throbber
(12) United States Patent
`Yagi et al.
`
`US006942817B2
`US 6,942,817 B2
`Sep. 13, 2005
`
`(10) Patent No.:
`(45) Date of Patent:
`
`(54) METHOD OF MANUFACTURING WIRELESS
`SUSPENSION BLANK
`
`(75) Inventors: Hiroshi Yagi, Tokyo (JP); Shigeki
`Kawano, Tokyo (JP); Kazuo Umeda,
`Tokyo (JP); Jiro Takei, Tokyo (JP);
`Yukio Iimura, Tokyo (JP); Satoshi
`Sasaki, Tokyo (JP); Katsuya Sakayori,
`Tokyo (JP), Hiroko Amasaki, Tokyo
`(JP)
`(73) Assignee: Dainippon Printing Co., Ltd., Tokyo
`(JP)
`Subject to any disclaimer, the term of this
`patent is extended or adjusted under 35
`U.S.C. 154(b) by 0 days.
`
`(*) Notice:
`
`(21) Appl. No.: 09/813,759
`(22) Filed:
`Mar. 21, 2001
`(65)
`Prior Publication Data
`US 2002/0027127 A1 Mar. 7, 2002
`Foreign Application Priority Data
`(30)
`(JP) “…. 2000–08:5045
`Mar. 24, 2000
`Jul. 7, 2000 (JP) ....................................... 2000–206195
`Jul. 7, 2000 (JP) ....................................... 2000–206196
`(51) Int. Cl." ........................... B44C 1/22; CO3C 15/00;
`CO3C 25/68; C23H 1/00; G11B 21/16
`(52) U.S. Cl. ....................... 216/57; 216/13; 118/723 E;
`438/108; 360/244.3; 360/245.9; 360/245.4;
`360/294.7
`(58) Field of Search ................. 216/57, 13; 118/723 E;
`438/108; 360/244.3, 245.9, 245.4, 294.7
`
`(56)
`
`References Cited
`U.S. PATENT DOCUMENTS
`
`5,839,193 A * 11/1998 Bennin et al. ............. 29/895.9
`5,970,319 A * 10/1999 Banks et al. ................ 438/108
`6,093,476 A * 7/2000 Horiuchi et al. ............ 428/209
`
`FOREIGN PATENT DOCUMENTS
`
`JP
`
`2000–49195
`
`2/2000
`
`* cited by examiner
`
`Primary Examiner—Rudy Zervigon
`(74) Attorney, Agent, or Firm—Flynn, Thiel, Boutell &
`Tanis, P.C.
`(57)
`
`ABSTRACT
`
`A wireless suspension blank is made using a two-layer
`laminate composed of a metallic layer with the spring
`property and an electrically insulating layer. The first
`method includes a first step for working the metallic layer by
`the photo etching method, a second step for forming a wiring
`part on the insulating layer by the semi-additive method and
`a third step for working the insulating layer by the wet
`etching method. The second method includes a first step for
`working the metallic layer by the photo etching method, a
`second step for forming a wiring part on the insulating layer
`by the semi-additive method and a third step for working the
`insulating layer by the plasma etching method. The third
`method includes a first step for forming a wiring part on the
`metallic layer by the semi-additive method, a second step for
`working the metallic layer by the wet-etching method and a
`third step for working the insulating layer by the dry-etching
`method or the wet-etching method. The use of a two-layer
`laminate makes possible a low cost production. Further, the
`forming of a wiring part by the semi-additive method makes
`possible to working very accurately a fine wiring part.
`
`5,628,869 A * 5/1997 Mallon ................... 118/723 E
`
`17 Claims, 9 Drawing Sheets
`
`
`
`{ b )
`
`(c)
`
`• SSSI.
`
`HUTCHINSON EXHIBIT 1009
`
`

`

`U.S. Patent
`
`Sep. 13, 2005
`Sheet 1 of 9
`F|G. 1
`
`29
`
`US 6,942,817 B2
`
`
`
`25
`
`~26 22
`
`2 =tº
`sº
`
`AAE /06 A 6'7
`
`F|G. 2
`
`HUTCHINSON EXHIBIT 1009
`
`

`

`U.S. Patent
`
`Sep. 13, 2005
`
`Sheet 2 of 9
`
`US 6,942,817 B2
`
`FIG. 3
`
`(S1)
`
`STEP FOR PROCESSING
`METALLIC LAYER
`
`(S2)
`
`STEP FOR FORMING
`WIRING PART
`
`(S3)
`
`STEP FOR PROCESSING
`INSULATING LAYER
`
`HUTCHINSON EXHIBIT 1009
`
`

`

`U.S. Patent
`
`Sep. 13, 2005
`
`Sheet 3 of 9
`
`US 6,942,817 B2
`
`F|G. 4
`
`(a )
`
`3
`
`2
`
`ZZZZZZZZZZZZZZZZO
`
`o, N-3 Z-2
`
`NS NNNNN
`
`NNNN
`
`zº a
`(d) N-3
`Z Z Z-2
`
`HUTCHINSON EXHIBIT 1009
`
`

`

`U.S. Patent
`
`Sep. 13, 2005
`
`Sheet 4 of 9
`
`US 6,942,817 B2
`
`F|G. 5
`
`
`
`Soºn NäNæ
`NNN
`
`
`
`
`
`
`
`
`
`(a )
`
`8
`
`(b)
`
`3
`
`
`
`(c)
`
`HUTCHINSON EXHIBIT 1009
`
`

`

`U.S. Patent
`
`Sep. 13, 2005
`
`Sheet 5 of 9
`
`US 6,942,817 B2
`
`
`
`HUTCHINSON EXHIBIT 1009
`
`

`

`U.S. Patent
`
`Sep. 13, 2005
`
`Sheet 6 of 9
`
`US 6,942,817 B2
`
`F|G, 8
`
`(sl) | SºFMING
`
`_WIRING PART -
`
`(S2)
`
`STEP FOR PROCESSING
`_METALLIC LAYER
`
`(S3) | STER FOR PROCESSING
`INSULATING LAYER
`
`HUTCHINSON EXHIBIT 1009
`
`

`

`U.S. Patent
`
`Sep. 13, 2005
`
`Sheet 7 of 9
`
`US 6,942,817 B2
`
`11
`
`/
`(a) [ZZZZZZZZZZZZ-12
`
`13
`
`(b)
`
`14
`
`5 1
`
`13
`12
`
`Bºl Bºl Bºl Bºlº 14
`NYNNNNNNNNNNS-13
`(c) DZZZZZZZZZZZz iz
`
`16 15
`
`ºzziºzzºl-14
`(d) NNNNNNS-13
`ZZZZZZZZZZZZ-12
`
`(e)
`
`16
`
`2– 14
`13
`12
`
`HUTCHINSON EXHIBIT 1009
`
`

`

`U.S. Patent
`
`Sep. 13, 2005
`
`Sheet 8 of 9
`
`US 6,942,817 B2
`
`F|G. 10
`
`17
`
`16
`
`
`
`
`
`ZZZZZZZZZZZZ
`— `R-18
`
`14
`
`12
`
`
`
`
`
`
`
`
`
`( b ) NSSSSSSSS-N-3
`12
`18
`
`16
`
`HUTCHINSON EXHIBIT 1009
`
`

`

`U.S. Patent
`
`Sep. 13, 2005
`
`Sheet 9 of 9
`
`US 6,942,817 B2
`
`F|G. 11
`
`
`
`19
`16
`fºrzil Z.
`(a) Rººsékº is
`WZZZZZZZ 12
`
`
`
`
`
`
`
`HUTCHINSON EXHIBIT 1009
`
`

`

`1
`METHOD OF MANUFACTURING WIRELESS
`SUSPENSION BLANK
`
`The present invention relates to a method of manufac
`turing a wireless suspension blank used in a hard disc drive
`(hereafter called “HDD”) as a data storage device and the
`like.
`
`BACKGROUND OF THE INVENTION
`Prior art concerning such a method of manufacturing the
`above-mentioned member for electric parts is mentioned in
`Japanese Patent Laid-open 2000-49195 (Title of Invention:
`“Process for making a member for electric parts”), in which
`a method of manufacturing a wireless suspension blank used
`for HDD is not concretely explained on a method of manu
`facturing a wireless suspension blank. However, a method of
`manufacturing a member for electric parts is disclosed as
`follows.
`In the method, a three-layered laminate composed of a
`polyimide resin film and metallic foils laminated on both
`sides of the polyimide resin film is used as a laminate. In the
`process, resist patterns are formed on the metallic foils
`laminated on both sides of the polyimide, respectively, and
`the two metallic foils are treated at the same time by etching
`solution. Thereafter, resist patterns are removed from the
`two metallic foils, and then plasma etching of the polyimide
`resin film is made through one metallic foil etched as a mask
`to form the polyimide resin film into a pattern. Thereafter,
`the metallic foil used as a mask is removed from the
`polyimide resin film. As a result, a member for an electronic
`part can be obtained which is composed of a laminate of the
`polyimide resin film formed into a pattern and the metallic
`foil formed into a pattern. This effect is that the low-cost
`production is possible since reproduction occurs only once
`and high quality product can be obtained in which a pattern
`of polyimide resin film is laminated on a pattern of metallic
`foil with a high positioning accuracy.
`However, the above-mentioned process has a first prob
`lem in that the three-layered laminate used is high-priced.
`Further, the above-mentioned process has a second prob
`lem in that working of metallic foil is difficult where finer
`working accuracy is required, since wet etching is made to
`the metallic foils laminated on both sides of polyimide resin
`film of three-layered laminates.
`Further, the above-mentioned process has another prob
`lem in that flying leads used in checking the action of a
`magnetic head cannot be formed in a state wherein both
`sides thereof are exposed to the air.
`Further, working of polyimide resin film of the insulating
`layer is carried out by the dry etching method such as the
`plasma etching method. However, dry etching has the fol
`lowing basic problem.
`FIG. 1 is a schematic illustration of a plasma etching
`system used for dry etching. The conventional plasma
`etching system has a flat-plate type of cathode electrode 23,
`in which cooling pipe 22 is passed. The cathode electrode is
`secured to a vacuum chamber 21 through RF electrode
`material 24, and the cathode electrode 23 is connected with
`power supply 27 through RF introducing pipe 25 and
`blocking condenser 26. Further, a flat-plate type of anode
`electrode 28 is arranged parallel with the cathode electrode
`23 above the cathode electrode, in which working gas is
`introduced from the whole surface of the anode electrode 28
`and through a gas introducing pipe 29. Further, anode
`electrode 28 and vacuum chamber 21 are grounded electri
`cally.
`
`10
`
`15
`
`20
`
`25
`
`30
`
`35
`
`40
`
`45
`
`50
`
`55
`
`60
`
`65
`
`US 6,942,817 B2
`
`2
`In the above-mentioned conventional plasma etching
`system, dry etching is carried out at a state that a laminate
`is put on the flat-plate type of cathode electrode 23. In case
`of polyimide resin film being dry-etched, usually, working
`of polyimide resin film at high temperature enables higher
`working speed and high throughput. Therefore, working of
`polyimide resin film is carried out generally at a temperature
`in the region of glass transition temperature (Tg) of poly
`imide resin. However, the laminate of the wireless suspen
`sion blank has different metallic materials on both sides.
`Therefore, if working temperature is in the region of Tg of
`polyimide resin, curving of the laminate is caused by the
`very small difference between thermal expansion coeffi
`cients of metals so that working efficiency is lowered by
`local thermal distribution caused by curving of the laminate.
`Namely, there is a problem that as shown in FIG. 2, a center
`of the laminate S goes up, in such an extent that the laminate
`S does not come into contact with cathode electrode 23, and
`therefore high throughput working becomes impossible.
`DISCLOSURE OF INVENTION
`The present invention was made considering the above
`mentioned technical problems. An object of the present
`invention is to provide a method of manufacturing a wireless
`suspension blank in which a highly accurate method is
`possible.
`In order to achieve this object, a first method of the
`present invention is a method of manufacturing a wireless
`suspension blank using a two-layered laminate composed of
`a metallic layer with a spring property and an electrically
`insulating layer, wherein the method comprises a first step
`for making the metallic layer by the photo etching method,
`a second step for making a wiring part on the insulating layer
`by the semi-additive method, and, a third step for working
`an insulating layer by the wet etching method.
`In the first method of the present invention, it is desirable
`to use polyimide resin as the insulating layer.
`Further, in the third step of the first method of the present
`invention, wet etching of the insulating layer may be made
`from any of the metallic layer side and the wiring part side,
`or from both sides thereof.
`Further, in order to achieve the same object, a second
`method of the present invention involves a method of
`manufacturing a wireless suspension blank using a two
`layered laminate composed of a metallic layer with the
`spring property and an electrically insulating layer, wherein
`the method comprises a first step for working the metallic
`layer by the photo etching method, a second step for forming
`a wiring part by the semi-additive method; and, a third step
`for working the insulating layer by the plasma etching
`method.
`In the second method of the present invention it is also
`desirable to use polyimide resin as the insulating layer.
`Further, in the method of the present invention, when
`plasma-etching the insulating layer, it is desirable to plasma
`etch the insulating layer using an electrode having a shape
`with curvature.
`Further, in order to achieve the same object, a third
`method of the present invention involves a method of
`manufacturing a wireless suspension blank using a two
`layered laminate composed of a metallic layer with the
`spring property and an electrically insulating layer, wherein
`the method comprises a first step for forming a wiring part
`by the semi-additive method, a second step for working the
`metallic layer which is processed by the wet etching method,
`and a third sep for working the insulating layer either by the
`dry etching method or the wet etching method.
`
`HUTCHINSON EXHIBIT 1009
`
`

`

`3
`In the third method of the present invention, it is also
`desirable to use polyimide resin as the insulating layer.
`Further, in the third method of the present invention, it is
`desirable to form a flying lead in the third step.
`BRIEF DESCRIPTION OF THE DRAWINGS
`FIG. 1 is a schematic illustration of a plasma etching
`system.
`FIG. 2 is an explanatory drawing showing a state where
`a laminate is curved in the case of the plasma etching system
`shown in FIG. 1 being used.
`FIG. 3 is a flow diagram showing a basic procedure in a
`method of manufacturing a wireless suspension blank for
`HDD, for explaining the first and second methods of the
`present invention.
`FIGS. 4 and 5 are method drawings showing the produc
`tion procedure of the wireless suspension blank for HDD
`according to the first and the second method of the present
`invention, respectively.
`FIG. 6 is a schematic illustration of a plasma etching
`system used in the third method of the present invention.
`FIG. 7 is an explanatory drawing showing the behavior of
`a laminate in the case of the plasma etching system shown
`in FIG. 6 being used.
`FIG. 8 is a flow drawing showing the basic production
`procedure in a method of manufacturing a wireless suspen
`sion blank, for explaining the third method of the present
`invention.
`FIGS. 9, 10 and 11 are process drawings showing the
`working procedures of a wireless suspension blank for HDD
`according to the third method of the present invention.
`DETAILED DESCRIPTION
`In order to explain in detail the present invention, refer
`ring to the drawings appended, the present invention is
`illustrated concretely.
`The Method (1) of the Present Invention
`In the first method of the present invention, a wireless
`suspension blank shown in FIG. 3 is made using a two-layer
`laminate composed of a metallic layer with a spring property
`or characteristic and an electrically insulating layer. Namely,
`first, the working step of metallic layer is carried out in Step
`1 (S1), and then the forming step of a wiring part is carried
`out in Step 2 (S2). Finally the working step of the insulating
`layer is carried out in Step 3 (S3).
`The step 1 is a first step for working the metallic layer
`such as a stainless steel positioned on one side of the
`two-layered laminate. The step 2 is carried out after the
`metallic layer is processed in such a manner. The step 2 is
`a second step in which a wiring part is formed on an
`insulating layer such as a polyimide resin layer laminated on
`the metallic layer by plating metals such as copper by the
`semi-additive method. The following step 3 is a third step in
`which a resist pattern is formed for working the insulating
`layer and thereafter the insulating layer is worked according
`to the resist pattern by wet-etching. A wireless suspension
`blank is made through these three steps.
`FIGS. 4 and 5 are process drawings showing the working
`60
`procedures of the wireless suspension blank for a HDD
`according to the first method of the present invention. Then,
`the respective steps are explained in order.
`FIG. 4(a) shows laminate 1 for making a wireless sus
`pension blank for HDD according to the first method. The
`laminate 1 is composed of a stainless steel as metallic layer
`2 with the spring property and an insulating layer 3 put on
`
`65
`
`35
`
`40
`
`45
`
`50
`
`55
`
`US 6,942,817 B2
`
`10
`
`15
`
`20
`
`25
`
`30
`
`4
`the metallic layer. The insulating layer 3 is composed of
`polyimide resin film as core-insulating layer and an adhesive
`layer, in which the core insulating layer is laminated with
`metallic layer 2 through the adhesive layer.
`A concrete example is as follows: polyimide resin film
`with thickness 12.5 um(“APIKAL NPI’’ manufactured by
`Kanefuchi Chemical Co., Ltd.) is used as insulating layer.
`Polyimide varnish (“EN-20° manufactured by Shin Nippon
`Rika Co., Ltd.) as a material of insulating layer is applied on
`the polyimide resin film in such a manner that the thickness
`of film of after drying comes to 2.5+0.3 um to form a film
`with an adhesive layer (insulating layer 3). The film with
`adhesive layer is laminated with stainless steel foil
`(“304HTA foil” manufactured by Shin Nippon Seitetu Co,
`Ltd.). Thereafter, pressure of I MPa is applied on the film
`with adhesive layer and stainless steel at 300° C. for 10 min
`in a vacuum so that a laminate is obtained.
`FIG. 4(b) shows a state where after resists 4 are applied
`on the upper face of insulating layer 3 and the lower face of
`metallic layer 2 in laminate 1, respectively, a resist pattern
`5 is formed on metallic layer 2 by exposing the resist applied
`on the lower face of the metallic layer to light and devel
`oping the resist.
`There is given a concrete example where after dry film
`resists (“AQ-5038” manufactured by Asahi Chemical Co.,
`Ltd.) are applied on the upper face of insulating layer 3 and
`the lower face of metallic layer 2 in laminate 1, respectively,
`at 100° C., a resist laminated on the lower face of the
`stainless steels is exposed through a given photomask to
`light and developed to form a resist pattern. Exposing is
`carried out by using grays with a quantity of exposing rays
`of 3~60 m.J/cm3, and the development is carried out by
`spraying 1 wt % of Na2CO3 solution to the resist at 30°C.,
`in which dry film resist is preferably used as resist. However,
`liquid resist such as casein may be used.
`FIG. 4(c) shows a state where one side of stainless steel
`is etched using general etching solution of ferric chloride by
`the one side lapping method, and then resists 4, 5 are
`removed from stainless steel by peeling solution of sodium
`hydroxide. By this, a two-layer laminate having metallic
`layer 2 formed into a shape on one side of insulating layer
`3 can be obtained.
`FIG. 4(d) shows a state where a wiring part 6 is formed
`by forming a pattern of conductive material on the side of
`insulating layer 3 opposite to the side of metallic layer 2. In
`this case, a feeding layer is formed on the upper face of
`insulating layer 2. Resist of photosensitive material is
`applied on the upper face of insulating layer 3 and the face
`of metallic layer 2 having worked pattern. Thereafter the
`resist formed on insulating layer 3 is exposed through a
`given photomask pattern to light and developed to form a
`resist pattern. Then, copper is deposited on an area of the
`feeding layer on insulating layer 3 exposed through the
`photomask pattern by plating with the feeding layer.
`Thereafter, the resist pattern and an area of the feeding layer
`under the resist pattern are removed.
`FIG. 5(a) shows a state where in order to work insulating
`layer 3 by the wet etching method, resist layers 7 and 8 for
`working insulating layer are formed on an area of insulating
`layer to be left on the upper face of insulating layer 3 on
`which a wiring part is formed and the lower face of
`insulating layer on which metallic layer 2 is formed. For this
`object, resists 7,8 for working insulating layer are formed by
`the dip-coating method, the roll coating method, the die
`coating method, or the laminating method. Thereafter, the
`resist layers are exposed to light through a given mask
`pattern.
`
`HUTCHINSON EXHIBIT 1009
`
`

`

`25
`
`5
`There is given a concrete example in which dry film
`resists (“AQ-5038” manufactured by Asahi Chemical Co.,
`Ltd.) are laminated on the upper face of insulating layer and
`the lower face of metallic layer 2. Exposure is carried out by
`g rays with a quantity of exposing rays of 30–60 m.J/cm3,
`and the development is carried out by spraying 1 wi 9% of
`Na2CO3 solution on the resist at 30° C. to form resist
`patterns, in which the forming of resist layers for working
`insulating layer may be carried out not by exposing the
`resists to light and developing the resist, but by the printing
`method.
`FIG. 5(b) shows a state where insulating layer 3 is worked
`by wet-etching the laminate with resist patterns through the
`resist patterns. In this case, working of insulating layer by
`wet etching may be carried out with every side of the
`laminate, or at the same time with both sides. After wet
`etching, resist layers 7, 8 for working insulating layer used
`as masks are removed from the laminate, and working of
`insulating layer 2 is finished. The stripping of resist is carried
`out generally at 50° C. in hot alkaline solution of 3 wt % of
`sodium hydroxide. However, in the case of using polyimide
`resin which is poor in alkali resistance, organic alkali such
`as ethanolamine may be used as a stripping solution.
`FIG. 5(c) shows a state where Au as finishing up of
`working is plated on wiring part 6 in the laminate formed as
`above-mentioned, and besides cover layer 9 of epoxide
`resins and others as protective layer is formed. The Au
`plating is a surface treatment for electrical connection
`between a magnetic head slider (not shown) and a suspen
`sion and for electrical connection between the suspension
`and a control side. Au plating is desirable. However, pro
`tective material is not restricted to it. Ni/Au plating may be
`used, or a soldering plating or a printing layer may be used.
`For example, when Niplating is applied, glossy plating bath,
`non-glossy plating bath or semi glossy plating bath can be
`selected.
`As above-mentioned, through the procedure shown in
`FIGS. 4 and 5, the process of a wireless suspension blank for
`HDD is finished. Thereafter, although not shown, working
`for the assembly such as mechanical working is carried out,
`so that a wireless suspension blank for HDD is finished.
`The Method (2) of the Present Invention
`In the second method of the present invention, a wireless
`suspension blank is made using a two-layer laminate com
`posed of a metallic layer with the spring property and an
`45
`electrically insulating layer. Namely, the working step of
`metallic layer is carried out in Step 1 (S1) and then the
`forming step of wiring part is carried out in Step 2 (S2), and
`finally the working step of insulating layer is carried out in
`Step (S3).
`Step 1 is a first step in which metallic layer such as
`stainless steel existing on one side of the two-layer laminate
`is worked by photo-etching. After the metallic layer is
`worked, Step 2 is carried out. The step 2 is a second step in
`which a wiring part is formed by plating metal such as
`copper on an insulating layer such as polyimide resin
`laminated on the metallic layer by the semi-additive method.
`The following step 3 is a step in which after the resist pattern
`for working of an insulating layer is formed, the insulating
`layer is worked through the resist pattern by plasma etching.
`Wireless suspension blank is made through these three steps.
`FIGS. 4 and 5 are the production drawings showing the
`productive procedure of wireless suspension blank for HDD
`according to the second method of present invention, in
`which the steps of up to a step shown in FIG. 5(a) are the
`same as steps in the first method of the present invention.
`The following steps for working insulating layer differs from
`
`30
`
`35
`
`40
`
`50
`
`55
`
`60
`
`65
`
`US 6,942,817 B2
`
`10
`
`15
`
`20
`
`6
`steps in the first method of the present invention in that
`working of insulating layer is carried not by the wet etching
`method, but by the plasma etching method. The plasma
`etching is preferable to be carried out by means of the
`plasma etching system schematically shown in FIG. 6.
`The plasma etching system has a cathode electrode 23
`with curved shape, through which cooling pipes 22 are
`passed. The cathode electrode 23 is secured to a vacuum
`chamber 21 through a RF insulating material 24. Further, the
`cathode electrode 23 is connected through RF introducing
`pipe 25 and a blocking condenser 26 with RF electric power
`27. Further, an anode electrode 28 with the same curved
`shape as that of the cathode electrode 23 is arranged over the
`cathode electrode 23 leaving the same space between the
`surface of the anode electrode 28 and the surface of the
`cathode electrode 23. Further, working gas is introduced into
`the vacuum chamber 21 through gas introducing pipe 29 and
`through a plurality of shower electrodes 28a. Further, anode
`electrode 28 and vacuum chamber 21 are electrically
`grounded. The radius of curvature of cathode electrode 23
`depends upon a size of laminate of substrate. Concretely, the
`above-mentioned radius of curvature is the minimum radius
`of curvature, which corresponds to 9% of the minimum side
`at which a laminate to be worked can be curved.
`Although the structure for generating plasma shown here
`is a cathode coupling system, the anode coupling system in
`which RF is applied to anode electrode 28, or the hollow
`cathode system in which RF is applied alternately to cathode
`electrode 23 and to anode electrode 28 may be used. Further,
`although cathode electrode 23 is connected here with RF
`electric power 27 through blocking power 27, cathode
`electrode 23 may be connected directly with RF electric
`power 27. Further, even if the distance between cathode
`electrode 23 and anode electrode 28 may vary somewhat
`according to places, its effect is very changed.
`If etching is carried out by means of the plasma etching
`system shown in FIG. 6, the phenomenon of laminate 1
`being curved disappears by holding down the laminate 1
`itself by empty weight thereof and by the action of elasticity
`thereof which makes efforts to keep parallelism, so that the
`laminate 1 is brought into close contact with cathode elec
`trode 23. In such a way, the phenomenon of the laminate 1
`being curved disappears by using a cathode electrode with a
`concave portion at the center of electrode, in which a
`laminate to be worked is put on the electrode so that the
`phenomenon of laminate 1 being curved disappears by
`holding down the laminate 1 itself by empty weight thereof
`and by the action of elasticity thereof which makes efforts to
`keep parallelism. Accordingly, the local distribution of tem
`perature is decreased so that working at high throughput
`becomes possible. In this case, the shape of cathode elec
`trode 23 may be formed into a convex shape, in which the
`shape of anode electrode 28 is concave. However, the shape
`of cathode electrode 23 is desirably concave.
`In addition to the above-mentioned content, only a part of
`laminate 1 may be pressed complementarily and physically,
`or laminate 1 may be pressed by electrostatic method.
`A concrete example of working condition of plasma
`etching made using the plasma etching system shown in
`FIG. 6 is as follows: the pressure of etching gas is 2-80 Pa.
`Components of etching gas are oxygen as the main
`component, and 5-40% of CF4. Further, 1-15% of Nitrogen
`may be added as needed. Further, additive gas such as NF3,
`CHF3, SF6 can be used instead of CF4. The flow rate of
`etching gas is 30–3000 sccm. The more the flow rate of
`etching gas, the higher the etching rate shows a tendency to
`be. However, even if the etching gas is added over the given
`
`HUTCHINSON EXHIBIT 1009
`
`

`

`US 6,942,817 B2
`
`7
`amount, the vacuum chamber becomes saturated with the
`etching gas. Therefore, the amount of etching gas is pref-
`erably adjusted to the exhaust capacity of the plasma etching
`system. Further, power is 0.1~2 W/cmz.
`After plasma-etching, as resist layers 7, 8 for working
`insulating layer used as mask are removed, working of
`insulating layer 3 is finished. The step of after working of
`insulating layer is in the same manner as that explained in
`the first method of the present invention.
`The Method (3) of the Present Invention
`In the third method of the present invention, a wireless
`suspension blank is made through the steps shown in FIG.
`8 using a two-layer laminate composed of a metallic layer
`with the spring property and an electrically insulating layer.
`Namely, first, the step for forming of a wiring part is carried
`out in Step 1 (SI), and then the step for working the metallic
`layer is carried out in Step 2 ($2) and the step for working
`the insulating layer in Step 3 (S3).
`The step 1 is a first step in which a metal such as copper
`is plated on an insulating layer such as polyimide resin
`laminated on a metallic layer by the semi-additive method.
`The step 2 is a second step in which the metallic layer such
`as stainless steel positioned on one side of the two-layer
`laminate is worked by the wet-etching method. The follow-
`ing step is a third step in which the insulating layer is worked
`by the dry etching method or the wet etching method. These
`three steps are carried out
`in order so that a wireless
`suspension blank is made.
`In such a manner,
`in the third method of the present
`invention, first, a wiring part is formed on an insulating
`layer, before a metallic layer and polyimide resin layer are
`worked. Accordingly, uniform under coating can be easily
`formed on the laminate. Further, a wiring part can be formed
`minutely.
`FIGS. 9 through 11 is the production drawings showing
`the productive procedure of a wireless suspension blank for
`HDD. The individual steps are explained in order. FIG. 9(a)
`shows a laminate 11 for forming a wireless suspension blank
`for HDD. The laminate 11 is the same one as that explained
`in the first method,
`in which an insulating layer 13 is
`laminated on stainless steel as a metallic layer 12 with the
`spring property, the insulating layer 13 being composed of
`polyimide resin film as a core insulating layer and adhesive
`layer. The metallic layer 12 is laminated through the adhe-
`sive layer on the polyimide film.
`A concrete example thereof is as follows: in the same
`manner as that explained about the first method, polyimide
`resin film with thickness of 12.5 um (“APIKAL NPI”
`manufactured by Kanegafuchi Chemical Co., Ltd.) is used
`as a core insulating layer; polyimide varnish (“EN-20”
`manufactured by Shin Nippon Rika Co., Ltd.) as adhesive
`layer is applied on the polyimide resin film in such a manner
`as the thickness of film of after having been dried comes to
`2.5103 um, so that a film with an adhesive layer (insulating
`layer 13) is formed. The film with adhesive layer is lami-
`nated with stainless steel foil (“304HTA foil” manufactured
`by Shin Nippon Steel Corporation). Thereafter, pressure of
`1 MPa is applied to the laminate of the film with adhesive
`layer and stainless steel at 300° C. for 10 min in a vacuum
`to form a two-layer laminate 11.
`First, a wiring part is formed on the laminate 11. For this,
`first, as shown In FIG. 9(b), under coating 14 for a wiring
`part is formed on an insulating layer 13, in which the under
`coating is formed by sputtering, chemical plating and others.
`A concrete example thereof is as follows: dry film resists
`(“AQ-5038” manufactured by Asahi Chemical Co., Ltd.) are
`laminated on both side of the laminate 11 at 100° C.; and a
`
`10
`
`15
`
`20
`
`25
`
`30
`
`35
`
`40
`
`45
`
`50
`
`55
`
`60
`
`65
`
`8
`resist laminated on the lower face of the stainless steel is
`
`exposed through a given mask pattern to light. The exposure
`is carried out by g-rays with the exposure of 30~60 mJ/cm2
`to form a resist pattern. The development is carried out by
`spraying 1 wt % of Na2CO3 solution on the exposed resist
`at 30° C. Dry film resist
`is preferably used as resist.
`However, liquid resist such as casein can be used.
`Then, a pattern of additive copper forming a wiring part
`16 is formed by using under coating 14 formed on insulating
`layer 13, as shown in FIG.,
`Thereafter, dry film resist
`15 is removed from the laminate, and then exposed portions
`of under coating 14 are etched to remove, by which wiring
`part 16 is formed on insulating layer 13, as shown in FIG.
`9(e).
`After wiring part 13 has been formed on insulating layer
`13, the working of metallic layer 12 positioned on the lower
`side of the insulating layer 13 is carried out. For this, first,
`as shown in FIG. 10(a), dry film resist 17, 18 are laminated
`on both sides of the laminate 11. Therefore, resist 18 is
`laminated on the lower face of the metallic layer 12.
`A concrete example thereof is as follows:
`in the same
`manner as above-mentioned, dry film resists (“AQ-5038”
`manufactured by Asahi Chemical Co., Ltd.) are laminated
`on both sides of the laminate at 100° C.; thereafter, resist
`laminated on the lower face of stainless steel is exposed
`through a given mask pattern to light and developed to form
`a pattern, in which the exposure is carried out by g-rays with
`the exposure of 30~60 mJ/cm2, and the development is
`carried out by spraying 1 wt % of Na2CO3 on the resist at
`30° C. Dry film resist is preferably used as resist. However,
`liquid resist such as casein can be also used as resist.
`Thereafter, as shown in FIG. 10(b), one side of stainless
`steel is etched with general etc

This document is available on Docket Alarm but you must sign up to view it.


Or .

Accessing this document will incur an additional charge of $.

After purchase, you can access this document again without charge.

Accept $ Charge
throbber

Still Working On It

This document is taking longer than usual to download. This can happen if we need to contact the court directly to obtain the document and their servers are running slowly.

Give it another minute or two to complete, and then try the refresh button.

throbber

A few More Minutes ... Still Working

It can take up to 5 minutes for us to download a document if the court servers are running slowly.

Thank you for your continued patience.

This document could not be displayed.

We could not find this document within its docket. Please go back to the docket page and check the link. If that does not work, go back to the docket and refresh it to pull the newest information.

Your account does not support viewing this document.

You need a Paid Account to view this document. Click here to change your account type.

Your account does not support viewing this document.

Set your membership status to view this document.

With a Docket Alarm membership, you'll get a whole lot more, including:

  • Up-to-date information for this case.
  • Email alerts whenever there is an update.
  • Full text search for other cases.
  • Get email alerts whenever a new case matches your search.

Become a Member

One Moment Please

The filing “” is large (MB) and is being downloaded.

Please refresh this page in a few minutes to see if the filing has been downloaded. The filing will also be emailed to you when the download completes.

Your document is on its way!

If you do not receive the document in five minutes, contact support at support@docketalarm.com.

Sealed Document

We are unable to display this document, it may be under a court ordered seal.

If you have proper credentials to access the file, you may proceed directly to the court's system using your government issued username and password.


Access Government Site

We are redirecting you
to a mobile optimized page.





Document Unreadable or Corrupt

Refresh this Document
Go to the Docket

We are unable to display this document.

Refresh this Document
Go to the Docket