polyimide resin as the insulating layer.
`Further, in the third step of the first method of the present
`invention, wet etching of the insulating layer may be made
`from any of the metallic layer side and the wiring part side,
`or from both sides thereof.
`Further, in order to achieve the same object, a second
`method of the present invention involves a method of
`manufacturing a wireless suspension blank using a two
`layered laminate composed of a metallic layer with the
`spring property and an electrically insulating layer, wherein
`the method comprises a first step for working the metallic
`layer by the photo etching method, a second step for forming
`a wiring part by the semi-additive method; and, a third step
`for working the insulating layer by the plasma etching
`method.
`In the second method of the present invention it is also
`desirable to use polyimide resin as the insulating layer.
`Further, in the method of the present invention, when
`plasma-etching the insulating layer, it is desirable to plasma
`etch the insulating layer using an electrode having a shape
`with curvature.
`Further, in order to achieve the same object, a third
`method of the present invention involves a method of
`manufacturing a wireless suspension blank using a two
`layered laminate composed of a metallic layer with the
`spring property and an electrically insulating layer, wherein
`the method comprises a first step for forming a wiring part
`by the semi-additive method, a second step for working the
`metallic layer which is processed by the wet etching method,
`and a third sep for working the insulating layer either by the
`dry etching method or the wet etching method.
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`3
`In the third method of the present invention, it is also
`desirable to use polyimide resin as the insulating layer.
`Further, in the third method of the present invention, it is
`desirable to form a flying lead in the third step.
`BRIEF DESCRIPTION OF THE DRAWINGS
`FIG. 1 is a schematic illustration of a plasma etching
`system.
`FIG. 2 is an explanatory drawing showing a state where
`a laminate is curved in the case of the plasma etching system
`shown in FIG. 1 being used.
`FIG. 3 is a flow diagram showing a basic procedure in a
`method of manufacturing a wireless suspension blank for
`HDD, for explaining the first and second methods of the
`present invention.
`FIGS. 4 and 5 are method drawings showing the produc
`tion procedure of the wireless suspension blank for HDD
`according to the first and the second method of the present
`invention, respectively.
`FIG. 6 is a schematic illustration of a plasma etching
`system used in the third method of the present invention.
`FIG. 7 is an explanatory drawing showing the behavior of
`a laminate in the case of the plasma etching system shown
`in FIG. 6 being used.
`FIG. 8 is a flow drawing showing the basic production
`procedure in a method of manufacturing a wireless suspen
`sion blank, for explaining the third method of the present
`invention.
`FIGS. 9, 10 and 11 are process drawings showing the
`working procedures of a wireless suspension blank for HDD
`according to the third method of the present invention.
`DETAILED DESCRIPTION
`In order to explain in detail the present invention, refer
`ring to the drawings appended, the present invention is
`illustrated concretely.
`The Method (1) of the Present Invention
`In the first method of the present invention, a wireless
`suspension blank shown in FIG. 3 is made using a two-layer
`laminate composed of a metallic layer with a spring property
`or characteristic and an electrically insulating layer. Namely,
`first, the working step of metallic layer is carried out in Step
`1 (S1), and then the forming step of a wiring part is carried
`out in Step 2 (S2). Finally the working step of the insulating
`layer is carried out in Step 3 (S3).
`The step 1 is a first step for working the metallic layer
`such as a stainless steel positioned on one side of the
`two-layered laminate. The step 2 is carried out after the
`metallic layer is processed in such a manner. The step 2 is
`a second step in which a wiring part is formed on an
`insulating layer such as a polyimide resin layer laminated on
`the metallic layer by plating metals such as copper by the
`semi-additive method. The following step 3 is a third step in
`which a resist pattern is formed for working the insulating
`layer and thereafter the insulating layer is worked according
`to the resist pattern by wet-etching. A wireless suspension
`blank is made through these three steps.
`FIGS. 4 and 5 are process drawings showing the working
`60
`procedures of the wireless suspension blank for a HDD
`according to the first method of the present invention. Then,
`the respective steps are explained in order.
`FIG. 4(a) shows laminate 1 for making a wireless sus
`pension blank for HDD according to the first method. The
`laminate 1 is composed of a stainless steel as metallic layer
`2 with the spring property and an insulating layer 3 put on
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`the metallic layer. The insulating layer 3 is composed of
`polyimide resin film as core-insulating layer and an adhesive
`layer, in which the core insulating layer is laminated with
`metallic layer 2 through the adhesive layer.
`A concrete example is as follows: polyimide resin film
`with thickness 12.5 um(“APIKAL NPI’’ manufactured by
`Kanefuchi Chemical Co., Ltd.) is used as insulating layer.
`Polyimide varnish (“EN-20° manufactured by Shin Nippon
`Rika Co., Ltd.) as a material of insulating layer is applied on
`the polyimide resin film in such a manner that the thickness
`of film of after drying comes to 2.5+0.3 um to form a film
`with an adhesive layer (insulating layer 3). The film with
`adhesive layer is laminated with stainless steel foil
`(“304HTA foil” manufactured by Shin Nippon Seitetu Co,
`Ltd.). Thereafter, pressure of I MPa is applied on the film
`with adhesive layer and stainless steel at 300° C. for 10 min
`in a vacuum so that a laminate is obtained.
`FIG. 4(b) shows a state where after resists 4 are applied
`on the upper face of insulating layer 3 and the lower face of
`metallic layer 2 in laminate 1, respectively, a resist pattern
`5 is formed on metallic layer 2 by exposing the resist applied
`on the lower face of the metallic layer to light and devel
`oping the resist.
`There is given a concrete example where after dry film
`resists (“AQ-5038” manufactured by Asahi Chemical Co.,
`Ltd.) are applied on the upper face of insulating layer 3 and
`the lower face of metallic layer 2 in laminate 1, respectively,
`at 100° C., a resist laminated on the lower face of the
`stainless steels is exposed through a given photomask to
`light and developed to form a resist pattern. Exposing is
`carried out by using grays with a quantity of exposing rays
`of 3~60 m.J/cm3, and the development is carried out by
`spraying 1 wt % of Na2CO3 solution to the resist at 30°C.,
`in which dry film resist is preferably used as resist. However,
`liquid resist such as casein may be used.
`FIG. 4(c) shows a state where one side of stainless steel
`is etched using general etching solution of ferric chloride by
`the one side lapping method, and then resists 4, 5 are
`removed from stainless steel by peeling solution of sodium
`hydroxide. By this, a two-layer laminate having metallic
`layer 2 formed into a shape on one side of insulating layer
`3 can be obtained.
`FIG. 4(d) shows a state where a wiring part 6 is formed
`by forming a pattern of conductive material on the side of
`insulating layer 3 opposite to the side of metallic layer 2. In
`this case, a feeding layer is formed on the upper face of
`insulating layer 2. Resist of photosensitive material is
`applied on the upper face of insulating layer 3 and the face
`of metallic layer 2 having worked pattern. Thereafter the
`resist formed on insulating layer 3 is exposed through a
`given photomask pattern to light and developed to form a
`resist pattern. Then, copper is deposited on an area of the
`feeding layer on insulating layer 3 exposed through the
`photomask pattern by plating with the feeding layer.
`Thereafter, the resist pattern and an area of the feeding layer
`under the resist pattern are removed.
`FIG. 5(a) shows a state where in order to work insulating
`layer 3 by the wet etching method, resist layers 7 and 8 for
`working insulating layer are formed on an area of insulating
`layer to be left on the upper face of insulating layer 3 on
`which a wiring part is formed and the lower face of
`insulating layer on which metallic layer 2 is formed. For this
`object, resists 7,8 for working insulating layer are formed by
`the dip-coating method, the roll coating method, the die
`coating method, or the laminating method. Thereafter, the
`resist layers are exposed to light through a given mask
`pattern.
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`There is given a concrete example in which dry film
`resists (“AQ-5038” manufactured by Asahi Chemical Co.,
`Ltd.) are laminated on the upper face of insulating layer and
`the lower face of metallic layer 2. Exposure is carried out by
`g rays with a quantity of exposing rays of 30–60 m.J/cm3,
`and the development is carried out by spraying 1 wi 9% of
`Na2CO3 solution on the resist at 30° C. to form resist
`patterns, in which the forming of resist layers for working
`insulating layer may be carried out not by exposing the
`resists to light and developing the resist, but by the printing
`method.
`FIG. 5(b) shows a state where insulating layer 3 is worked
`by wet-etching the laminate with resist patterns through the
`resist patterns. In this case, working of insulating layer by
`wet etching may be carried out with every side of the
`laminate, or at the same time with both sides. After wet
`etching, resist layers 7, 8 for working insulating layer used
`as masks are removed from the laminate, and working of
`insulating layer 2 is finished. The stripping of resist is carried
`out generally at 50° C. in hot alkaline solution of 3 wt % of
`sodium hydroxide. However, in the case of using polyimide
`resin which is poor in alkali resistance, organic alkali such
`as ethanolamine may be used as a stripping solution.
`FIG. 5(c) shows a state where Au as finishing up of
`working is plated on wiring part 6 in the laminate formed as
`above-mentioned, and besides cover layer 9 of epoxide
`resins and others as protective layer is formed. The Au
`plating is a surface treatment for electrical connection
`between a magnetic head slider (not shown) and a suspen
`sion and for electrical connection between the suspension
`and a control side. Au plating is desirable. However, pro
`tective material is not restricted to it. Ni/Au plating may be
`used, or a soldering plating or a printing layer may be used.
`For example, when Niplating is applied, glossy plating bath,
`non-glossy plating bath or semi glossy plating bath can be
`selected.
`As above-mentioned, through the procedure shown in
`FIGS. 4 and 5, the process of a wireless suspension blank for
`HDD is finished. Thereafter, although not shown, working
`for the assembly such as mechanical working is carried out,
`so that a wireless suspension blank for HDD is finished.
`The Method (2) of the Present Invention
`In the second method of the present invention, a wireless
`suspension blank is made using a two-layer laminate com
`posed of a metallic layer with the spring property and an
`45
`electrically insulating layer. Namely, the working step of
`metallic layer is carried out in Step 1 (S1) and then the
`forming step of wiring part is carried out in Step 2 (S2), and
`finally the working step of insulating layer is carried out in
`Step (S3).
`Step 1 is a first step in which metallic layer such as
`stainless steel existing on one side of the two-layer laminate
`is worked by photo-etching. After the metallic layer is
`worked, Step 2 is carried out. The step 2 is a second step in
`which a wiring part is formed by plating metal such as
`copper on an insulating layer such as polyimide resin
`laminated on the metallic layer by the semi-additive method.
`The following step 3 is a step in which after the resist pattern
`for working of an insulating layer is formed, the insulating
`layer is worked through the resist pattern by plasma etching.
`Wireless suspension blank is made through these three steps.
`FIGS. 4 and 5 are the production drawings showing the
`productive procedure of wireless suspension blank for HDD
`according to the second method of present invention, in
`which the steps of up to a step shown in FIG. 5(a) are the
`same as steps in the first method of the present invention.
`The following steps for working insulating layer differs from
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`steps in the first method of the present invention in that
`working of insulating layer is carried not by the wet etching
`method, but by the plasma etching method. The plasma
`etching is preferable to be carried out by means of the
`plasma etching system schematically shown in FIG. 6.
`The plasma etching system has a cathode electrode 23
`with curved shape, through which cooling pipes 22 are
`passed. The cathode electrode 23 is secured to a vacuum
`chamber 21 through a RF insulating material 24. Further, the
`cathode electrode 23 is connected through RF introducing
`pipe 25 and a blocking condenser 26 with RF electric power
`27. Further, an anode electrode 28 with the same curved
`shape as that of the cathode electrode 23 is arranged over the
`cathode electrode 23 leaving the same space between the
`surface of the anode electrode 28 and the surface of the
`cathode electrode 23. Further, working gas is introduced into
`the vacuum chamber 21 through gas introducing pipe 29 and
`through a plurality of shower electrodes 28a. Further, anode
`electrode 28 and vacuum chamber 21 are electrically
`grounded. The radius of curvature of cathode electrode 23
`depends upon a size of laminate of substrate. Concretely, the
`above-mentioned radius of curvature is the minimum radius
`of curvature, which corresponds to 9% of the minimum side
`at which a laminate to be worked can be curved.
`Although the structure for generating plasma shown here
`is a cathode coupling system, the anode coupling system in
`which RF is applied to anode electrode 28, or the hollow
`cathode system in which RF is applied alternately to cathode
`electrode 23 and to anode electrode 28 may be used. Further,
`although cathode electrode 23 is connected here with RF
`electric power 27 through blocking power 27, cathode
`electrode 23 may be connected directly with RF electric
`power 27. Further, even if the distance between cathode
`electrode 23 and anode electrode 28 may vary somewhat
`according to places, its effect is very changed.
`If etching is carried out by means of the plasma etching
`system shown in FIG. 6, the phenomenon of laminate 1
`being curved disappears by holding down the laminate 1
`itself by empty weight thereof and by the action of elasticity
`thereof which makes efforts to keep parallelism, so that the
`laminate 1 is brought into close contact with cathode elec
`trode 23. In such a way, the phenomenon of the laminate 1
`being curved disappears by using a cathode electrode with a
`concave portion at the center of electrode, in which a
`laminate to be worked is put on the electrode so that the
`phenomenon of laminate 1 being curved disappears by
`holding down the laminate 1 itself by empty weight thereof
`and by the action of elasticity thereof which makes efforts to
`keep parallelism. Accordingly, the local distribution of tem
`perature is decreased so that working at high throughput
`becomes possible. In this case, the shape of cathode elec
`trode 23 may be formed into a convex shape, in which the
`shape of anode electrode 28 is concave. However, the shape
`of cathode electrode 23 is desirably concave.
`In addition to the above-mentioned content, only a part of
`laminate 1 may be pressed complementarily and physically,
`or laminate 1 may be pressed by electrostatic method.
`A concrete example of working condition of plasma
`etching made using the plasma etching system shown in
`FIG. 6 is as follows: the pressure of etching gas is 2-80 Pa.
`Components of etching gas are oxygen as the main
`component, and 5-40% of CF4. Further, 1-15% of Nitrogen
`may be added as needed. Further, additive gas such as NF3,
`CHF3, SF6 can be used instead of CF4. The flow rate of
`etching gas is 30–3000 sccm. The more the flow rate of
`etching gas, the higher the etching rate shows a tendency to
`be. However, even if the etching gas is added over the given
`
`HUTCHINSON EXHIBIT 1009
`
`

`

`US 6,942,817 B2
`
`7
`amount, the vacuum chamber becomes saturated with the
`etching gas. Therefore, the amount of etching gas is pref-
`erably adjusted to the exhaust capacity of the plasma etching
`system. Further, power is 0.1~2 W/cmz.
`After plasma-etching, as resist layers 7, 8 for working
`insulating layer used as mask are removed, working of
`insulating layer 3 is finished. The step of after working of
`insulating layer is in the same manner as that explained in
`the first method of the present invention.
`The Method (3) of the Present Invention
`In the third method of the present invention, a wireless
`suspension blank is made through the steps shown in FIG.
`8 using a two-layer laminate composed of a metallic layer
`with the spring property and an electrically insulating layer.
`Namely, first, the step for forming of a wiring part is carried
`out in Step 1 (SI), and then the step for working the metallic
`layer is carried out in Step 2 ($2) and the step for working
`the insulating layer in Step 3 (S3).
`The step 1 is a first step in which a metal such as copper
`is plated on an insulating layer such as polyimide resin
`laminated on a metallic layer by the semi-additive method.
`The step 2 is a second step in which the metallic layer such
`as stainless steel positioned on one side of the two-layer
`laminate is worked by the wet-etching method. The follow-
`ing step is a third step in which the insulating layer is worked
`by the dry etching method or the wet etching method. These
`three steps are carried out
`in order so that a wireless
`suspension blank is made.
`In such a manner,
`in the third method of the present
`invention, first, a wiring part is formed on an insulating
`layer, before a metallic layer and polyimide resin layer are
`worked. Accordingly, uniform under coating can be easily
`formed on the laminate. Further, a wiring part can be formed
`minutely.
`FIGS. 9 through 11 is the production drawings showing
`the productive procedure of a wireless suspension blank for
`HDD. The individual steps are explained in order. FIG. 9(a)
`shows a laminate 11 for forming a wireless suspension blank
`for HDD. The laminate 11 is the same one as that explained
`in the first method,
`in which an insulating layer 13 is
`laminated on stainless steel as a metallic layer 12 with the
`spring property, the insulating layer 13 being composed of
`polyimide resin film as a core insulating layer and adhesive
`layer. The metallic layer 12 is laminated through the adhe-
`sive layer on the polyimide film.
`A concrete example thereof is as follows: in the same
`manner as that explained about the first method, polyimide
`resin film with thickness of 12.5 um (“APIKAL NPI”
`manufactured by Kanegafuchi Chemical Co., Ltd.) is used
`as a core insulating layer; polyimide varnish (“EN-20”
`manufactured by Shin Nippon Rika Co., Ltd.) as adhesive
`layer is applied on the polyimide resin film in such a manner
`as the thickness of film of after having been dried comes to
`2.5103 um, so that a film with an adhesive layer (insulating
`layer 13) is formed. The film with adhesive layer is lami-
`nated with stainless steel foil (“304HTA foil” manufactured
`by Shin Nippon Steel Corporation). Thereafter, pressure of
`1 MPa is applied to the laminate of the film with adhesive
`layer and stainless steel at 300° C. for 10 min in a vacuum
`to form a two-layer laminate 11.
`First, a wiring part is formed on the laminate 11. For this,
`first, as shown In FIG. 9(b), under coating 14 for a wiring
`part is formed on an insulating layer 13, in which the under
`coating is formed by sputtering, chemical plating and others.
`A concrete example thereof is as follows: dry film resists
`(“AQ-5038” manufactured by Asahi Chemical Co., Ltd.) are
`laminated on both side of the laminate 11 at 100° C.; and a
`
`10
`
`15
`
`20
`
`25
`
`30
`
`35
`
`40
`
`45
`
`50
`
`55
`
`60
`
`65
`
`8
`resist laminated on the lower face of the stainless steel is
`
`exposed through a given mask pattern to light. The exposure
`is carried out by g-rays with the exposure of 30~60 mJ/cm2
`to form a resist pattern. The development is carried out by
`spraying 1 wt % of Na2CO3 solution on the exposed resist
`at 30° C. Dry film resist
`is preferably used as resist.
`However, liquid resist such as casein can be used.
`Then, a pattern of additive copper forming a wiring part
`16 is formed by using under coating 14 formed on insulating
`layer 13, as shown in FIG.,
`Thereafter, dry film resist
`15 is removed from the laminate, and then exposed portions
`of under coating 14 are etched to remove, by which wiring
`part 16 is formed on insulating layer 13, as shown in FIG.
`9(e).
`After wiring part 13 has been formed on insulating layer
`13, the working of metallic layer 12 positioned on the lower
`side of the insulating layer 13 is carried out. For this, first,
`as shown in FIG. 10(a), dry film resist 17, 18 are laminated
`on both sides of the laminate 11. Therefore, resist 18 is
`laminated on the lower face of the metallic layer 12.
`A concrete example thereof is as follows:
`in the same
`manner as above-mentioned, dry film resists (“AQ-5038”
`manufactured by Asahi Chemical Co., Ltd.) are laminated
`on both sides of the laminate at 100° C.; thereafter, resist
`laminated on the lower face of stainless steel is exposed
`through a given mask pattern to light and developed to form
`a pattern, in which the exposure is carried out by g-rays with
`the exposure of 30~60 mJ/cm2, and the development is
`carried out by spraying 1 wt % of Na2CO3 on the resist at
`30° C. Dry film resist is preferably used as resist. However,
`liquid resist such as casein can be also used as resist.
`Thereafter, as shown in FIG. 10(b), one side of stainless
`steel is etched with general etc