Petitioner: Haag-Streit AG
`Petitioner: Haag-Streit AG
`
`Ex. 10(cid:20)(cid:27)
`
`EX. 1018
`
`

`

`’
`
`O
`5,660,461
`[11] Patent Number:
`[19]
`Umted States Patent
`
`Ignatius et a].
`[45] Date of Patent:
`Aug. 26, 1997
`
`USOOS660461A
`
`[54] ARRAYS OF OPTOELECTRONIC DEVICES
`AND METHOD OF MAKING SAME
`
`[75]
`
`Inventors: Ronald W. Ignatius; Todd S. Martin,
`-
`-
`bah 0f DOdgeV‘nc’ W‘s‘
`.
`.
`[73] A5519“: Q‘Pmm Dewces’ Inc" Barneveld‘
`Wls-
`
`[21] Appl. No.: 351,813
`.
`[22] Filed:
`Dec. 8, 1994
`[51]
`Int. CLG ............................. FZIV 7/02; HOIR 43/00;
`H01L 33/00
`
`[52’ ”'5' C‘s5275;81"§a;ao’-‘§é%‘3§83§§’773§? 323/822?
`’
`’
`’
`’
`’
`29/827; 29/856; 29/860; 313/114; 313/500
`[58] Field of Search ........................... 228/1791; 257/88,
`257/98, 99, 666. 668. 675. 676. 701. 704.
`723‘ 725. 313,500~ 114; 362/800. 240.
`241. 247, 249, 226. 294‘ 250~ 346; 29/827,
`854, 856. 860
`'
`
`[56]
`
`References Cited
`
`U-S- PATENT DOCUMENTS
`3,711,789
`1/1973 D1
`hke ............................... 313/500
`3,764,862 10/1973 Jaafiwsh .....
`.. 317/234
`3,773,337 12/1973 Suzuki et 31
`29/327
`3,832,480
`8/1974 Bunker ......
`29/327
`4,0S4,814 10/1977 Fegley ...........
`315/71
`
`4,129,687- 12/1973 Stewart et a1.
`------ 423/571
`
`5/1979 Knaebel .............. 313/499
`4,152,624
`232232
`$138: FD???) .e't'al""""""335g;
`4:486:364 12/1984 Takahashi
`.....
`264/1 .7
`4,542,259
`9/1985 Butt ...........
`.. 174/52
`4,667,277
`5/1987 Hanchar
`
`
`
`.
`
`5/1988 Thillays eta]. ......................... 362/800
`4,742,432
`8/1989 Stein ..............
`313/500
`4,853,593
`9/1989 Osada ................. 29/827
`4,862,586
`
`
`'- 232/7138
`$133?) gaViiettZIl
`11333132;
`......
`use e
`,
`,
`
`6/1990 Murata
`313/500
`4,935,665
`t al. ............. 47/58
`5/1991 1
`ti
`5,012,609
`
`11/1991 $221126; etal. ..
`445/856
`5,062,818
`
`5,174,649 12/1992 Alston ................
`362/244
`
`5,175,060 12/1992 Enomoto et a1.
`428/827
`
`5,241,457
`8/1993 Sasajlma et a1.
`362/80.1
`
`1/1994 Ignatius et a1. ........... 257/88
`5,278,432
`
`5,289,033
`211994 Asami et a1.
`257/676
`
`5,404 82
`4/1995 Klinke et a1.
`362/800
`7/1995 Brassier Ct a1 ....................... 3621800
`5,436:§09
`
`Primary Exam-Alan C3950
`.
`t
`F'
`M'
`A tomey’ Age“ 0'
`‘
`‘Chael' Be“
`[57]
`ABSTRACT
`
`'
`& F ’
`“Edam
`
`~
`_
`AlOW COSt LED array 15 formed from aplurality Of modular
`units that are snapped together. Each modular unit consists
`of one or more U—shaped lead frame substrates Wthh are
`overmolded with a thermoplastic insulator material. The
`lead frame substrates act as heat dissipators. The LEDs are
`then bonded onto the upper surfaces of the lead frame
`substrates. Areflector unit is separately molded and has one
`cone'Sh‘3P‘id ”fleet“ for “Ch light emitting diOdC' The
`“flea“ Emit is align“ and we? to “1610? Of the lead
`frame umt such that the LED 1s dlsposed 1n the center of
`each cone. Each of the reflector units has several dovetail-
`shaped connectors which enable the completed module to be
`connected to adjacent modules to form the array. The
`modules are then electrically connected together in series or
`in parallel according to the particular application. The arrays
`may be used for plant growth or In photodynam1c therapy.
`
`37 Claims, 7 Drawing Sheets
`
`
`
`

`

`US. Patent
`
`Aug. 26,1997
`
`Sheet 1 of 7
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`5,660,461
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`

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`US. Patent
`
`Aug. 26, 1997
`
`Sheet 2 of 7
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`5,660,461
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`

`

`US. Patent 6
`
`Aug. 26, 1997
`
`Sheet 3 of 7
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`5,660,461
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`

`

`US. Patent
`
`Aug. 26, 1997
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`Sheet 4 of 7
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`5,660,461
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`

`

`U.S. Patent
`
`'
`
`Aug. 26, 1997
`
`Sheet 5 of 7
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`5,660,461
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`
`
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`US. Patent
`
`Aug. 26, 1997
`
`Sheet 6 of 7
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`5,660,461
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`

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`US. Patent
`
`Aug. 26, 1997
`
`Sheet 7 of 7
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`5,660,461
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`

`

`5,660,461
`
`1
`ARRAYS OF OPTOELECTRONIC DEVICES
`AND METHOD OF MAKING SAME
`
`BACKGROUND OF THE INVENTION
`
`The U.S. Government has a paid-up license in this inven—
`tion and the right in limited circumstances to require the
`patent owner to license others on reasonable terms as
`provided for by the terms of Grant No. NASW-4909
`awarded by the National Aeronautics and Space Adminis-
`tration.
`
`This invention relates to arrays of optoelectronic devices
`such as light emitting diodes. More particularly, this inven-
`tion relates to low cost methods of manufacturing such
`arrays.
`
`In the past. arrays of light emitting diodes (LEDs) and
`other optoelectronic devices were primarily used as indica—
`tors and in signs. More recently. such arrays have been used
`as a source of radiant flux. The term “power” is often used
`interchangeably with the term “radiant flux” when referring
`to optoelectronic devices. Both radiant flux and power are
`measured in watts. Several applications of LED arrays in
`which the LEDs are used as a source of radiant flux include
`
`environmental chambers for plant growth and medical appli—
`cations in photodynarnic therapy.
`Regardless of whether LED arrays are used as indicators
`or as a radiant flux source, it is often desirable to provide
`large scale arrays in some applications. For example. large
`scale arrays may be used in plant growth in which red and
`blue LEDs supply the most desirable wavelengths of light
`energy to large numbers of plants.
`There are several problems in using arrays. and particu-
`larly large scale arrays, of optoelectronic devices. One
`problem is the cost of manufacturing the arrays. Prior art
`LED arrays are expensive to manufacture on a large scale
`basis because many components and manufacturing steps
`are required to produce the arrays.
`Another problem with prior art LED arrays is the dissi-
`pation of the heat generated by the optoelectronic devices.
`For an LED array to be effective as a radiant flux source. it
`is often desirable to provide sufficient power to the array so
`that the light output of the array is equivalent to the output
`of l to 10 suns or more. However. a great deal of heat is
`generated when the light output of the array is very high.
`Indeed, the ability to dissipate the heat generated by the LED
`array is one of the greatest limitations on the total light
`output of the array.
`
`SUMMARY OF THE INVENTION
`
`A low cost method of manufacturing arrays of optoelec-
`tronic devices, such as light emitting diodes. is provided.
`In a preferred embodiment of the present invention. the
`array is manufadured by individually manufacturing a plu—
`rality of modules, and then by mechanically and electrically
`connecting the modules together to form an array of any
`desired size. The array is then electrically connected to a
`power source. Each of the modules may have one or more
`optoelectronic devices. The modules may be connected in
`parallel or in series to yield any desired configuration or
`radiant flux output.
`The preferred method of manufacturing each module
`includes forming at least one lead frame substrate. applying
`an insulator material onto portions of the lead frame sub-
`strate by molding or the like to create a lead frame unit. and
`affixing at least one optoelectronic device onto the lead
`frame unit. Thereafter. a reflector unit is formed that has at
`
`2
`least one reflector. and the reflector unit is aflixed to the lead
`frame unit such that a reflector is disposed adjacent to each
`optoelectronic device. Each of the lead frame units or the
`reflector unit is formed with male and female connectors so
`
`that adjacent modules may be mechanically connected
`together to form the array.
`The method according to the present invention results in
`a unique array of optoelectronic devices which is formed
`from a plurality of interconnected modules. Each of the
`modules has at least one U-shaped lead frame substrate. If
`a plurality of lead frame substrates are used in a module. the
`individual substrates are electrically separated and mechani-
`cally held together by the insulator material. At least some
`of the lead frame substrates have an optoelectronic device
`disposed on an upper surface thereof. Each device is elec—
`trically connected to two lead frame substrates.
`The module also has a plurality of registration members
`that align the reflector unit which is afixed to the upper
`surface of the lead frame unit. The reflector unit is a molded
`component that has one reflector for each of the optoelec-
`tronic devices in the module. Each of the individual reflec-
`tors is coated with a reflective material such as chromium.
`In a preferred embodiment. each of the reflector units also
`has connectors aflixed thereto which are used to mechani—
`cally connect the reflector units of adjacent modules to each
`other.
`Each of the lead frame substrates is made from a metal or
`metal alloy, and acts as a heat sink that is capable of
`dissipating a great deal of heat. Thus, the LED array may not
`require ventilators or water cooling apparatus to dissipate
`the heat generated by the light emitting diodes.
`It is a feature and advantage of the present invention to
`reduce the cost of manufacturing large scale arrays of light
`emitting diodes.
`It is another feature and advantage of the present inven-
`tion to provide an array of light emitting diodes that has a
`high output yet which inexpensively dissipates the heat
`generated by the array.
`It is another feature and advantage of the present inven—
`tion to allow the LEDs to be driven beyond their typical or
`rated forward currents by effectively dissipating the heat
`from the LED array. thereby increasing the radiant flux
`output of the array with fewer LED components.
`These and other features and advantages of the present
`invention will be apparent to those skilled in the art from the
`following detailed description of the preferred embodiment
`and the drawings. in which:
`BRIEF DESCRIPTION OF THE DRAWINGS
`
`FIG. 1 is a plan View of a plurality of lead frame
`substrates.
`
`FIG. 2 is a perspective view of a plurality of lead frame
`substrates after they have been bent into U-shaped members.
`FIG. 3 is a perspective view of the lead frame unit after
`an insulator material has been applied thereto.
`FIG. 4 is a perspective View of the lead frame unit after
`the optoelectronic devices have been aflixed thereto.
`FIG. 5 is a perspective view of a reflector unit.
`FIG. 6 is a perspective view of a completed module.
`FIG. 7 is an exploded View of a porfion of the module of
`FIG. 6.
`
`10
`
`15
`
`20
`
`25
`
`30
`
`35
`
`45
`
`50
`
`55
`
`FIG. 8 is a perspective view of a complete array of
`optoelectronic devices.
`DETAILED DESCRIPTION OF THE
`PREFERRED ElvaODIMENT
`
`65
`
`FIG. 1 depicts a plurality of lead frame substrates. Lead
`frame substrates are made from a highly conductive metal
`
`

`

`5,660,461
`
`3
`
`such as copper, aluminum or nickel. Substrates may be
`manufactured by stamping, laser cutting, or photornilling.
`Each of substrates includes an integral protrusion 12a,
`14a, 16a, 18a, and 20a respectively that is used as the
`attachment point for the lead wire from an optoelectronic
`device on the adjacent lead flame substrate. Substrate 10
`does not have such a protrusion.
`Substrate 10 has a pair of electrical terminals 10a, both of
`which are used as either the input terminals of the completed
`module or the output terminals. Similarly, lead frame sub-
`strate 20 has a pair of electrical terminals 20b which may
`serve as either the output terminals or the input terminals of
`the complete module. If terminals 10a are connected as the
`input terminals, then terminals 20b are connected as the
`output terminals of the module, and vice versa.
`Each of lead frame substrates has attached thereto two
`extra pieces 22 and 24 which are formed during the stamping
`process.
`
`The stamped lead frame substrates are then bent into a
`substantially U-shaped configuration using a press with male
`and female inserts, and pieces 22 and 24 are removed The
`bent lead frame substrates are depicted in FIG. 2. As shown
`in FIG. 2, adjacent substrates have gaps 11, 13, 15, 17 and
`19.
`
`As also shown in FIG. 2. each of protrusions 12a, 14a,
`16a, 18a and 20a is received in an indentations 10b, 12b,
`14b, 16b and 18b respectively of an adjacent lead frame
`substrate.
`
`Although the preferred embodiment discussed herein con-
`sists of a module having five optoelectronic devices and six
`lead frame substrates, it is to be understood that the arrays
`according to the present invention may be manufactured
`with as few as one lead frame substrate having a single
`optoelectronic device, as well as with more than five lead
`frame substrates and optoelectronic devices. The number of
`substrates and optoelectronic devices in a single module is
`dependent upon designer’s choice, tooling cost, and space
`and power considerations in the final array.
`To improve the electrical connections between the opto-
`electronic devices and the substrates, it may be desirable to
`place another electrically-conductive material on top of at
`least a portion of the uppermost surfaces of substrates. The
`addition conductive material may be plated onto the upper—
`most surfaces, it could be spot plated at those locations
`where the optoelectronic devices and lead wires connect to
`the substrates, or it could be inlaid where the optoelectronic
`devices and the lead wires connect to the substrates. The
`
`additional conductive material is preferably nickel, gold or
`silver, although other materials may be used. If copper is
`used as the primary substrate material, it is particularly
`desirable to plate another metal where the optoelectronic
`devices connect to the substrate since it is often difficult to
`connect the optoelectronic devices to copper, and to create
`a more reliable metallic connection.
`
`The next step in the manufactrning process is to place an
`insulator material in gaps 11, 13. 15, 17 and 19 between
`substrates, as well as around the edges of the substrates. The
`purpose of the insulator material is to prevent short circuits
`between the substrates, and between substrates of adjacent
`modules. Another primary purpose of the insulator material
`is to hold substrates 10, 12. 14. 16, 18 and 20 together in the
`module.
`
`5
`
`10
`
`15
`
`20
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`25
`
`30
`
`35
`
`45
`
`50
`
`55
`
`FIG. 3 depicts the lead flame unit after the insulator
`material has been applied As shown in FIG. 3. gaps 11. 13,
`15, 17 and 19 have been filled with the insulator material;
`portions of indentations 10b, 12b, 14b, 16b and 18b have
`
`65
`
`4
`also been filled. Rails 26, 27, 28 and 29 of insulator material
`have also been formed at the outermost edges of substrates.
`The insulator material has also been used to form registra-
`tion members 30 which are used to align the reflector unit,
`as best shown in FIG. 6.
`
`The insulator material is preferably applied by placing the
`lead flame unit (FIG. 2) in a mold. and injection molding the
`insulator material around the lead flame unit. One particu—
`larly suitable thermoplastic material that may be used as the
`insulator material
`is known as acrylonitrile-butadiene-
`styrene, or ABS. This material may be glass-filled, and is
`supplied by a number of manufacturers including GE Plas—
`tics of Pittsfield, Md. and by Monsanto.
`After the molding step, the unit depicted in FIG. 3 is
`approximately 1 centimeter Wide, 5 centimeters long, and
`2.5 centimeters high. These dimensions were chosen such
`that the completed array (FIG. 8) will have an optoelectronic
`device every centimeter in both planar directions, thereby
`yielding sufficient power output for plant growth. By way of
`example, the array depicted in FIG. 8 may be composed of
`one-half red light emitting diodes (LEDs) and one-half blue
`LEDs. The output of the blue LEDs is approximately 50
`micromoles per meter squared per second, with wavelengths
`in the range of 400 to 500 nanometers. The red LEDs have
`an output of approximately 500 micromoles per meter
`squared per second, with wavelengths in the range of about
`640 to 700 nanometers. Thus, the total array has an output
`of approximately 550 micromoles per meter squared per
`second if the LEDs are one centimeter apart from each other.
`In a preferred embodiment, each modular unit would have
`LEDs of all the same type, red or blue. Modules of different
`types would be connected together to yield the desired
`output in thedesired wavelengths. Of course, the LEDs in
`the resultant array could all be of the same type, or the array
`could be comprised of different proportions of the red and
`blue devices.
`
`The next step in the manufactrning process is to attach the
`individual optoelectronic devices to the module. As dis-
`cussed in US. Pat. No. 5,278,432 issued Jan. 11, 1994 to
`Ignatius et al, which is incorporated by reference herein, the
`red optoelectronic devices may be GaAlAs LEDs manufac-
`tured by Mitsubishi Kaisi Polytech of Japan, and are avail-
`able flom Showa Denkoa or Stanley, both of Japan, or from
`Hewlett-Packard of Palo Alto, Calif. The blue optoelectronic
`devices may be silicon carbide LEDs sold by Cree Research
`Inc. of Durham, NC. The LEDs are preferably epitaxially-
`formed, double heterojunction, double power diodes that
`emit substantially monochromatic light. These LEDs have '
`one electrode disposed at the bottom of the optoelectronic
`device, which must be electrically bonded to the lead frame
`substrate. The positions of optoelectronic devices 32. 34, 36,
`38 and 40 on substrates 10, 12, 14, 16 and 18 respectively
`are depicted in FIG. 4.
`One way of bonding optoelectronic devices 32. 34. 36, 38
`and 40 to the substrates is to use an electrically-conductive
`epoxy resin. One suitable conductive epoxy is made by
`Ablestik of Rancho Dominquez. Calif. and sold under the
`trademark ABLEBOND. Type No. 84-1LM1T. However. a
`preferred way of attaching the devices, to the lead frame
`substrates is by eutectic bonding using a metallic alloy such
`as an indium. lead or tin alloy. In the eutectic bonding step,
`the metallic alloy is melted between the LED electrode and
`the lead frame substrate, resulting in a much lower thermal
`resistance than if the electrically-conductive epoxy is used in
`the bond. A lower fliermal resistance is highly desirable
`since a lower resistance will result in greater heat dissipation
`from the optoelectronic devices through the heat sink, con-
`
`

`

`5
`
`6
`
`5,660,461
`
`sisting of the lead flame substrates. Another advantage of the
`lower thermal resistance achieved using eutectic bonding is
`that the greater heat dissipation allows the LEDs to be driven
`beyond their typical or rated forward currents. This feature
`increases the total radiant flux output by the LED array with
`fewer LED components.
`The next step in attaching the optoelectronic devices to
`the substrates is to attach a lead wire flom the other device
`
`electrode. located at the top of the device. to the protrusion
`portion of the adjacent substrate. In FIG. 4. a lead wire 1 is
`attached flom an electrode of a device 32 to protrusion 12a
`of substrate 12. Similarly, a lead wire 3 is attached between
`device 34 and protrusion 14a, a lead wire 5 is attached
`between device 38 and protrusion 18a. and a lead wire 7 is
`attached between device 40 and protrusion 20a.
`The lead wire is preferably aluminum or gold. and may be
`aflixed by ultrasonic bonding at both ends. If the lead wire
`is gold. thermosonic bonding may be used in which the wire
`is first heated and then ultrasonically bonded to the opto-
`electronic device and the adjacent substrate.
`After the optoelectronic devices have been electrically
`connected to the substrates. an overcoat of a transparent
`passivation epoxy is applied over the optoelectronic devices
`and their lead wires to protect the devices flom the envi-
`ronment.
`
`The next step in the process is to manufacture a reflector
`unit like reflector unit 42 depicted in FIG. 5. Referring to
`FIG. 5, reflector unit 42 is manufactured using stande
`injection molding techniques. The reflector unit contains a
`plurality of reflectors 44. 46. 48. 50 and 52. one reflector for
`each of optoelectronic optoelectronic devices 32. 34, 36. 38
`and 40 respectively (FIG. 4). Reflector unit 42 is manufac—
`tured flom the insulator material called ABS. discussed
`above. This material
`is particularly suitable for
`electroplating. since the reflective material is then electro—
`plated or otherwise applied onto each of reflectors 44, 46.
`48. 50 and 52. The reflector material is preferably chro-
`mium.
`
`Reflectors 44, 46. 48. 50 and 52 are cone-shaped. and may
`be 30° cones for environmental chambers used to grow
`plants. Of course. other types of cones or other types of
`reflectors altogether may be used; the shapes of the reflectors
`are chosen as a function of the desired output beam profile
`flom the optoelectronic devices.
`Reflector unit 42 has a plurality of connectors aflixed
`thereto for connecting the reflector unit to adjacent reflector
`units of adjacent modules. In FIG. 5. reflector unit 42 has a
`plurality of male-type connectors 54. S6. and 58. as well as
`a plurality of female—type connectors 60. 62. and 64. The
`connectors 54, 56. 58, 60, 62 and 64 preferably dovetail-
`shaped. although other shapes may also be used.
`If the optional reflector units are not used, the connectors
`could be affixed to the lead frame unit. or could be injection
`molded onto the lead frame substrates along with the insu-
`lator material.
`
`The next step in the manufacturing process is to complete
`each module by affixing the reflector units onto their respec-
`tive lead flame units. A completed module is depicted in
`FIG. 6. In FIG. 6. reflector unit 42 is aligned on the lead
`flame unit by registration members 30. After being placed
`on the lead flame unit. reflector unit 42 is aflixed to the lead
`flame unit by an adhesive such as an epoxy. or by a
`double-sided tape.
`As depicted in FIG. 6. each of the reflectors is disposed
`adjacent to an optoelectronic device. That is. reflector 44 is
`disposed adjacent device 32. reflector 46 is disposed adja-
`
`10
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`15
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`20
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`25
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`30
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`35
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`50
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`65
`
`cent device 34. reflector 48 is adjacent device 36. reflector
`50 is adjacent device 38. and reflector 52 is disposed
`adjacent device 40. FIG. 7 is an exploded View which more
`clearly depicts the orientation of the reflectors with respect
`to their respective optoelectronic devices.
`After a number of modules have been completed. they are
`snapped together into an array. as depicted in FIG. 8. The
`modules are held together by the male and female-type
`connectors on their respective reflector units. The position—
`ing of the connectors on each of the four sides of the reflector
`unit allows a wide variety of configurations for the com—
`pleted array. For example.
`the array may be an 8x10
`rectangular array 66 as depicted in FIG. 8. However. the
`array may also be configured to fit into a housing having a
`different shape. or may be used without a housing altogether.
`The U—shape of each of the lead flame substrates provides a
`great deal of surface area for heat dissipation without the
`need for an additional cooling apparatus in many
`applications. so that no surrounding housing may be needed.
`To complete the entire assembly. a continuously variable
`power supply is connected to power the array. For the
`configuration in FIG. 8 and assuming that the modules are
`connected such that there are eight parallel strings of ten
`optoelectronic devices in each string. a continuously vari-
`able power supply may be used like that described in U.S.
`Pat. No. 5.278.432 issued Jan. 11, 1994 to Ignatius et al and
`incorporated by reference herein. except that the power
`supply should have a 24 volt output.
`If it is assumed that array 66 in FIG. 8 is comprised of
`eight parallel strings of ten devices in each string. then each
`of electrical terminals 100 of module 68 will be connected
`to the power supply. Output terminals 20b (FIG. 2) of each
`of module 68 will be electrically connected by wires or
`otherwise to the input terminals of modules 70. so that each
`of the eight parallel strings will consist of a module 68 and
`a module 70 connected in series. Each of module 68 is also
`mechanically connected to one or more adjacent modules 68
`and one module 70 using the connectors discussed above in
`connection with FIG. 6.
`
`While a preferred embodiment of the present invention
`has been shown and described. alternate embodiments will
`be apparent to those skilled in the art and are within the
`intended scope of the present invention. Therefore.
`the
`invention is to be limited only by the following claims.
`We claim:
`
`1. A module having at least one optoelectronic device.
`comprising:
`at least one electrically and thermally conductive lead
`frame substrate having an upper surface and being
`adapted to act as a heat sink;
`at least one optoelectronic device electrically connected to
`said upper surface of said lead frame substrate; and
`at least one connector interconnected with said lead flame
`substrate that is adapted to interconnect said lead flame
`substrate with at least one other lead flame substrate of
`another module.
`2. The module of claim 1. wherein said at least one lead
`flame substrate comprises a plurality of lead flame sub-
`strates separated and held together by an insulator material.
`3. The module of claim 2. wherein at least one of said lead
`frame substrates has an input electrical
`terminal. and
`wherein another of said lead flame substrates has an output
`electrical terminal.
`
`4. The module of claim 3. wherein said optoelectronic
`device has a rated forward current associated therewith. and
`wherein said input electrical terminal receives an amount of
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`current that exceeds the rated forward current of said opto-
`electronic device.
`5. The module of claim 2. wherein at least some of said
`lead frame substrates have an optoelectronic device aflixed
`thereto, and wherein each optoelectronic device is also
`electrically connected to another lead flame substrate in said
`module.
`
`6. The module of claim 1, further comprising:
`areflector unit, having at least one reflector, aflixed to said
`lead flame substrate such that said reflector is adjacent
`to said optoelectronic device.
`7. The module of claim 6, wherein said reflector unit
`includes a plurality of reflectors, each of said reflectors
`havinga coating of a reflective material.
`8. The module of claim 6, wherein said at least one
`connector is aflixed to said reflector unit.
`9. The module of claim 8. wherein said reflector unit has
`a male connector and a female connector that are adapted to
`connect said reflector unit with a reflector unit of another
`module.
`
`10. The module of claim 1, wherein said optoelectronic
`device is a light emitting diode.
`11. The module of claim 1, wherein said lead frame
`substrate is U-shaped in cross-section.
`12. The module of claim 1, wherein at least a portion of
`the lead frame substrate to which an optoelectronic device is
`affixed is coated with a metal.
`
`13. An array of optoelectronic devices, comprising: a
`plurality of modules of optoelectronic devices, each of said
`modules including
`a plurality of electrically and thermally conductive lead
`frame substrates, each of said substrates being adapted
`to act as a heat sink, at least one of said substrates
`having an input electrical terminal and at least one
`other substrate having an output electrical terminal;
`an optoelectronic device electrically connected to at least
`some of said lead flame substrates; means for mechani-
`cally connecting two of said modules together; and
`means for electrically connecting an input terminal of one
`of said modules to an output terminal of another
`module.
`
`14. The array of claim 13, wherein each of said optoelec-
`tronic devices has a rated forward current associated
`therewith, and wherein said input electrical
`terminal
`receives an amount of current that exceeds the rated forward
`current of said optoelectronic devices.
`15. The array of claim 13, wherein each module also
`includes:
`a reflector unit interconnected with said lead frame sub—
`
`strates and having a plurality of reflectors thereon, each
`of said reflectors being adjacent to an optoelectronic
`device.
`
`16. The array of claim 15, wherein each of said modules
`includes at least two registration members that are used to
`align said reflector unit.
`17. The array of claim 13, wherein the lead frame sub-
`strates in each module are held together by an insulator
`material.
`-
`
`18. The array of claim 13. wherein said lead frame
`substrates are U-shaped in cross-section.
`19. The array of claim 13. wherein each optoelectronic
`device is also electrically connected to an adjacent lead
`frame substrate.
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`10
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`15
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`20
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`25
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`30
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`35
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`45
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`50
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`55
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`20. The array of claim 13, wherein said mechanically
`connecting means comprises:
`at least one male connector interconnected with each
`module; and
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`65
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`8
`at least one female connector interconnected with each
`module.
`
`21. The array of claim 13, wherein said electrical con—
`necting means comprises a lead wire connected between an
`input terminal of a module and an output terminal of another
`module.
`
`22. A method of manufacturing a module having at least
`one optoelectronic device, comprising;
`forming at least one lead frame substrate;
`applying an insulator material onto portions of said lead
`frame substrate to create a lead flame unit;
`affixing said at least one optoelectronic device onto said
`lead frame unit; and
`forming at least one connector that connects said module
`to an adjacent module.
`23. The method of claim 22, wherein said lead frame
`forming step includes:
`creating a lead flame substrate; and
`bending said lead frame substrate into a U—shape.
`24. The method of claim 22, wherein said insulator
`applying step includes:
`placing said at least one lead flame substrate into a mold;
`and
`
`molding a thermoplastic insulator material onto portions
`of said lead flame substrate.
`
`25. The method of claim 22, wherein said device aflixing
`step includes:
`bonding an optoelectronic device onto said lead frame
`substrate; and
`affixing a lead wire between said bonded optoelectronic
`device and another lead frame substrate.
`
`26. The method of claim 22, fln'ther comprising:
`coating said optoelectronic device with a transparent
`protective layer.
`27. The method of claim 22, wherein lead frame forming
`step includes:
`forming at least one electrical terminal on said lead frame
`substrate.
`
`28. The method of claim 22, further comprising:
`forming a reflector unit having at least one reflector; and
`affixing said reflector unit to said lead flame unit such that
`said at least one reflector is disposed adjacent to said at
`least one optoelectronic device.
`29. The method of claim 28, wherein said reflector unit
`forming step includes:
`applying a layer of a reflective material onto said reflector.
`30. The method of claim 28, wherein said reflector unit
`forming step includes:
`forming a plurality of connectors on said reflector unit
`such that each of said connectors may be connected
`with an adjacent reflector unit.
`31. The method of claim 28, wherein said reflector unit
`affixing step includes:
`bonding said reflector unit onto an upper surface of said
`lead frame unit.
`
`32. The method of claim 28, further comprising:
`forming at least two registration members on said lead
`frame unit that are used to align said reflector unit with
`said lead flame unit.
`
`33. A method of manufacturing an array of optoelectronic
`devices. comprising:
`creating a plurality of modules of optoelectronic devices,
`each of said modules being created by
`forming a plurality of lead flame substrates such that at
`least one of said substrates has an input electrical
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`terminal and at least one of said lead frame substrates
`has an output electrical terminal;
`applying an insulator material onto portions of said lead
`frame substrates to create a unit of spaced lead frame
`substrates;
`forming at least one connector that is interconnected
`with said lead frame unit;
`mechanically connecting said at least one connector on
`each module with a connector of another module;
`and
`electrically connecting the output electrical terminal of
`at least one of said modules with the input electrical
`terminal 0f another module.
`34- The method 0f claim 33~ further comprising:
`electrically connecting the input terminal of at least one of 15
`said modules with a power supply.
`35. The method of claim 33, wherein said module creating
`step further comprises:
`
`10
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`forming a reflector unit having a plurality of reflectors;
`and
`affixing said reflector unit to said unit of spaced lead
`frame substrates such that a reflector is disposed adja-
`cent to each of said optoelectronic devices.
`36- The method 0f claim 35, WhCICiIl said ICflCCtOI unit
`forming step includes:
`forming at least one male connector on each reflector unit;
`and
`forming at least one female connector on each reflector
`unit.
`37, The method of claim 33, wherein said electrically
`connecting step includes:
`affixing a lead wire between the output electrical terminal
`of at least one of said modules and the input electrical
`terminal on another module.
`
`a:
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`*
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`a:
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`*
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`*
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