Petition for Inter Partes Review
`U.S. Patent No. 8,530,250
`
`UNITED STATES PATENT AND TRADEMARK OFFICE
`____________________________
`
`BEFORE THE PATENT TRIAL AND APPEAL BOARD
`____________________________
`
`LOWE’S COMPANIES, INC.,
`LOWE’S HOME CENTERS, LLC AND L G SOURCING, INC.,
`Petitioners
`
`v.
`
`NICHIA CORPORATION
`Patent Owner
`
`_____________________________
`
`U.S. Patent No.: 8,530,250
`Issue Date: September 10, 2013
`Title: Light Emitting Device, Resin Package, Resin-Molded
`Body, and Methods For Manufacturing Light Emitting
`Device, Resin Package and Resin-Molded Body
`Attorney Docket No.: 01320083.000012
`_____________________________
`
`MAIL STOP PATENT BOARD
`Patent Trial and Appeal Board
`United States Patent and Trademark Office
`Post Office Box 1450
`Alexandria, Virginia 22313-1450
`
`PETITION FOR INTER PARTES REVIEW OF
`UNITED STATES PATENT NO. 8,530,250
`
`

`

`Petition for Inter Partes Review
`U.S. Patent No. 8,530,250
`
`TABLE OF CONTENTS
`
`INTRODUCTION .......................................................................................... 1
`I.
`II. MANDATORY NOTICES (37 C.F.R. §42.8) ............................................... 1
`A.
`Real Parties-in-Interest Under 37 C.F.R. § 42.8(b)(1): ........................ 1
`B.
`Related Matters Under 37 C.F.R. § 42.8(b)(2): ................................... 1
`C.
`Lead and Back-Up Counsel Under 37 CFR § 42.8(b)(3): ................... 3
`D.
`Service Information .............................................................................. 4
`III. REQUIREMENTS FOR IPR UNDER 37 C.F.R. § 42.104 ........................... 4
`A. Grounds for Standing Under 37 C.F.R. §42.104(a) ............................. 4
`B.
`Challenge under 37 C.F.R. 42.104(b); Relief Requested..................... 4
`C.
`Claim Construction under 37 C.F.R. § 42.104(b)(3) ........................... 6
`D.
`Person of Ordinary Skill in the Art ...................................................... 7
`IV. SUMMARY OF THE ’250 PATENT ............................................................ 7
`V.
`’250 PATENT PROSECUTION HISTORY................................................ 10
`VI. DETAILED REASONS FOR RELIEF ........................................................ 11
`A.
`Claims 1, 2, 7, 11, 12, 15-17, 19 and 21 are obvious ......................... 11
`1.
`Japanese Patent Publication No. 2006-093697 (“Park
`’697”) ....................................................................................... 11
`PCT Patent Publication No. WO 2007/055486 (“Park
`’486”) ....................................................................................... 17
`Japanese Patent Publication No. JP2007-235085
`(“Urasaki”) ............................................................................... 20
`U.S. Patent Publication No. 2007/0126020 (“Lin”) ................ 22
`4.
`U.S. Patent Publication No. 2005/0280017 (“Oshio”) ............ 25
`5.
`U.S. Patent Publication No. 2008/0261339 (“Koung”) ........... 26
`6.
`7. Motivation to Combine Park ’697 with Park ’486 .................. 28
`8. Motivation to Combine Park ’697 with Urasaki ...................... 30
`9. Motivation to Combine Park ’697 with Lin............................. 31
`10. Motivation to Combine Park ’697 with Oshio ........................ 33
`11. Motivation to Combine Park ’697 with Koung ....................... 36
`
`3.
`
`2.
`
`ii
`
`

`

`Petition for Inter Partes Review
`U.S. Patent No. 8,530,250
`Claim Charts for Grounds 1-24 (see also Ex. 1003 ¶¶ 95-161) ......... 37
`B.
`VII. CONCLUSION ............................................................................................. 86
`
`iii
`
`

`

`Petition for Inter Partes Review
`U.S. Patent No. 8,530,250
`
`LIST OF EXHIBITS
`
`Ex. 1005
`Ex. 1006
`Ex. 1007
`
`Ex. 1008
`Ex. 1009
`Ex. 1010
`
`Ex. 1011
`
`Ex. 1012
`Ex. 1013
`Ex. 1014
`
`Exhibit No. Description
`Ex. 1001
`U.S. Patent No. 8,530,250
`Ex. 1002
`U.S. Patent No. 8,530,250 File Wrapper
`Ex. 1003
`Declaration of Dr. Stanley R. Shanfield, Ph.D.
`Ex. 1004
`Japanese Patent Pub. No. 2006-093697 (“Park ’697”) with Certified
`English Translation
`U.S. Patent Pub. No. 2008/0261339 (“Koung”)
`PCT Patent Pub. No. WO2007/055486 (“Park ’486”)
`Japanese Patent Pub. No. JP2007-235085 (“Urasaki”) with
`Certified English Translation
`U.S. Patent Pub. No. 2005/0280017 (“Oshio”)
`U.S. Patent Pub. No. 2007/0126020 (“Lin”)
`Japanese Patent Pub. No. JP2001-036154 (“Suenaga”) with
`Certified English Translation
`Japanese Patent Pub. No. JP2006-156704 (“Kuramoto”) with
`Certified English Translation
`U.S. Patent Pub. No. 2005/0151149 (“Chia”)
`U.S. Patent Pub. No. 2008/0073662 (“Wang”)
`Nichia Corp. v. Everlight Elecs. Co., No. 2:13-cv-702, D.I. 79,
`Claim Construction Memorandum Opinion and Order (E.D. Tex.
`Dec. 12, 2014).
`Nichia Corp. v. Everlight Ams., Inc., Nos. 2016-1585, 2016-1618,
`D.I.52, Opinion and Judgment (Fed. Cir. Apr. 28, 2017).
`
`Ex. 1015
`
`iv
`
`

`

`Petition for Inter Partes Review
`U.S. Patent No. 8,530,250
`
`TABLE OF AUTHORITIES
`
`FEDERAL CASES
`Blue Coat Systems, Inc. v. Finjan, Inc.,
`No. IPR2016-00480, Paper 9 (PTAB Jun. 24, 2016) ........................................... 2
`
`Page(s)
`
`Dell, Inc. v. Network-1 Sec. Sols., Inc.,
`No. IPR2013-00385, Paper 17 (PTAB July 29, 2013) ......................................... 3
`
`In re Cuozzo Speed Techs., LLC,
`136 S. Ct. 2131 (2016) .......................................................................................... 6
`
`Nichia Corp. v. Everlight Elecs. Co., Ltd. et al.,
`No. 2:13-cv-702-JRG (E.D. Tex.) ........................................................................ 2
`
`Nichia Corporation v. Lowe’s Companies, Inc. et al.
`No. 2:16-cv-00613-JRG (E.D. Tex.) .................................................................... 1
`
`FEDERAL STATUTES
`
`35 U.S.C. § 102(b) ..................................................................................................... 6
`
`35 U.S.C. §§ 102 (b), (a) .............................................................................. 11, 17, 20
`
`35 U.S.C. §§ 102 (b), (a), and (e) ...................................................................... 22, 25
`
`35 U.S.C. § 102(e) ............................................................................................... 6, 26
`
`35 U.S.C. §§ 311-319................................................................................................. 1
`
`REGULATIONS
`
`37 C.F.R. § 42 ............................................................................................................ 1
`
`37 C.F.R. § 42.8 ......................................................................................................... 1
`
`37 C.F.R. § 42.100(b) ................................................................................................ 6
`
`37 C.F.R. § 42.104 ..................................................................................................... 4
`
`37 C.F.R. § 42.104(b)(3) ............................................................................................ 6
`
`37 CFR § 42.8(b)(3) ................................................................................................... 3
`
`v
`
`

`

`OTHER AUTHORITIES
`
`MPEP § 2111 ............................................................................................................. 6
`
`Petition for Inter Partes Review
`U.S. Patent No. 8,530,250
`
`vi
`
`

`

`Petition for Inter Partes Review
`U.S. Patent No. 8,530,250
`
`I.
`
`INTRODUCTION
`
`Pursuant to 37 C.F.R. § 42 and 35 U.S.C. §§ 311-319, Lowe’s Companies,
`
`Inc., Lowe’s Home Centers, LLC and L G Sourcing, Inc. (collectively
`
`“Petitioners”) petition for Inter Partes Review (“IPR”) of claims 1, 2, 7, 11, 12, 15-
`
`17, 19 and 21 (the “Claims”) of U.S. Patent No. 8,530,250 (the “’250 Patent”).
`
`Review should be instituted because there is reasonable likelihood Petitioner will
`
`prevail on at least one challenged claim.
`
`II. MANDATORY NOTICES (37 C.F.R. § 42.8)
`
`A.
`
`Real Parties-in-Interest Under 37 C.F.R. § 42.8(b)(1):
`
`Lowe’s Companies, Inc., Lowe’s Home Centers, LLC and L G Sourcing,
`
`Inc. (collectively “Lowe’s” or “Petitioners”), Zhejiang Yankon Group Co., Ltd.
`
`(“Yankon”), Zoren Industries (“Zoren”), and Litetronics International, Inc.
`
`(“Litetronics”) are real parties-in-interest.
`
`B.
`
`Related Matters Under 37 C.F.R. § 42.8(b)(2):
`
`Nichia Corporation (“Patent Owner” or “PO”) asserted claims 1, 2, 7, 11, 12,
`
`15-17, 19 and 21 against Petitioners in Nichia Corporation v. Lowe’s Companies,
`
`Inc. et al. No. 2:16-cv-00613-JRG (E.D. Tex.), consolidated with Nos. 2:16-cv-
`
`01453-JRG (lead), 2:16-cv-00246-JRG, 2:16-cv-00613-JRG, 2:16-cv-00615-JRG,
`
`2:16-cv-00616-JRG, 2:16-cv-875-JRG, 2:16-cv-01452-JRG, 2:16-cv-01451-JRG,
`
`2:16-cv-01455-JRG (in which PO asserted the ’250 Patent against other
`
`1
`
`

`

`Petition for Inter Partes Review
`U.S. Patent No. 8,530,250
`defendants). PO also asserted the ’250 Patent in Nichia Corp. v. Everlight Elecs.
`
`Co., Ltd. et al., No. 2:13-cv-702-JRG (E.D. Tex.); Appeal Nos. 16-1585, 16-1618
`
`(Fed. Cir.).
`
`Petitioners have also contemporaneously filed another petition for IPR,
`
`which relies on a different primary reference (U.S. Patent Pub. No. 2008/0261339
`
`(“Koung”)) and raises different grounds as to the obviousness of the Claims.
`
`Accordingly, Petitioners respectfully request institution on the grounds set forth in
`
`both petitions.
`
`VIZIO Inc. has recently filed separate petitions for inter partes review of the
`
`’250 Patent (IPR2017-01608 and IPR2017-01623 (“VIZIO IPR Proceedings”),
`
`which challenge only some of the claims addressed herein. Petitioners have
`
`utilized portions of the publically-available materials filed in the VIZIO IPR
`
`Proceedings in its Petitions. Petitioners have also retained technical expert Dr.
`
`Stanley R. Shanfield, Ph.D., who also provided expert testimony in the VIZIO IPR
`
`Proceedings. See Ex. 1003 ¶ 3. Although Petitioners have added additional
`
`arguments and made various edits, Petitioners hope that use of Vizio analyses
`
`(rather than pointless rewording of analyses of the same elements of the same prior
`
`art references) will help facilitate review of this Petition, at least for those claims
`
`that are also challenged in the Vizio Petitions. Blue Coat Systems, Inc. v. Finjan,
`
`2
`
`

`

`Petition for Inter Partes Review
`U.S. Patent No. 8,530,250
`Inc., No. IPR2016-00480, Paper 9 at 2-6 (PTAB Jun. 24, 2016) (Petition was
`
`“practically a copy of [a different entity’s] petition with respect to the proposed
`
`grounds, including the same analysis of the prior art and expert testimony” and
`
`instituting IPR and granting joinder request “[i]n view of the identity of the
`
`challenge in the instant Petition and in the petition [of the other entity]”), Dell, Inc.
`
`v. Network-1 Sec. Sols., Inc., No. IPR2013-00385, Paper 17 at p. 6 (PTAB July 29,
`
`2013)
`
`(granting petition and joinder request where petition used identical
`
`arguments and same expert and arguments as another entity).
`
`Half of the claims challenged in this Petition (claims 2, 11, 12, 15, and 16)
`
`were not challenged in either of the Vizio Petitions. All these claims have been
`
`asserted against Lowe’s in the above-identified Texas litigation. This Petition
`
`accordingly provides numerous grounds for invalidity, and uses prior art (Lin
`
`reference), not found in either of the Vizio Petitions. The Director, pursuant to §
`
`315(d), may determine after institution of both of Petitioners’ IPR petitions that
`
`consolidation of these proceeding with the VIZIO IPR Proceedings may be
`
`appropriate, or may at minimum decide to coordinate the schedules of the
`
`proceedings.
`
`C.
`
`Lead and Back-Up Counsel Under 37 C.F.R. § 42.8(b)(3):
`
`Lead Counsel
`Scott D. Stimpson, (Reg. No. 33,607)
`
`Back-Up Counsel
`Tod Melgar, (Reg. No. 41,190)
`
`3
`
`

`

`SILLS CUMMIS & GROSS P.C.
`101 Park Avenue, 28th Floor
`New York, New York 10178
`Tel: (212) 500-1550
`Fax: (212) 643-6500
`sstimpson@sillscummis.com
`
`D.
`
`Service Information
`
`Petition for Inter Partes Review
`U.S. Patent No. 8,530,250
`SILLS CUMMIS & GROSS P.C.
`101 Park Avenue, 28th Floor
`New York, New York 10178
`Tel: (212) 500-1519
`Fax: (212) 643-6500
`tmelgar@sillscummis.com
`
`Please address all correspondence and service to both counsel listed above.
`
`Petitioners consent to service by email at sstimpson@sillscummis.com.
`
`III. REQUIREMENTS FOR IPR UNDER 37 C.F.R. § 42.104
`
`A.
`
`Grounds for Standing Under 37 C.F.R. § 42.104(a)
`
`Petitioners certify that IPR is available for the ’250 Patent and that
`
`Petitioners are not barred or estopped from requesting IPR. Petitioners were
`
`served with a complaint asserting infringement of the ’250 Patent on or after
`
`August 30, 2016. Neither Petitioners nor any other real party-in-interest or privy
`
`was served with a complaint before that date or has initiated a civil action
`
`challenging the ’250 Patent’s validity.
`
`Challenge under 37 C.F.R. 42.104(b); Relief Requested
`B.
`Petitioner requests inter partes review of claims 1, 2, 7, 11-12, 15-17, 19 and
`
`21 on the grounds in the table below and requests that each of the Claims be found
`
`invalid. A detailed explanation of why the Claims are invalid is provided below in
`
`Part VI.
`
`4
`
`

`

`Petition for Inter Partes Review
`U.S. Patent No. 8,530,250
`Claims Challenged
`Basis
`§ 103 1, 2, 7, 11, 12, 15-17,
`19, 21
`§ 103 1, 2, 7, 11, 12, 15-17,
`19, 21
`§ 103 1, 2, 7, 11, 12, 15-17,
`19, 21
`§ 103 1, 2, 7, 11, 12, 15-17,
`19, 21
`§ 103 1, 2, 7, 11, 12, 15-17,
`19, 21
`§ 103 1, 2, 7, 11, 12, 15-17,
`19, 21
`§ 103 1, 2, 7, 11, 12, 15-17,
`19, 21
`§ 103 1, 2, 7, 11, 12, 15-17,
`19, 21
`§ 103 2, 11, 15-16
`§ 103 2, 11, 15-16
`§ 103 2, 11, 15-16
`§ 103 2, 11, 15-16
`§ 103 2, 11, 15-16
`§ 103 2, 11, 15-16
`§ 103 2, 11, 15-16
`
`§ 103 2, 11, 15-16
`
`Ground
`1
`
`Prior Art References
`Park ’697
`
`Park ’697 and Oshio
`
`Park ’697 and Park ’486
`
`Park ’697 and Urasaki
`
`Park ’697, Park ’486 and Oshio
`
`Park ’697, Urasaki and Oshio
`
`Park ’697, Park ’486 and Urasaki
`
`2
`
`3
`
`4
`
`5
`
`6
`
`7
`
`8
`
`9
`10
`11
`12
`13
`14
`15
`
`16
`
`17
`18
`19
`20
`21
`
`22
`23
`
`24
`
`Park ’697, Oshio, Park ’486, and
`Urasaki
`Park ’697 and Lin
`Park ’697, Oshio and Lin
`Park ’697, Park ’486 and Lin
`Park ’697, Urasaki and Lin
`Park ’697, Park ’486, Oshio and Lin
`Park ’697, Urasaki, Oshio and Lin
`Park ’697, Park ’486, Urasaki and
`Lin
`Park ’697, Oshio, Park ’486, Urasaki
`and Lin
`Park ’697 and Koung
`Park ’697, Oshio and Koung
`Park ’697, Park ’486 and Koung
`Park ’697, Urasaki and Koung
`Park ’697, Park ’486, Oshio and
`Koung
`Park ’697, Urasaki, Oshio and Koung § 103 12
`Park ’697, Park ’486, Urasaki and
`§ 103 12
`Koung
`Park ’697, Oshio, Park ’486, Urasaki
`and Koung
`
`§ 103 12
`§ 103 12
`§ 103 12
`§ 103 12
`§ 103 12
`
`§ 103 12
`
`5
`
`

`

`Petition for Inter Partes Review
`U.S. Patent No. 8,530,250
`The ’250 Patent claims a priority date of September 3, 2008. Accordingly,
`
`the Claims are allegedly entitled to a priority date no earlier than this date. Each of
`
`the referenced prior art qualified as prior art under 35 U.S.C. § 102(b) and/or §
`
`102(e).
`
`§ VI.B below provides charts specifying how the prior art renders the Claims
`
`obvious.
`
`C.
`
`Claim Construction under 37 C.F.R. § 42.104(b)(3)
`
`In accordance with 37 C.F.R. § 42.100(b), the challenged claims must be
`
`given their broadest reasonable interpretations in light of the specification of the
`
`’250 Patent.
`
`For purposes of this review, Petitioners interpret all terms according to their
`
`plain and ordinary meaning under the required broadest reasonable interpretation
`
`consistent with the specification, as understood by one of ordinary skill in the art
`
`and consistent with the disclosure. Because the standard for claim construction for
`
`unexpired patents at the PTO is different from that used in litigation, see In re
`
`Cuozzo Speed Techs., LLC, 136 S. Ct. 2131, 2146 (2016); MPEP § 2111,
`
`Petitioners expressly reserve the right to argue in litigation a different claim
`
`construction for any term, as appropriate to that proceeding and to assert that the
`
`claims are invalid for reasons other than those for which any resulting estoppel
`
`might apply, including under §§ 101 and/or 112.
`
`6
`
`

`

`Petition for Inter Partes Review
`U.S. Patent No. 8,530,250
`
`D.
`
`Person of Ordinary Skill in the Art
`
`A person of ordinary skill in the art (“POSITA”) circa the priority date of the
`
`’250 Patent (i.e., September 3, 2008), would have a minimum of a Bachelor’s
`
`degree in Physics, Electrical Engineering, Material Science, or a related field, and
`
`approximately 5 years of professional experience in the field of semiconductor
`
`technology, including manufacturing and packaging processes for light emitting
`
`devices. Ex. 1003 ¶¶ 17-19. Additional graduate education could substitute for
`
`professional experience, or significant experience in the field could substitute for
`
`formal education. A POSITA is presumed to have knowledge of all relevant prior
`
`art, and would thus have been familiar with each of the references cited herein, as
`
`well as the background knowledge in the art, and the full range of teachings they
`
`contain. Id.
`
`IV.
`
`SUMMARY OF THE ’250 PATENT
`
`The ’250 Patent is directed to a “simple and low cost method for
`
`manufacturing . . . light emitting devices”. Ex. 1001 at 2:49-51; see generally Ex.
`
`1003 ¶¶ 39-44. In particular, the ’250 Patent describes a lead frame (shown in
`
`blue) that can be made from “a metal plate of a flat plate shape” or “a metal plate
`
`in which differences in level or concavity and convexity are provided.” Id. at 8:46-
`
`48, Fig. 7. The lead may include a step. Id. at 4:18-20, 13:7-11, 14:37-45, 14:64-
`
`15:2, 15:36-45, 16:8-16, 16:46-50, Figs. 6, 9-13. The ’250 Patent discloses “notch
`
`7
`
`

`

`Petition for Inter Partes Review
`U.S. Patent No. 8,530,250
`parts” (shown in red) that “penetrate the lead frame” to provide “positive and
`
`negative leads . . . when the resin-molded body is singulated” and reduce “the area
`
`for cutting the leads.” Id. at 9:7-15, see also, e.g., id. at 3:29-40, Figs. 5, 7, 10.
`
`Id., at Fig. 7.
`
`The ’250 Patent further discloses, after plating the lead frame (id. at 3:21-28,
`
`8:6-11, 9:22-28, and 11:62-67), the “sandwiching the lead frame” using “an upper
`
`mold 61 and a lower mold 62” (lead frame is shown in blue and molds are shown
`
`in purple) and “transfer-molding a thermosetting resin 23 containing the light
`
`reflecting material 26…to form a resin- molded body 24 in the lead frame 21”
`
`(resin-molded body is shown in green). Id. at 11:5-12, Fig. 4; see also id. at
`
`Abstract, 3:1-9, 4:25-36, 11:5-14, 12:7-20. The thermosetting resin is filled in the
`
`notch parts. Id. at 3:8-12; see also 4:36-41; 8:15-23, 12:51-57, 17:29-30. The
`
`8
`
`

`

`Petition for Inter Partes Review
`U.S. Patent No. 8,530,250
`upper mold features convex parts to form corresponding concave parts in the resin-
`
`molded body. Id. at 5:7-9, 7:60-61, and Fig. 4. After the resin-mold body is
`
`formed, a “light emitting element 10 is placed on the lead frame 21 of the inner
`
`bottom surface 27a of the concave part 27”, as shown in orange below. Id. at
`
`12:27-29.
`
`Id. at Fig. 4.
`
`After transfer-molding, the ’250 Patent describes separating or “singulation”
`
`of the resin- molded body (shown in green) and lead frame (shown in blue) into
`
`9
`
`

`

`Petition for Inter Partes Review
`U.S. Patent No. 8,530,250
`individual packages whereby “the resin-molded body 24 and lead frame 21 are cut
`
`along the notch parts 21a.” Id. at 12:40-46; see also id. at 2:63-3:9, 4:25-36, Figs.
`
`5-7, 10. Through the cutting step, “the resin-molded body 24 and lead frame 21
`
`are in the substantially same plane.” Id. at 12:47-49, 7:49-52.
`
`Id. at Fig. 6.
`
`V.
`
`’250 PATENT PROSECUTION HISTORY
`
`The application leading to the ’250 Patent was filed March 2, 2011 as U.S.
`
`Pat. App. No. 12/737,940 (“’940 application”), claiming priority to JP2008-
`
`225408, filed September 3, 2008. See generally Ex. 1003 ¶¶ 45-48. The Examiner
`
`rejected all prosecution claims as unpatentable over combinations of
`
`WO2008/059856 (“Kotani”), U.S. Pat. Pub. No. 2007/0138697 (“Takeda”), U.S.
`
`Pat. Pub. No. 2005/0151149 (“Chia”) (Ex.1012) and U.S. Pat. Pub. No.
`
`10
`
`

`

`Petition for Inter Partes Review
`U.S. Patent No. 8,530,250
`2002/0028525 (“Sakamoto”). Ex. 1002 at 488-492. The Examiner found it would
`
`have been obvious to “include a plurality of concave portions” Id. at 490. The
`
`Examiner found Chia discloses providing a “step on the bottom of the lead frame”
`
`and “the lead includes two different levels.” Id. at 491.
`
`On February 28, 2013, Applicants submitted remarks and amended claim 1
`
`to include the additional limitations of “plating the lead frame…wherein the plated
`
`lead frame is cut so as to form an unplated outer side surface on the lead.” Id. at
`
`656, 655-658. Regarding original claims 1 and 7 (now claims 1 and 17),
`
`Applicants acknowledged Takeda discloses plating before molding, but argued
`
`Takeda “does not suggest a method in which ‘the plated lead frame is cut so as to
`
`form an unplated outer side surface on the lead.’” Id. at 664. On May 13, 2013,
`
`the claims were allowed. Id. at 674-79.
`
`VI. DETAILED REASONS FOR RELIEF
`
`There is at least a reasonable likelihood Petitioner will prevail with respect
`
`to at least one of the Claims, § 314(a), as all are invalid under § 103.
`
`A.
`
`Claims 1, 2, 7, 11, 12, 15-17, 19 and 21 are obvious
`
`1.
`
`Japanese Patent Publication No. 2006-093697 (“Park ’697”)
`
`Park ’697 (Ex. 1004) published April 6, 2006, making it prior art under at
`
`least 35 U.S.C. §§ 102 (b), (a). Park ’697 discloses providing a silver-plated lead
`
`frame with anode lead 5 and a cathode lead 4 (shown in blue) having notches
`
`(shown in red), transfer-molding a thermosetting resin containing a light reflecting
`
`11
`
`

`

`Petition for Inter Partes Review
`U.S. Patent No. 8,530,250
`material on the lead frame to form a resin-molded body (shown in green), and
`
`cutting (shown in red) the lead frame and resin-molded body to form
`
`individualized LED packages comprising a resin part and two leads. See e.g., Ex.
`
`1004 at Abstract, ¶¶ 11-13, Fig. 5; see generally Ex. 1003 ¶¶ 61-68. The leads
`
`include a step on an outer surface and have different levels. See, e.g., id. at Figs.
`
`1(b), 3(b), 4(b), 5.
`
`Id. at Fig. 5.
`
`Park ’697 further discloses “forming a transfer mold type reflector with a
`
`white thermosetting resin” on the “silver plated lead frame.” See, e.g., id. ¶ 12.
`
`Transfer-molding is performed using a thermosetting resin 9 containing TiO2,
`
`which is a light reflecting (i.e., “white”) material. See, e.g., id. ¶ 13. The resin-
`
`molded body forms a plurality of concave portions comprising an inner bottom
`
`12
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`Petition for Inter Partes Review
`U.S. Patent No. 8,530,250
`surface at which a portion of the lead frame is exposed. See e.g., id. at Figs. 1(a),
`
`1(c), 3(a), 3(c), 4(a), 4(c), 7.
`
`Id. at Fig. 7.
`
`Id. at Fig. 1(c).
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`13
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`Petition for Inter Partes Review
`U.S. Patent No. 8,530,250
`Park ’697 discloses “finally performing a sawing or a trimming process”
`
`(shown in red) to cut the lead frame and resin-molded body and “singulate” or
`
`“individualize” the light emitting device where an outer surface of the resin part
`
`and an outer side surface of the leads are planar at an outer side surface of the resin
`
`package. See, e.g., id. ¶¶ 1, 12, Figs. 5, 1(a), 3(a), 4(a). Because Park ’697
`
`discloses cutting after plating the lead frame, the cut-side of the lead is unplated.
`
`Id.; see also Ex. 1003 ¶ 64.
`
`Ex. 1004 at Fig. 1(a).
`
`Park ’697 additionally discloses a “light-emitting diode chip” 10 (shown in
`
`orange) mounted in a concave portion of the resin package. See, e.g., Ex. 1004 ¶
`
`12. A portion of the resin part is disposed over a portion of the plating on the upper
`
`surface of the lead. See, e.g., id. at Figs. 1(a), 1(c), 3(a), 3(c), 4(a), 4(c), 7.
`
`14
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`Petition for Inter Partes Review
`U.S. Patent No. 8,530,250
`
`Id. at Fig. 1(b).
`
`Park ’697 discloses a first set of notches which separate a first lead and a
`
`second lead (indicated in red) and a second set of notches, oriented horizontally
`
`and vertically, along which the package is cut from the lead frame (indicated in
`
`green). Ex. 1004 at Figs. 5 and 6; Ex. 1003 ¶ 66.
`
`15
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`

`

`Second Set of Notches
`(horizontal and vertical)
`
`Petition for Inter Partes Review
`U.S. Patent No. 8,530,250
`
`Cathode Lead (4)
`
`Anode Lead (5)
`
`First Set of Notches
`
`Second Set of Notches
`(horizontal and vertical)
`
`First Set of Notches
`
`Park ’697 further discloses a length of an exposed portion of the at least one
`
`lead around a periphery of the resin package is less than or equal to one half a total
`
`16
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`

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`Petition for Inter Partes Review
`U.S. Patent No. 8,530,250
`length of the periphery. See, e.g. Ex. 1004 at Fig. 5; Ex. 1003 ¶ 67.
`
`Cathode Lead (4)
`
`Length of exposed
`portion of leads
`
`Anode Lead (5)
`
`Length of
`periphery
`
`2.
`
`PCT Patent Publication No. WO 2007/055486 (“Park ’486”)
`
`Park ’486 (Ex. 1006) published May 18, 2007, making it prior art under at
`
`least §§ 102 (b) and (a). Park ’486 discloses a lead frame (shown in blue) includes
`
`portions for a cathode lead (e.g., item 111a in Figs. 6-12) and an anode lead (e.g.,
`
`item 111b in Figs. 6-12). See, e.g., Ex. 1006 at 6:2-14, 17:17-20, 18:7-15, Figs. 6-
`
`7, 11-13. The lead frame has notches (shown in red). Id., 17:17-20.
`
`17
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`Petition for Inter Partes Review
`U.S. Patent No. 8,530,250
`
`Id. at Fig. 6.
`
`Park ’486 discloses a reflector (i.e., a resin-molded body, shown in green)
`
`“is formed on the upper and lower parts of the pair of lead frames” that “houses the
`
`LED chip 130” See, e.g., 13:7-11, 12:16- 13:10 17:9-11, Fig. 10,. “Finally, the
`
`lead frame plate and the walls are sawed (S6)” along the “cutting lines C” (shown
`
`in red) and cut into individual packages such that an outer surface of the resin part
`
`and an outer side surface of the at least one lead are planar at an outer side surface
`
`of the resin package. See, e.g., id. at 15:12-16, 16:10-18, Figs. 6-12. Because Park
`
`’486 discloses cutting after plating the lead frame, the side of the lead that is cut is
`
`unplated. Id.; Ex. 1003 ¶ 71.
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`Petition for Inter Partes Review
`U.S. Patent No. 8,530,250
`
`Id. at Fig. 7.
`
`Park ’486 also discloses a length of an exposed portion of the at least one
`
`lead around a periphery of the resin package is less than or equal to one half a total
`
`length of the periphery. See, e.g., Ex. 1006 at Figs. 11-12; Ex. 1003 ¶ 72.
`
`Length of exposed
`portion of leads
`
`Id. at Fig. 11.
`
`Length of
`periphery
`
`19
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`

`Petition for Inter Partes Review
`U.S. Patent No. 8,530,250
`
`Length of exposed
`portion of leads
`
`Length of
`periphery
`
`Id. at Fig. 12.
`
`3.
`
`Japanese Patent Publication No. JP2007-235085 (“Urasaki”)
`
`Urasaki (Ex. 1007) published September 13, 2007, making it prior art under
`
`at least 35 U.S.C. §§ 102 (b) and (a). Urasaki discloses using a lead frame (shown
`
`in blue), and providing an upper mold (shown in purple) on a first surface of the
`
`lead frame and a lower mold (shown in purple) on a second surface of the lead
`
`frame to transfer-mold a thermosetting resin containing a light reflecting material
`
`in a space between the upper mold and the lower mold to form a resin-molded
`
`body (shown in green). Ex. 1007 ¶¶ 17, 23-25, Figs. 1-2. Urasaki further discloses
`
`the upper mold includes a plurality of convex portions to form a resin-molded body
`
`with a plurality of concave portions, wherein each of the concave portions has an
`
`inner bottom surface at which a portion of the lead frame is exposed, and further
`
`provides an optical semiconductor element (shown in orange) in a concave portion
`
`20
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`Petition for Inter Partes Review
`U.S. Patent No. 8,530,250
`of the resin package. Id. ¶¶ 1, 23, 36, 38, Figs. 1-6.. Id. ¶¶ 11, 17, 23, 24, 36-38,
`
`Figs. 1-2. Urasaki additionally discloses cutting to form individual LED packages.
`
`Id. ¶¶ 1, 23, 36, 38, Figs. 1-6.
`
`Id. at Fig. 1.
`
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`Petition for Inter Partes Review
`U.S. Patent No. 8,530,250
`
`Id. at Fig. 2(a).
`
`4.
`
`U.S. Patent Publication No. 2007/0126020 (“Lin”)
`
`Lin (Ex. 1009) published June 7, 2007 and is prior art under at least 35
`
`U.S.C. §§ 102 (b), (a), and (e). Lin discloses a metallic plate that features concave
`
`portion. For example, Lin discloses a metal concaved reflection mirror 103 is
`
`formed on the top surface of the heat sinking seat 102 and beneath the LED chip
`
`150. See, e.g., Ex. 1009 ¶ 29, Figs. 2(d) and 2(f); Ex. 1003 ¶¶ 78-79.
`
`Id. at Fig. 2(f).
`
`Lin describes the process of forming multiple packages wherein the “bases
`
`100 are formed mainly by appropriate means of etching and machinery” and
`
`remaining gaps are filled with an “insulator”, the packages then being “fixat[ed]
`
`and wire bonded” with an LED chip and filled with transparent filler, and
`
`ultimately singulated by cutting. Ex. 1009 ¶¶ 31-33, Fig. 4(g); Ex. 1003 ¶ 79. Lin
`
`further discloses a length of an exposed portion of the at least one lead around a
`
`periphery of the resin package is less than or equal to one half a total length of the
`
`22
`
`

`

`periphery. See, e.g., Ex. 1009 at Fig. 3(a); Ex. 1003 ¶ 79.
`
`Petition for Inter Partes Review
`U.S. Patent No. 8,530,250
`
`Length of exposed
`portion of leads
`
`Id.
`
`Length of
`periphery
`
`Lin discloses the lead frame comprises a plurality of notches, including a
`
`first set of notches and a second set of notches, each of the notches in the first set
`
`of notches is located in a position corresponding to a portion of the resin part that
`
`separates a first lead from a second lead (indicated in red below), and each of the
`
`notches in the second set of notches is a notch orientated horizontally and/or
`
`vertically along which the resin-molded body and the lead frame are cut during the
`
`cutting step (indicated in blue below). See, e.g., Ex. 1009 at Fig. 2(f), 4(c); Ex.
`
`1003 ¶¶ 80-81.
`
`23
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`

`

`Petition for Inter Partes Review
`U.S. Patent No. 8,530,250
`
`First Set of Notches
`
`Id. at Fig. 2(f).
`
`Second Set of Notches
`
`First Set of
`Notches
`
`Electrode (104)
`
`Second Set of Notches
`(horizontal and vertical)
`
`Electrode (104)
`
`Id. at Fig. 4(c).
`
`24
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`

`

`Petition for Inter Partes Review
`U.S. Patent No. 8,530,250
`
`5.
`
`U.S. Patent Publication No. 2005/0280017 (“Oshio”)
`
`Oshio (Ex. 1008) published December 22, 2005 and is prior art under at least
`
`§§ 102(b), (a), and (e). Oshio discloses a method for manufacturing multiple
`
`semiconductor light emitting devices. See, e.g., Ex. 1008 at Abstract, ¶¶ 2, 82, 100-
`
`101, 113, Figs. 11-14, 18(a)-18(b); Ex. 1003 ¶¶ 90-94. Oshio discloses providing a
`
`metal lead frame (shown in blue). See e.g., Ex. 1008 ¶¶ 49, 69, Figs. 1-3, 11-13.
`
`Oshio discloses the lead frame is coated “by plating” on all surfaces. See e.g., id.
`
`¶¶ 69, 113, Figs. 1-4. Oshio also discloses the leads have at least two different
`
`levels. See, e.g., id. ¶ 52, Figs. 1-3.
`
`Id. at Fig. 4.
`
`Oshio further discloses molding a thermoplastic resin on the lead frame to
`
`form a resin-molded body (shown in green) and an “LED chip 10” mounted on the
`
`lead in a concave portion of the resin package, where a portion of the lead is
`
`25
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`

`Petition for Inter Partes Review
`U.S. Patent No. 8,530,250
`exposed. See e.g., id. ¶¶ 49, 61-63, 71, Figs. 1-3, 13. Additionally, Oshio discloses
`
`the lead frame is cut along notches provided in the lead frame to individualize the
`
`light emitting devices. See e.g., at id. ¶ 113, Figs. 11-14, 18A-18B. Oshio
`
`discloses “if the lead frame is plated with silver or the like, an unplated surface of
`
`base material is exposed at the cut section.” See e.g., id. ¶ 114.
`
`Id. at Figs. 13, 18B.
`
`6.
`
`U.S. Patent Publication No. 2008/0261339 (“Koung”)
`
`Koung (Ex. 1005) was filed April 3, 2008 and published October 23, 2008,
`
`making it prior art to ’250 Patent under at least 35 U.S.C. § 102(e). Koung
`
`discloses a method for manufacturing multiple light emitting devices, generally
`
`comprising the steps of providing a lead frame (shown in blue) having at least one
`
`26
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`

`Petition for Inter Partes Review
`U.S. Patent No. 8,530,250
`notch (shown in red) that is plated, molding a resin containing a light reflecting
`
`material on the lead frame to form a resin-molded body (shown in green), and
`
`cutting (shown in red) the lead frame and resin-molded body to form
`
`individualized LED packages comprising a resin part and at least one lead. Ex.
`
`100