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`o =
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`IN THE UNITED STATES PATENT AND TRADEMARKOFFICE “nt
`=
`ot =o
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`7)
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` a
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`_
`-
`m
`5
`
`Applicant: YIDUO ZHANGetal.
`Serial No.:
`To Be Assigned
`Filed:
`Herewith
`
`For:
`
`HEAD SUSPENSION
`CONFIGURED FOR
`SOLDER BALL BONDING
`TO HEAD SLIDER
`
`Docket No.
`
`173 10-279128
`
`Box New Application
`Commissioner for Patents
`Washington, D.C. 20231
`
`EXPRESS MAIL LABEL NO. EV257249453US
`ApRit 23, 2003
`
`TRANSMITTAL LETTER
`
`Enclosedfor filing are the following papers in connection with the above-identified
`
`patent application:
`
`¢ New Application consisting of 11 pages Specification; 5 pages Claims (1-25); 1
`
`page Abstract; 10 sheets Drawings (Figures 1-12)
`
`° ADeclaration andPowerofAttorney(3 pages)
`
`e Recordétion Form with Assignment(4 pages)
`© Credit Card Payment Form in the amount of $880.00; $840.00 filing fee and
`$40.00 Recordation of Assignmentfee.
`
`e Postcard
`
`A self-addressed return postcard in accordance with M.P.E.P. Section 503
`itemizing all of the above-referenced documents filed with the United States
`Patent and Trademark Office.
`
`Applicant requests that the above-noted application not be published under 35
`
`U.S.C, § 122(b). The invention disclosed in the above-noted application has not been and
`
`will not be the subject of an application filed in another country or under a multilateral
`
`international agreement, that requires publication at eighteen monthsafterfiling.
`
`
`
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`Page 2
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`
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`In the event the amount submitted herewith is insufficient in any respect, the
`
`Commissioner is hereby authorized to charge the balance needed to our Deposit Account No.
`
`06-0029 and is requested to notify us of the same.
`
`Respectfully Submitted,
`
`YIDUO ZHANGet al.
`
` L
`
`C. Cameron, #44,581
`FAEGRE & BENSON LLP
`2200 Wells Fargo Center
`90 South Seventh Street
`Minneapolis, MN 55402-3901
`612/766-8073
`
`By:
`
`Dated: April 23, 2003
`M2:20538906.01
`
`
`
`Nitto Ex. 1006
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`

`

`O4- 24-04%
`
`o =
`PATENT &,
`co
`S
`IN THE UNITED STATES PATENT AND TRADEMARKOFFICE “nt
`=
`ot =o
`
`7)
`
` a
`
`_
`-
`m
`5
`
`Applicant: YIDUO ZHANGetal.
`Serial No.:
`To Be Assigned
`Filed:
`Herewith
`
`For:
`
`HEAD SUSPENSION
`CONFIGURED FOR
`SOLDER BALL BONDING
`TO HEAD SLIDER
`
`Docket No.
`
`173 10-279128
`
`Box New Application
`Commissioner for Patents
`Washington, D.C. 20231
`
`EXPRESS MAIL LABEL NO. EV257249453US
`ApRit 23, 2003
`
`TRANSMITTAL LETTER
`
`Enclosedfor filing are the following papers in connection with the above-identified
`
`patent application:
`
`¢ New Application consisting of 11 pages Specification; 5 pages Claims (1-25); 1
`
`page Abstract; 10 sheets Drawings (Figures 1-12)
`
`° ADeclaration andPowerofAttorney(3 pages)
`
`e Recordétion Form with Assignment(4 pages)
`© Credit Card Payment Form in the amount of $880.00; $840.00 filing fee and
`$40.00 Recordation of Assignmentfee.
`
`e Postcard
`
`A self-addressed return postcard in accordance with M.P.E.P. Section 503
`itemizing all of the above-referenced documents filed with the United States
`Patent and Trademark Office.
`
`Applicant requests that the above-noted application not be published under 35
`
`U.S.C, § 122(b). The invention disclosed in the above-noted application has not been and
`
`will not be the subject of an application filed in another country or under a multilateral
`
`international agreement, that requires publication at eighteen monthsafterfiling.
`
`
`
`Nitto Ex. 1006
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`Page 2
`
`
`
`In the event the amount submitted herewith is insufficient in any respect, the
`
`Commissioner is hereby authorized to charge the balance needed to our Deposit Account No.
`
`06-0029 and is requested to notify us of the same.
`
`Respectfully Submitted,
`
`YIDUO ZHANGet al.
`
` L
`
`C. Cameron, #44,581
`FAEGRE & BENSON LLP
`2200 Wells Fargo Center
`90 South Seventh Street
`Minneapolis, MN 55402-3901
`612/766-8073
`
`By:
`
`Dated: April 23, 2003
`M2:20538906.01
`
`
`
`Nitto Ex. 1006
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`
`HEADSLIDER
`
`HEAD SUSPENSION CONFIGURED FOR SOLDER BALL BONDING TO
`
`This application claims the benefit of copending U.S. provisional
`
`patent application, Serial No. 60/375,596, filed on April 25, 2002 andentitled
`HEAD SUSPENSION CONFIGURED FOR SOLDER BALL BONDING TO
`
`HEADSLIDER.
`
`Background of the Invention
`
`Head suspensions are well known and commonly used within
`
`dynamic magnetic or optical information storage devices or drives with rigiddisks.
`The head suspension is a component within the disk drive that positions a head
`
`10
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`slider having a magnetic or optical read/write head over a desired position on the
`
`storage media where information is to be retrieved (read) ortransferred (written).
`
`Head suspensionsfor use in rigid disk drives typically include a load beam that
`
`generates a spring force and that includes a gimbal region or supports a flexure to
`which a headslider is to be mounted. Head suspensions are normally combined
`
`with an actuator arm or E-block to which a mounting region of the load beam is
`
`mounted with a base plate so as to position (by linear or rotary movement) the head
`
`suspension, and thus the head slider and read/write head, with respect to data tracks
`
`20
`
`ofthe rigid disk. The rigid disk within a disk drive rapidly spins about an axis, and
`the headslider is aerodynamically designed to “fly” on an air bearing generated by —
`the spinning disk.
`
`‘The head suspension typically includes electrical traces that
`electrically connect the read/write headto control electronics mounted external to
`
`the head suspension. The traces may be attached to the components of the head
`
`suspension, such as the load beam and/or flexure, or they maybeintegrally
`
`formed with the components. The traces typically terminate in slider bond pads
`
`at a distal end of the head suspensionin the head slider mounting region. The
`
`read/write head is then electrically connected to the traces through bondingofthe
`
`-]-
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`head slider to the slider bond pads. This bonding may be accomplished through
`
`various methods, but most typically through gold ball bonding or solder ball
`
`bonding.
`
`Gold ball bonding is accomplished by contacting a tool to the head
`
`suspensionto support the back side of the bonding pads during ultrasonic
`
`placementof the gold ball between the head slider and trace bonding pads. Gold
`
`ball bonding requires and produces very little heat and results in little or no
`
`shrinkage ofthe goldball after the bonding procedure. However, contact of the
`
`tool to the head suspension may cause distortion in or damage to the head
`
`10
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`suspension components. In addition, in some head suspension configurations an
`
`opening in the head suspension components, such as the load beam, near the
`
`bondingregion is required so that the tool can contact the necessary parts of the
`
`head suspension. As a result, the load beam must be wider, which causes the
`
`head suspensionto have lower resonant frequencies than are desired for optimum
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`15
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`performance of the head suspension.
`
`Solder ball bonding is accomplished by applying heat at or near a
`
`solder ball positionedal the head slider andtrace bonding pads. The heat melts
`
`the solder ball. The solder wets to the head slider and trace bonding pads, and
`
`then shrinks upon cooling. Solder ball bonding does not require contact with the
`
`head suspension, which reducesthe likelihood of damageto ordistortion of the
`
`head suspension due to contact by a tool. Without the tool, the need for an
`
`" opening in some load beam configurations is eliminated, and thus the load beam
`
`may be narrower and thus may have better resonant performance. In addition,
`
`bonding attachments by solder ball bonding are easier to rework, when necessary,
`
`than gold ball bonding attachments. However, shrinkage of the solder ball may
`
`cause distortion in the head suspension components at or near the bonding region,
`
`which may then affect head suspension characteristics, such as static attitude.
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`20
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`25
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`A
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`The ability to use solder ball bonding, but without the resulting distortion, would
`
`be the preferable head slider bondingsituation.
`
`Summary of the Invention
`
`The present invention provides a head suspension or head
`
`suspension component configured for solder ball bonding of a headsliderto
`
`electrical traces on the head suspension or head suspension component. The head
`
`suspension or head suspension componentincludeselectrical traces formed from
`
`electrically conductive material with the electrical traces having a bonding region
`
`adapted for electrical bonding to a head slider. Also included is a support
`
`structure providing support for at least portions ofthe electrical traces and having
`
`a head slider mounting region adapted to receive the headslider. The support
`
`structure is configured to mechanically and thermally isolate the bonding region
`
`of the electrical traces from the head slider mounting region to reduce the
`
`mechanical and thermal effects of a solder ball bonding process on the head
`
`suspension or head suspension component during solder ball bonding ofthe head
`slider to the electrical traces.
`
`In one embodiment, the support structure is reduced in an area
`
`beneath the bonding region so as to mechanically and thermally isolate the
`
`bonding region. In another embodiment, the electrical traces include strain relicf
`
`portions formed generally adjacent the bonding region and generally free from
`
`connection to the support structure. In a further embodiment, the bonding region
`
`ofthe electrical traces includes bonding pads and an area of conductive material
`
`of the bonding padsis increased relative to conventional bonding pads so as to
`
`dissipate more heat from the bonding process. These embodiments may be
`
`provided alone or in combinations to achieve the desired level ofisolation.
`
`In yet another embodiment, the support structure includes a U-
`
`shaped slit formed around the bonding regionso that the electrical traces of the
`
`bonding region are positioned on at least one support structure tongue. The
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`support structure material of the tongue may be reduced to provide more of a
`
`cantilevered bonding region.
`
`In addition, the conductive material of the bonding
`
`region maybe increased relative to conventional bonding regions so as to
`
`dissipate more heat during the bonding process.
`
`
`Brief Description of the Several Views of the Drawings
`
`Figure | is a top view of one embodiment of a head suspension in
`
`accordance with the present invention, including a flexure having structure for
`
`use with solder ball bonding.
`
`Vigure 2 is an exploded view ofthe flexure of Figure 1.
`
`Figure 3 is a top view ofthe head suspension of Figure 1 further
`
`including a head slider mounted to the flexure andelectrically connected via
`
`solderball bonding.
`
`Figure 4 is a top view ofa first variation of the head suspension of
`
`Figure 1.
`
`of Figure 1.’
`
`Figure 5 is a top view of a second variation of the head suspension
`
`10
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`1S
`
`Figure 6 is a top view of a second embodimentof a head
`
`suspension in accordance with the present invention.
`
`Figure 7 is a top viewofan alternative embodimentof the head
`
`20
`
`suspensionofFigure 6.
`
`Figure 8 is a top view of a third embodiment of a head suspension
`
`in accordance with the present invention.
`
`Figure 9 is a top view ofa first variation of the head suspension of
`
`Figure 8,
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`Figure 10 is a bottom view of the head suspension of Figure 9.
`
`Figure 11 is a top view of a secondvariation of the head
`
`suspension of Figure 8.
`
`Figure 12 is a bottom view ofthe head suspension of Figure 11.
`
`5
`
`
`Detailed Description of the Invention
`
`The present invention provides various configurations of head
`
`suspensions and head suspension components, such as flexures, which resist
`
`distortion in the slider bonding region duc to solder ball bonding affects.
`
`Therefore, these novel configurations lend themselves to bonding by solder ball
`
`10
`
`bonding and thus the benefits of this bonding method mayberealized for these
`
`head suspension configurations.
`
`Referring to Figures 1-3, a portion of a first embodiment ofa head
`
`suspension 100 in accordance with the present invention is shownincluding a
`
`load beam 110 and a flexure 120. The flexure 120 includes integrated clectrical
`
`15
`
`leads ortraces 130 that are preferably formed of copper and/orotherelectrically
`
`conductive material, a dielectric layer 140 and a stainless steel 122 or other
`
`resilient material layer. The dielectric layer 140 and stainless steel 122 together
`
`providing a support structure for the traces 130 and head slider 105. In addition,
`
`20
`
`a cover layer 145 over the copper traces 130 mayalso be provided, if desired.
`The flexure 120 includesat a distal end 121 a head slider mounting region 124 to
`which a headslider 105 (shownin Figure 3) is mounted. The head slider 105
`
`- includes head slider bonding pads [06 at one end that align with trace bonding
`
`pads 132 provided in the traces 130 on the flexure 120. Solder batls 134 are then
`
`applied at the juncture ofthe two types of bonding padssoas to electrically
`
`25
`
`connect the head slider 105 to the traces 130.
`
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`The flexure 120 includesat the distal end 121 a distal portion 123
`
`including a cross beam 127 that is transverse to the longitudinal axis 101 of the
`
`head suspension 100 and flexure 120. The cross beam 127 connects to the head
`
`slider mounting region 124 at a center longitudinal member 126 and twoside
`
`longitudinal members 125, such that two apertures 128 are formed between the
`
`head slider mounting region 124 and the cross beam 127. A cross member 142 is
`
`also formed in the dielectric layer 140, which is positioned over the two apertures
`
`128 and the center member 126. The dielectric cross member 142 supports the
`
`trace bonding pads 132 over the apertures 128 to facilitate connection to the head
`
`slider 105. ‘he cross beam 127 provides additional stability to the flexure 120 at
`
`the distal end 121 so that the distal end 121 of the flexure 120 is not easily
`
`damaged during fabrication or handling.
`
`In this embodiment, the area of the stainless steel layer 122 around
`
`the trace bonding pads 132 is reduced, such that support of the trace bonding pads
`
`132 is provided by the dielectric cross member 142. As a result, the stainless
`
`stecl layer 122 is relatively isolated from the trace bonding pads 132 and, thus,
`
`the heat and potential distortion of the bonded solder balls 134. Vhis embodiment
`
`also provides for trace bonding pads 132 that are generally larger than standard
`bonding pads. Therefore, the area of copper forming the trace bonding pads 132
`is increased and provides for increased heat dissipation during bonding of the
`
`solder balls 134. However, the copper pad area cannot be increased to too large
`
`ofa size, or else uneven solder wicking will occur, resulting in poor solder bonds.
`
`Although shown together in the same embodiment, it is to be understood that
`
`reduction ofthe stainless steel layer 122 and increase in the area of the copper
`
`trace bonding pads 132 each may be provided alone, as well as in combination,
`
`for improving performance of the head suspension 100 with solder ball bonding.
`
`In Figure 4, a first variation of the above-described head
`
`suspension 100 is shown as head suspension 150 having a flexure 160, including
`
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`a head slider mounting region 162, traces 170 and a dielectric layer 180. In this
`
`alternative embodiment, a stainless steel layer 165 of the flexure 160 includes a
`
`center support 166 upon which a dielectric cross member 182 is positioned for
`
`supporting trace -bonding pads 172. These trace bonding pads 172 preferably
`
`include increased surface area, but may be standard size, as desired. The
`
`dielectric cross member 182 provides adequate support for the trace bonding pads
`
`172 that extend from a distal end 161 of the flexure 160. As shown,the stainless
`
`steel layer 165 is effectively isolated from the heat and distortion caused by
`
`solder ball bonding ofa head slider (not shown) to the trace bonding pads 172.
`
`Referring now to Figure 5, a second variation of the above-
`
`described head suspension 100 in accordance with the present invention is shown
`as head suspension 200 having a flexure 210, including a head slider mounting
`region 212, traces 220 and a diclectric layer 230. In this embodiment, trace
`
`1S
`
`bonding pads 222 extend beyond a distal end 211 of the flexure 210 without
`direct support by either dielectric or stainless steel portions, such as shown in the
`previous two embodiments. This cantilevered configuration ofthe traces 220
`
`provides increased isolation from the heat and distortion of solder ball bonding at
`
`the trace bonding pads 222. As with the previous embodiments, the trace
`
`bonding pads 222 preferably have increased surface area, althoughit is not
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`20
`
`required.
`
`Referring nowto Figure 6, a second embodimentof a head
`
`suspension 300 in accordance with the present invention is shown having a
`
`flexure 310, including a head slider mounting region 314 andtraces 320. A
`
`support structure includes a dielectric layer 330 and a stainless steel layer 312
`
`configured in a similar mannerto the stainless stecl layer 122 offlexure 120,
`
`having a head slider mounting region 314 and a distal portion 313 including a
`
`cross beam 317 at a distal end 311. The cross beam 317 connects to the head
`
`slider mounting region 314 at a center longitudinal member 316 and two side
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`longitudinal members 315, such that two apertures 318 are formed between the
`
`head slider mounting region 314 and the cross beam 317. A dielectric member
`
`332 that extends across center longitudinal member 316 over apertures 318
`
`provides support for trace bonding pads 322.
`
`In this embodiment, however, the
`
`traces 320 are configured to include strain relief portions 324 positioned over
`
`apertures 318, adjacent the trace bonding pads 322. Thestrain relief portions 324
`
`are generally serpentine in shape. They provide additional compliance to the
`
`traces 320 and aid in reducing distortion ofthe flexure 310 due to solderball
`
`bonding at the trace bonding pads 322.
`
`In Figure 7, a first variation of the embodiment described above
`
`with reference to Figure 6 is shown as head suspension 350 havinga flexure 360,
`
`including traces 370 and a dielectric layer 380. A stainless steel layer 362 ofthe
`
`flexure 360 includes a head slider mounting region 364 and a cross member 367
`
`at a distal end 361. Two side members 365 join the cross member 367 forming a
`
`single aperture 368 between the cross member 367 and the head slider mounting
`
`region 364. A dielectric member 382 is configured to span the aperture 368
`
`supported on the side members 365.
`
`‘The traces 370 are supported by the
`
`dielectric member 382. In this embodiment, the traces 370 also include strain
`
`relief portions 374 positioned over the aperture 368, adjacent the trace bonding
`
`pads 372.
`
`‘The strain relief portions 374 are generally serpentine in shape and
`
`provide additional compliance for reduction ofdistortion duc to solder ball
`
`bonding. The trace bonding pads 372 andstrain relief portions 374 are supported
`
`in cantilever form over the aperture 368 without engagement with the dielectric
`layer 380 orstainless steel layer 362, such that increased mechanical and thermal
`isolation are provided.
`
`Referring now to Figure 8, a third embodimentof a head
`
`suspension 400 in accordance with the present invention is shown having a
`
`flexure 410 including traces 420. The flexure 410 includes a head slider
`
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`mounting region 414 to which a headslider 405 is attached. Traces 420 includes
`trace bonding pads 422 positioned adjacent the headslider 405. In this
`
`embodiment, a support structure includes a dielectric layers 430 and a stainless
`
`steel layer 412 configured to include a tab 413 upon which the trace bonding pads
`
`422 are located overa dielectric portion 432. The tongue 413 is created by a U-
`
`shaped slit 415 formedin the stainless steel layer 412 between the headslider
`
`mounting region 414 and the trace bonding pads 422. Provision ofthe slit 415
`
`and tab 413 results in improved mechanical and thermalisolation of the trace
`
`10
`
`bonding pads 422 from the head slider mounting region 414 and other arcas of
`the flexure 410. Therefore, distortion due to mechanical and/or thermal effects of
`solder ball bonding is reduced.
`
`In Figures 9 and 10, a first variation of the embodimentdescribed
`above with reference to Figure 8 is shown as head suspension 450, having a
`
`flexure 460, including traces 470 and a dielectric layer 480. The flexure 460
`
`includes a head slider mounting region 464 to which a head slider 455 is attached.
`
`In this embodiment, a stainless steel layer 462 includes two tabs 463 (best shown
`
`in igure 10) supporting trace bonding pads 472 over a diclectric portion 482.
`
`The tabs 463 are each formed by a U-shaped slit 465 in the stainless steel layer
`
`462.
`
`20
`
`25
`
`In Figures 11 and 12, a second variation of the embodiment
`
`described above with reference to Figure 8 is shown as head suspension 500
`having a flexure 510, including traces 520 and a dielectric layer 530. The flexure
`510 includes a stainless steel layer 512 and a head slider mounting region 514 to
`
`which a headslider 505 is attached. The stainless steel layer 512 includes two
`
`apertures 518, similar to those in the embodiment shown in Figures 6 and 7.
`
`However, in this embodiment, the apertures 518 are formed to include tabs 513
`
`projecting partially into the apertures 518. Trace bonding pads 522 are
`
`positioned over the apertures 518 and a dielectric portion 532, including dielectric
`
`-9.
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`tabs 534. ‘he partial tabs 513 provide additional support to the dielectric portion
`
`532 when supporting the trace bonding pads 522 overthe dielectric tabs 534.
`
`Solder ball bonding is a preferred methodofelectrically
`
`connecting a head slider to electrical traces on a head suspension. In order to
`
`reduce the mechanical and thermal effects of the bonding process on the flexure
`
`of the head suspension, the present invention provides various configurations for
`mechanically and thermally isolating the trace bonding pads from the head slider
`mounting region, while positioning the trace bonding pads adjacentto the
`location of the slider bonding region to facilitate bonding between the pads and
`
`- the slider. In one aspect ofthe present invention, the trace bonding pads of a
`
`head suspension flexure are mechanically and thermally isolated from a slider
`
`bonding region of the flexure so as to facilitate bonding ofa slider to the pads by
`solder ball bonding methods.
`In yet another aspect ofthe present invention,
`
`mechanical and thermal isolation of the trace bonding padsis achieved by
`
`elimination ofthe stainless steel material beneath the trace bonding pads so as to
`effectively cantilever the pads. Asa result, the trace bonding pads and associated
`
`traces are free to distort as needed due to the bonding process, but with a
`
`reduction in distortion ofthe remainder of the flexure in the head slider mounting
`area.
`
`In another aspect ofthe present invention, the area of conductive
`
`material at the trace bonding pads is increased overthe area of conventional
`
`bonding pads to aid in dissipating more heat from the bonding process and, thus,
`
`reducing related distortion in the flexure components. In yet another aspect of the
`
`present invention, the traces are formed with strain relief portions that are free
`
`from connection to the stainless steel layer and generally adjacent to the trace
`
`bonding pads. These strain relief portions provide further compliance to the
`
`cantilevered traces and bonding pads so as to accommodate distortion resulting
`
`from the bonding process. Reconfiguration ofthe traces and trace bonding pads
`
`-1]0-
`
`10
`
`15
`
`20
`
`25
`
`
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`may be used alone or in combination with each and/or with reductionof the
`
`stainless steel layer, as described above.
`
`In one other aspect of the invention, a U-shapedslit is provided in
`
`the stainless steel layer around the trace bonding pads, resulting in the pads being
`
`positioned on one or more tongues. These tongues are thus mechanically and
`
`thermally isolated from the head slider mounting region, thereby reducing
`
`distortion from the bonding process, but still providing support for the pads. In
`
`one variation of this configuration, the stainless steel tongue is combined with
`
`reduccd stainless stcel, resulting in cantilevered trace bonding pads with
`
`additional support. In another variation, the trace bonding pads include increased
`
`surface area to provide increased heat dissipation in combination with the
`
`mechanical and thermalisolation ofthe tongue structure.
`
`Although the present invention has been described with reference
`
`to preferred embodiments, workers skilled in the art will recognize that changes
`may be made in form and detail without departing fromthe spirit and scopeof the
`
`invention.
`In addition, the invention is not to be taken as limited to all ofthe
`details thereof as modifications andvariations thereof may be made without
`departing from the spirit or scope ofthe invention.
`
`10
`
`15
`
`-ll-
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`
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`WhatIs ClaimedIs:
`
`A head suspension or head suspension component configured for
`1.
`solder ball bonding ofa headsliderto electrical traces on the head suspension or head
`suspension componcnt, the head suspension or head suspension component
`comprising:
`
`electrical traces formed from electrically conductive material, the
`electrical traces including a bonding region adapted for electrical bonding to a head
`slider; and
`
`a support structure providing support for at least portions of the
`electrical traces, the support structure including a head slider mounting region adapted
`to receive the headslider, with the support structure configured to mechanically and
`thermally isolate the bonding region ofthe electrical traces from the head slider
`
`mounting region to reduce mechanical and thermal effects of a solder ball bonding
`process on the head suspension or head suspension componentduring solder ball
`bonding of the head slider to the electrical traces.
`
`The head suspension or head suspension componentof claim 1,
`2.
`wherein portions of the supportstructure are reduced in an area beneath the bonding
`region.
`
`The head suspension or head suspension componentofclaim 1,
`3.
`wherein the electrical traces comprise strain relief portions formed generally adjacent
`the bonding region and generally frec from connection to the support structure.
`
`The head suspension or head suspension componentofclaim 1,
`4,
`wherein the bonding regionofthe electrical traces comprises bonding pads and
`wherein an area of conductive material of the bonding padsis increased relative to
`conventional bonding padsso asto dissipate more heat from the bonding process.
`
`-12-
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`5.
`
`The head suspension or head suspension component of claim 1,
`
`wherein portions of the support structure are reduced in an area beneath the bonding
`
`region and whercinthe electrical traces further comprise strain relief portions formed
`
`generally adjacent the bonding region and gencrally free from connection to the
`
`support structure.
`
`The head suspension or head suspension componentofclaim 1,
`6.
`wherein portions ofthe support structure are reduced in an area beneath the bonding
`
`region and wherein the bonding region ofthe electrical traces comprises bonding pads
`
`with an area of conductive material of the bonding pads increased relative to
`
`conventional bonding pads so as to dissipate more heat from the bonding process.
`
`7.
`
`The head suspension or head suspension componentofclaim 1,
`
`wherein the electrical traces further comprise strain relief portions formed generally
`
`adjacent the bonding region and generally free from connection to the support structure
`
`and wherein the bonding regionofthe electrical traces comprises bonding pads with an
`
`area of conductive material of the bonding pads increased relative to conventional
`
`bonding pads so as to dissipate more heat from the bonding process.
`
`8.
`The head suspension or head suspension component of claim 1,
`wherein portions of the support structure are reducedin an area beneath the bonding
`
`region, wherein the electrical traces further comprises strain relief portions formed
`
`generally adjacent the bonding region and generally free from connectionto the
`
`support structure and wherein the bonding region ofthe electrical traces comprises
`
`bonding pads with an area of conductive material of the bonding pads increased
`
`relalive to conventional bonding pads so as to dissipate more heat from the bonding
`
`process.
`
`9.
`
`The head suspension or head suspension componentof claim 1,
`
`wherein the support structure comprises a U-shaped slit formed around the bonding
`
`
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`region so that the electrical traces of the bonding region are positioned on at least one
`
`support structure tongue.
`
`10.
`
`The head suspension or head suspension component of claim 9,
`
`wherein the support structure tongue comprises reduced support structure material.
`
`HH.
`
`The head suspension or head suspension componentof claim 10,
`
`wherein the bonding region is partially cantilevered but is still supported.
`
`12.
`
`The head suspension or head suspension component ofclaim 10,
`
`wherein an area of conductive material of the bonding region is increased soas to
`
`dissipate more heat from the bonding process.
`
`13.
`
`The head suspension or head suspension component of claim 9,
`
`wherein an area of conductive material of the bonding region is increased to dissipate
`
`more heat from the bonding process.
`
`14.
`
`‘The head suspension or head suspension componentofclaim 1,
`
`wherein the support structure comprises a stainless steel layer.
`
`15.
`
`The head suspension or head suspension component of claim 14,
`
`wherein the support structure further comprises a diclectric layer betwcen the electrical
`
`traces and the stainless steel layer, the dielectric layer configured to support portions of
`the electrical traces.
`
`16.
`
`The head suspension or head suspension componentof claim 15,
`
`wherein the dielectric layer provides support for ihe bonding region when the stainless
`
`steel layer is reduced in an area beneath the bonding region.
`
`17.
`
`The head suspension or head suspension component ofclaim 16,
`
`wherein both the dielectric layer and the stainless steel layer are reduced in an area
`
`beneath the bonding region leaving the bonding region free from support.
`
`-14-
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`18.
`
`‘he head suspension or head suspension component of claim 1,
`
`whereinthe head suspension component comprises a flexure.
`
`19.
`
`A flexure comprising:
`
`a slider bonding region adapted to receive a headslider;
`
`electrical traces including bonding pads located adjacent to the
`slider bonding region; and
`.
`a support structure for supporting the bonding pads to reduce
`
`mechanical and thermal effects of a solder ball bonding process on the flexure during
`
`solder ball bonding of a headslider to the electrical traces.
`
`20.
`
`‘The flexure of claim 19, wherein the support structure includes a
`
`dielectric layer supported over an aperture in a stainless steel layer.
`
`21.
`
`The flexure of claim 19, wherein the support structure includes
`
`apertures in a stainless steel layer with portions of the electrical traces and the bonding
`
`pads cantilevered over the apertures.
`
`22.
`The flexure ofclaim 19, wherein the electrical traces further