Thomas W. Kenny
`Department of Mechanical Engineering, Stanford University, Stanford, CA 94305-4021
`Home : 2820 Greenwich St #2, San Francisco, CA 94123
`(415) 725-3805 kenny@cdr.stanford.edu
`
`• University of Minnesota, Minneapolis
`BS
`Physics March 1983
`
`Education
`• University of California, Berkeley
`Ph D Physics
`June 1989
`Experience
`Senior Associate Dean of Engineering for Student Affairs, Stanford. 7/15-present.
`Founder, Member Board of Directors, Applaud Medical 11/14-present.
`• Non-invasive therapy for Kidney Stones
`Founder, Member, Board of Directors, Chair of Technical Advisory Board, SiTime 8/04-11/14
`• CMOS-Compatible MEMS Resonators for Electronic Products.
`CTO and Founder Cooligy, 6/02-3/05
`• Liquid cooling of microprocessors and other high power-density electronic devices.
`Program Manager, DARPA Microsystems Technology Office, 10/06-10/10
`• Launched $250M program on Nanotechnology, Thermal Management and Nanomanufacturing.
`Professor, Department of Mechanical Engineering, Stanford University, 1/94-Present
`• Leading Micromechanical Systems Research Group, with emphasis on development of high-
`performance microsensors, and measurements of fundamental properties of microstructures.
`• Active research in Micromechanical Resonators for Time References, Encapsulated Inertial
`Sensors, Optimal Design of MEMS Structures, Wafer-Scale Packaging of MEMS Devices.
`• Teaching Mechatronics, Sensors and Measurement, and others
`Staff Scientist, Technical Group Leader, Jet Propulsion Laboratory, 7/89-1/94.
`• Led the design, construction, and characterization of novel micromachined Si infrared detectors
`magnetometers and accelerometers based on an electron tunneling displacement transducer.
`Fully packaged tunneling sensors were delivered to collaborators for characterization.
`Participated in development of meterological instrumentation (pressure, wind, temperature,
`humidity,...), seismological
`instrumentation, deformable optical elements,
`instrumented
`neurological probes, soil chemistry apparatus, calibration parts for space telescopes,...
`Research Assistant, Physics Department, University of California, Berkeley. 1/84-7/89.
`• Measured of the heat capacity of 4He submonolayers on metallic films, showing them to be in a
`2-dimensional Bose gas phase, in contradiction to similar measurements on other substrates.
`Honors
`• Recipient
`• Recipient
`• Recipient
`• Recipient
`• Winner
`• Recipient
`• Recipient
`• Recipient
`• Recipient
`• Recipient
`
`Stanford Presidential Award for Excellence in Diversity
`Tau Beta Pi Teaching Honor Roll
`IEEE Daniel Noble Award for Emerging Technologies
`IEEE Sensors Council Technical Achievement Award
`Coed Ultimate Frisbee National and World Champion
`NSF CAREER Award
`Terman Fellowship
`R+D 100 Award
`Distinguished Teaching Award
`AT&T Bell Laboratories Fellowship
`
`•
`
`6/19
`6/19
`9/18
`9/11
`11/98, 11/99
`7/95
`7/94
`5/93
`6/89
`8/86-6/89
`
`APPLE 1004
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`Litigation Experiences
`• 2019 retained as Expert witness in case related to wearable baby monitors, including
`motion and temperature sensors. Case settled during drafting of expert infringement
`report.
`• 2018, retained as Expert witness by attorneys representing Apple in a case related to
`algorithms for sensing motion and other physiological parameters in wearable devices,.
`
`• 2015, Expert Witness in Mayfonk –vs- Nike patent infringement suit brought by
`Mayfonk. I prepared expert reports on validity and non-infringement. The case settled
`just before depositions were taken. I was compensated by Nike for this work. This was
`
`• 2013-2014, Expert Witness in ST Microelectronics –vs- Invensense patent infringement
`suit brought by ST. I assisted in claim construction, prepared expert reports on claim
`construction, validity and infringement, and provided deposition testimony. I was
`
`• 2016, Expert Witness in case involving optical proximity sensors in smartphones. I was
`retained by HTC America and Capella, who were defendants in the case. I was
`compensated by defendants for work involving Invalidity and Non-Infringement reports,
`and was deposed after expert reports on invalidity and non-infringement. This case
`settled just a few weeks before trial in march 2017. This was Case Action No. 2:15-cv-
`
`Case settled after going on hold for IPR evaluation of IP.
`1524-JRG in Marshall Texas.
`case # Civil No.3:14-cv-00423-MO in the District of Oregon.
`compensated by Invensense for this work. This was ITC Investigation # 337-TA-876.
`this work.
`proceeding Rg. 50253/2011.
`
`• 2011-2012, Expert Witness in St. Jude Medical-vs-Volcano Corp patent infringement suit
`and counter suit. Assisted in claim construction, prepared expert reports, provided
`deposition testimony and trial testimony. I was compensated by Volcano Corporation for
`
`• 2011, Retained by Maxim Integrated Systems to examine documents and prepare
`opinions as to the value of certain documents in the possession of former employees of
`ST Microelectronics. I was compensated by Maxim for this work. This was Italian
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`Books :
`J.E. Carryer, M.Ohline and T.W. Kenny, “Introduction to Mechatronic Design”, Pearson (2011).
`Refereed Journal Publications:
`
`1.
`
`I.B. Flader, Y. Chen, Y. Yang, E.J. Ng, D.D. Shin, D.B. Heinz, L. Comenencia Ortiz,
`A.L Alter, W. Park, K.E. Goodson, T.W. Kenny, “Micro-Tethering for Fabrication of
`Encapsulated Inertial Sensors with High Sensitivity”, JMEMS (2019).
`H.J. Kim, K. Kaplan, P. Schindler, S. Xu, M.M. Winterkorn, D. Heinz, T. English, J,
`Provine, F.B. Prinz, T. Kenny, “Electrical Properties of Ultrathin Platinum Films by Plasma
`Enhanced Atomic Layer Deposition”, ACS Applied Materials and Interfaces, 11, 9594 (2019).
`J. Rodriguez, S.A.Chandorkar, C.A. Watson, G.M, Glaze, C.H. Ahn, E.J. Ng, Y. Yang,
`T.W. Kenny, “Direct Detection of Akhiezer Damping in a Silicon MEMS Resonators”,
`Scientific Reports 9, 2244 (2019).
`J.M.L. Miller, A. Ansari, D.B. Heinz, Y. Chen, I.B. Flader, D.D. Shin, L.G.
`Villanueva and T.W. Kenny, “Effective Quality Factor Tuning Mechanisms in
`Micromechanical Resonators”, Applied Physics Reviews 5, 041307 (2018).
`J.M.L. Miller, H. Zhu, D.B. Heinz, Y. Chen, I.B. Flader, D.D. Shin, J.E-Y. Lee, T.W.
`Kenny, “Thermal-Piezoresistive Tuning of the Effective Quality Factor of a MicroMechanical
`Resonator”, Physical Review Applied, 10, 044055 (2018).
`J. Rodriguez, S.A.Chandorkar, G.M, Glaze, D.D. Gerrard, Y. Chen, D.B. Heinz, I.B.
`Flader, T.W. Kenny, “Direct Detection of Anchor Damping in MEMS Tuning Fork
`Resonators”, JMEMS 99, 1 (2018).
`M. Mellema, W. Behnke-Parks, A. Luong, M. Hopcroft, Claire Mills, S. Ho, R. Hsi, D.
`Laser, T. Kenny, R. Grubbs, M. Stoller, “Absence of Ureteral/Renal Injury Following Low-
`Intensty Extracorporeal Acoustic Energy Lithotripsy with Stone-Targeting Microbubbles in an
`in-vivo Swine Model”, The Journal of Urology 199,4 pe479, (2018).
`L. Comenencia Ortiz, D.B. Heinz, I.B. Flader, A.L. Alter, D.D. Shin, Y. Chen and
`T.W. Kenny, “Assessing failure in epitaxially encapsulated micro-scale sensors using micro
`and nano x-ray computed tomography”, MRS Communications 8, 275 (2018).
`M.T. Barako, T.S. English, S. Roy-Panzer, T.W. Kenny and Kenneth E Goodson,
`“Dielectric barrier layers by low-temperature plasma-enhanced atomic layer deposition of
`silicon dioxide”, Thin Solid Films 649, 24 (2018).
`Y. Chen, I.B. Flader, D.D. Shin, C.H. Ahn, J. Rodriguez and T.W. Kenny, “Robust
`10.
`Method of Fabricating Epitaxially Encapsulated MEMS Devices with Large Gaps”, JMEMS
`26, 1235 (2017).
`11. W. Park, D.D. Shin, S.J. Kim, J.S. Katz, J. Park, C.H. Ahn, T. Kodama, M. Asheghi,
`T.W. Kenny, K.E. Goodson, “Phonon Conduction in Silicon Nanobeams”, Appl, Phys. Lett.
`110, 213102 (2017).
`F. Purkl, A.Daus, T. English, J Provine, A. Feyh, G. Urban, T. Kenny, “Measurement of
`12.
`Young's modulus and residual stress of atomic layer deposited Al2O3 and Pt thin films”, J.
`Micromech. Microeng. 27, 085008 (2017)
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`G.Agarwal, T. Kazior, T. Kenny, D. Weinstein, “Modeling and analysis for thermal
`13.
`management in Gallium Nitride HEMTs using microfluidic cooling”, Journal of Electronic
`Packaging 139, 11001 (2017).
`14.
`J. Atalaya, T.W. Kenny, M.L Roukes, M.I Dykman, “Nonlinear damping and dephasing
`in nanomechanical systems”, Physical Review B, 94, 15440 (2016).
`O. Shoshani, D. Heywood, Y. Yang, T.W. Kenny, and S.W. Shaw, “Phase Noise
`15.
`Reduction in an MEMS Oscillator Using a Nonlinearly Enhanced Synchronization Domain”,
`JMEMS 25 (2016).
`Y. Yang, E.J. Ng, P.M. Polunin, Y.Chen, I.B. Flader, S.W. Shaw, M.I. Dykman, and
`16.
`T.W. Kenny, “Nonlinearity of Degenerately Doped Bulk-Mode Silicon MEMS Resonators”,
`JMEMS 25, 859 (2016).
`T.S. English, J Provine, A.F. Marshall, A.L. Koh, T.W. Kenny, “Parallel preparation of
`17.
`plan-view transmission electron microscopy specimens by vapor-phase etching with
`integrated etch stops”, Ultramicroscopy 166, 39 (2016).
`Y. Yang, E.J. Ng, Y. Chen, I.B. Flader, T.W. Kenny, “A Unified Epi-Seal Process for
`18.
`Fabrication of High-Stability Microelectromechanical Devices”, JMEMS 25, 489 (2016).
`D.B. Heinz, V.A. Hong, C.H. Ahn, E.J. Ng, Y. Yang, and T.W. Kenny, “Experimental
`19.
`Investigation into Stiction Forces and Dynamic Mechanical Anti-Stiction Solutions in Ultra-
`Clean Encapsulated MEMS Devices”, JMEMS 25, 469 (2016)
`P.M. Polunin, Y. Yang, M.I. Dykman, T.W. Kenny, and S.W. Shaw, “Characterization of
`20.
`MEMS Resonator Nonlinearities Using the Ringdown Response”, JMEMS 25, 297 (2016).
`C.H. Ahn, E.J Ng, V.A Hong, J. Huynh, S. Wang, and T.W. Kenny, “Characterization
`21.
`of Oxide-Coated Polysilicon Disk Resonator Gyroscope Within a Wafer-Scale Encapsulation
`Process”, JMEMS 24, 1687 (2015).
`B.W. Soon, Y. Qian, E.J. Ng, V.A. Hong, Y. Yang, C.H. Ahn, T.W. Kenny, and C. Lee,
`22.
`“Investigation of a Vacuum Encapsulated Si-to-Si Contact Microswitch Operated From− 60°
`C to 400° C”, JMEMS 24 1906, (2015).
`Y. Won, Y. Gao, R. Guzman de Villoria, B.L. Wardle, R. Xiang, S. Maruyama, T.W.
`23.
`Kenny, and K.E. Goodson, “Nonhomogeneous morphology and the elastic modulus of aligned
`carbon nanotube films”, Journal of Micromechanics and Microengineering 25, 115023 (2015).
`24.
`M.T Barako, S. Roy-Panzer, T.S. English, T. Kodama, M. Asheghi, T.W. Kenny, and
`K.E. Goodson, “Thermal Conduction in Vertically Aligned Copper Nanowire Arrays and
`Composites”, ACS Applied Materials and Interfaces, 34, 19251 (2015).
`V. Zega, S.H. Nitzan, M. Li, C.H. Ahn, E. Ng, V. Hong, Y.Yang, T.W. Kenny, A.
`25.
`Corigliano, and D.A. Horsley, “Predicting the closed-loop stability and oscillation amplitude
`of nonlinear parametrically amplified oscillators
”, Appl. Phys. Lett. 106, 233111 (2015).
`S.H. Nitzan, V. Zega, M. Li, C.H. Ahn, A. Corigliano, T.W. Kenny and D.A. Horsley,
`26.
`“Self-Induced Parametric Amplification arising from Nonlinear Elastic Coupling in a
`Micromechanical Resonating Disk Gyroscope”, Scientific Reports 5:9036 (2015)
`C.H. Ahn, E.J. Ng, V.A. Hong, Y.Yang, B. Lee, I. Flader and T.W. Kenny, “Mode-
`27.
`Matching of Wineglass-Mode Disk Resonator Gyroscope in (100) Single Crystal Silicon”,
`JMEMS 24, 343 (2015).
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`V.A. Hong, S. Yoneoka, M.W. Messana, A.B. Graham, J.C. Salvia, T.T.
`28.
`Branchflower, E.J. Ng and T.W. Kenny, “Fatigue Experiments on Single-Crystal Silicon in
`an Oxygen-Free Environment”, JMEMS 24, 351 (2015).
`E.J. Ng, V.A. Hong, Y. Yang, C.H. Ahn, C.L.M. Everhart and T.W. Kenny,
`29.
`“Temperature Dependence of the Elastic Constants of Doped Silicon”, JMEMS 24 730,
`(2015)
`C.L. Roozeboom, B.E. Hill, V.A. Hong, C.H. Ahn, E.J. Ng, Y. Yang, T.W. Kenny,
`30.
`M.A. Hopcroft and B.L. Pruitt, “Multifunctional Integrated Sensors for MultiParameter
`Monitoring Applications”, JMEMS 24, (2015).
`S. Ghaffari, E.J. Ng, C.H. Ahn, Y.Yang, S. Wang, V.A. Hong, and T.W. Kenny,
`31.
`“Accurate Modeling of Quality Factor Behavior of Complex MEMS Resonators”, JMEMS
`24, 276 (2015)
`C.H. Ahn, S. Nitzan, E.J. Ng, V.A. Hong, Y. Yang, T. Kimbrell, D.A. Horsley, and
`32.
`T.W. Kenny, “Encapsulated High Frequency (235 kHz), High-Q (100k) Disk Resonator
`Gyroscope with Electrostatic Parametric Pump”, Applied Physics Letters, 105, 243504
`(2014).
`B.W. Soon, E.J. Ng, V.A. Hong, Y. Yang, C.H. Ahn. Y. Quan, T.W. Kenny and C. Lee,
`33.
`“Fabrication and Characterization of a Vacuum-Encapsulated Curved Beam Switch for Harsh
`Environment Application”, JMEMS 23, 1121 (2014).
`34.
`Y.Won, Y. Gao, M.A. Panzer, R.Xiang, S. Maruyama, T.W. Kenny, W. Cai, and K.E.
`Goodson, “Zipping, entanglement, and the Elastic Modulus of Aligned Single-Walled Carbon
`Nanotube Films”, Proceedings of the National Academy of Sciences, 110, 20426 (2013).
`35. M.A. Philippine, H. Zareie, O. Sigmund, G.M. Rebeiz, and T.W. Kenny, “Experimental
`Validation of Topology Optimization for RF MEMS Capacitive Switch Design”, JMEMS 22,
`1296 (2013).
`S. Ghaffari, S.A. Chandorkar, S. Wang, E.J. Ng, C.H Ahn, V. Hong, Y. Yang, and
`36.
`T.W. Kenny, “Quantum Limit of Quality Factor in Silicon Micro and Nano Mechanical
`Resonators”, Scientific Reports, 3:3244 (2013).
`M. Li, E.J. Ng, V.A. Hong, C.H. Ahn, Y. Yang, T.W. Kenny and D.A. Horsley,
`37.
`“Lorentz Force Magnetometer using a Micromechanical Oscillator”, Appl. Phys. Lett 103,
`(2013)
`H.K. Lee, R. Melamud, B. Kim, S. Chandorkar, J.C. Salvia and T.W. Kenny, “The
`38.
`effect of Temperature-Dependent Nonlinearities on the Temperature Stability of
`Micromechanical Resonators”, J. Appl. Phys. 114, (2013)
`R.G. Hennessy, M.M. Shulaker, M. Messana, A.B. Graham, N. Klewa, J. Provine, T.W.
`39.
`Kenny and R.T. Howe, “Vacuum Encapsulated Resonators for Humidity Measurement”,
`Sensors and Actuators B-Chemical 185, 575 (2013)
`S. Ghaffari, C.H. Ahn, E.J. Ng, S. Wang and T.W. Kenny, “Crystallographic Effects in
`40.
`Modeling Fundamental behavior in MEMS Silicon Resonators”, Microelectronics Journal 44,
`586 (2013)
`E. Ng, H-K Lee, C-H Ahn, R. Melamud and T.W. Kenny, “Stability of Silicon
`41.
`Microelectromechanical Systems Resonant Thermometers”, IEEE Sensors 13, (2013).
`42. M.A. Philippine, O. Sigmund, G.M Rebeiz, and T.W. Kenny, “Topology Optimization
`of Stressed Capacitive RF MEMS Switches,” JMEMS 22, 206 (2013).
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`J.C. Duda, T.S. English. E.S. Piekos, T.E. Beechem, T.W. Kenny and P.E. Hopkins,
`43.
`“Bidirectionality tuning Kapitza conductance through the inclusion of Substitutional
`Impurities”, J. Appl. Phys 112, (2012).
`S. Yoneoka, J. Lee, M. Liger, G. Yama, T. Kodama, M. Gunji, R.T. Howe, K.E.
`44.
`Goodson and T.W. Kenny, “Electrical and Thermal Conduction in Atomic Layer Deposition
`Nanobridges down to 7nm Thickness”, NanoLett, 12 (2) 683 (2012).
`Y. Won, J.Lee, M. Asheghi, T.W. Kenny, and K.E. Goodson “Phase and thickness
`45.
`dependent modulus of Ge 2Sb 2Te 5 films down to 25 nm thickness”, Appl. Phys. Lett 100,
`161905 (2012).
`Y. Won, Y. Gao. M.A. Panzer, S. Dogbe, L. Pan, T.W. Kenny, and K.E. Goodson,
`46.
`“Mechanical Characterization of Aligned Milti-Walled Carbon Nanotube Films using
`Microfabricated Resonators”, Carbon 50, 347 (2012)
`H.K. Lee, R. Melamud, S. Chandorkar, J.G. Salvia, S. Yoneoka and T.W. Kenny,
`47.
`“Stable Operation of MEMS Oscillators Far Abve the Critical Vibration Amplitude in the
`Nonlinear Regime”, JMEMS Letters 20,1228 (2011).
`48.
`K.P. Bloschock, A.R. Schofield, and T.W Kenny, “Tip-Based Nanofabrication : An
`Approach to True Nanotechnology”, Proceedings of the SPIE 8031, 803102 (2011).
`H.K. Lee, R. Melamud, B. Kim, M.A. Hopcroft, J.G. Salvia, and T.W. Kenny,
`49.
`“Electrostatic Tuning to Achieve Higher Stability Micromechanical Composite Resonators”,
`JMEMS 20, 1355 (2011).
`G. Bahl, S. Wang, J.C. Salvia, R. Melamud, R.T. Howe and T.W. Kenny, “AC
`50.
`Polarization for Charge-Drift Elimination in Resonant Electrostatic MEMS and Oscillators”,
`IEEE JMEMS 20, 355-364 (2011).
`H.K. Lee, B. Kim, R. Melamud, M.A. Hopcroft, J.C. Salvia and T.W. Kenny,
`51.
`“Influence of the Temperature-Dependent Nonlinearities on the Performance of
`Micromechanical Resonators”, Appl. Phys. Lett 99, 194102 (2011).
`Y. Won, E.N. Wang, K.E. Goodson and T.W. Kenny, “3-D Visualization of Flow in
`52.
`Microscale Jet Impingement Systems”, International Journal of Thermal Sciences, 50, 325
`(2011).
`K-L. Chen, S. Wang, J.C. Salvia. R. Melamud R.T. Howe and T.W. Kenny, “Wafer-
`53.
`Level Epitaxial Silicon Packaging for Out-of Plane RF MEMS Resonators with Integrated
`Actuation Electrodes”, IEEE Transactions on Components, Packaging and Manufacturing
`Technology Vol 1, 310-317 (2011).
`G. Hill, D. Soto, A. Peattie, R.J. Full, T.W. Kenny, “Orientation angle and the adhesion
`54.
`of single gecko setae”, Journal of the Royal Society Interface, Vol 8 926-933 (2011).
`S. Yoneoka, J.C. Salvia, G. Bahl, R. Melamud, S.A, Chandorkar, and T.W. Kenny,
`55.
`“Active Electrostatic Compensation of Micromechanical Resonators under Random
`Vibrations”, IEEE JMEMS 19, 1270 (2010).
`56.
`A.R. Schofield, K,P, Bloschock, and T.W Kenny, “Tip-Based Nanofabrication : An
`Approach to True Nanotechnology”, Proceedings of the SPIE 7637, 76371 (2010).
`D. Soto, G. Hill, A. Parness, N. Esparza, M. Cutkosky, and T. Kenny, “Effect of Fibril
`57.
`Shape on Adhesive Properties”, Appl. Phys Lett 97, 153701 (2010).
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`58. M.A. Hopcroft, W.D. Nix, T.W. Kenny, “What is the Young’s Modulus of Silicon?”,
`IEEE JMEMS 19, 229 (2010).
`S. Yoneoka, C.S. Roper, R.N. Candler, S.A. Candorkar, A.B. Graham, J. Provine, R.
`59.
`Maboudian, R.T. Howe, and T.W. Kenny, “Characterization of Encapsulated
`Micromechanical Resonators Sealed and Coated with Polycrystalline SiC”, IEEE JMEMS 19,
`357 (2010).
`A.B. Graham, M.W. Messana, P.G. Hartwell, J. Provine, S. Yoneoka, R. Melamud, B.
`60.
`Kim, R.T. Howe and T.W. Kenny, “A Method for Wafer-Scale Encapsulation of Large
`Lateral-Deflection MEMS Devices”, IEEE JMEMS 19, 28 (2010).
`G. Bahl, R. Melamud, B. Kim, S.A. Chandorkar, J.C. Salvia, M.A. Hopcroft, D.
`61.
`Elata, R.G. Hennessy, R.N. Candler, R.T. Howe and T.W. Kenny, “Model and Observations
`of Dielectric Charge in Thermally-Oxidized Silicon Resonators”, IEEE JMEMS 19, 162,
`(2010).
`J.C. Salvia, R. Melamud, S.A. Chandorkar, S.F. Lord and T.W. Kenny, “Real-Time
`62.
`Temperature Compensation of MEMS Oscillators using an Integrated Micro-Oven and a
`Phase-Locked Loop”, IEEE JMEMS 19, 192 (2010).
`R. Melamud, S.A. Chandorkar, B. Kim, HK Lee, J. Salvia, G. Bahl, MA Hopcroft,
`63.
`and TW Kenny, “Temperature-Insensitive Composite Micromechanical Resonators”, IEEE
`JMEMS 18, 1409 (2009).
`V. Ayanoor-Vitikkate, K-L Chen, W.T. Park, T.W. Kenny, “Development of Wafer-
`64.
`Scale Encapsulation Process for Large Displacement Piezoresistive MEMS Device”, Sensors
`and Actuators A 156, 275 (2009).
`K-L Chen, J. Salvia, R. Potter, R.T. Howe, and T.W. Kenny, “Performance evaluation
`65.
`and equivalent model of silicon interconnects for fully-encapsulated RF MEMS devices”,
`IEEE Transactions on Advanced Packaging 32, p. 402-9 (2009).
`S.A. Chandorkar, R.N Candler, A. Duwel, R. Melamud, M. Agarwal, K.E. Goodson,
`66.
`T.W. Kenny, “Multimode thermoelastic dissipation”, Journal of Applied Physics105, P
`043505 (13 pp.) (2009).
`B. Kim, R.N. Candler, R. Melamud, M.A. Hopcroft, S. Yoneoka, H-K Lee, M.
`67.
`Agarwal, S.A. Chandorkar, G. Yama, and T.W. Kenny, “Hermeticity and diffusion
`investigation in polysilicon film encapsulation for microelectromechanical systems”, Journal
`of Applied Physics105 pp. 013514 (10 pp.), (2009).
`C.M. Jha, J. Salvia, S.A. Chandorkar, R. Melamud, E. Kuhl, T.W. Kenny,
`68.
`“Acceleration insensitive encapsulated silicon microresonator”, Applied Physics Letters 93 P.
`234103 (3 pp.) (2008)
`B. Kim, M.A. Hopcroft, R.N. Candler, C.M. Jha, M. Agarwal, R. Melamud, S.A.
`69.
`Chandorkar, G. Yama, T.W. Kenny, “Temperature Dependence of Quality Factor in MEMS
`Resonators”, JMEMS 17, 755 (2008).
`70. M. Agarwal, SA Chandorkar, H. Mehta, RN Candler, B, Kim, MA Hopcroft, R.
`Melamud, TW Kenny, and B. Muhrmann, “A Study of Electrostatic Force nonlinearities in
`Resonant Microstructures”, Appl. Phys Lett. 92, 104 (2008).
`71. M. Swartwout, C Kitts, R. Twiggs, T.W. Kenny, B.R. Smith, R. Lu, K. Stattenfield, F.
`Pranajaya, “Mission Results for a Student-Built Satellite”, ACTA Astronautica 62, 521
`(2008).
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`C.M. Jha, M.A. Hopcroft, S.A. Chandorkar, J.C. Salvia, M. Agarwal, R.N Candler,
`72.
`R. Melamud, B. Kim, and T.W. Kenny, “Thermal Isolation of Encapsulated MEMS
`Resonators”, JMEMS 17, 175 (2008).
`73. W.T. Park, K.N. O’Connor, K.L. Chen, J.R. Mallon, T. Maetani, P. Dalal, R.N.
`Candler, V. Ayanoor-Vitikkate, J.B. Roberson, S. Puria, and T.W. Kenny, “Ultraminiature
`Encapsulated Accelerometers as a Fully-Implantable Sensors for Implantable Hearing Aids”,
`Biomedical MicroDevices 9, 939 (2007).
`74. M. Bartsch, W. Federle, R.J. Full and T.W. Kenny, “A Multi-Axis Force Sensor for the
`Study of Insect Biomechanics”, JMEMS 16, 709 (2007).
`75. M.Agarwal, H.Mehta, R.N. Candler, S.A. Chandorkar, B. Kim, M.A. Hopcroft,
`R.Melamud, G. Bahl, G. Yama2, T. W. Kenny and B. Murmann, “Scaling of A-f
`nonlinearities in electrostatically transduced microresonators”, Journal of Applied Physics
`102, 74903 (2007).
`B. Kim, R.N. Candler, M.A. Hopcroft; M. Agarwal, WT Park, T.W. Kenny,
`76.
`“Frequency stability of wafer-scale film encapsulated silicon based MEMS resonators ”
`Sensors and Actuators A (Physical), 136, 125 (2007).
`77. M.A. Hopcroft, B. Kim, S. Chandorkar, R. Melamud, M. Agarwal, C.M. Jha, G.
`Bahl, J.Salvia, H.Mehta, H.K.Lee, R.N.Candler, T.W.Kenny, “Using the Temperature
`Dependence of Resonator Quality Factor as a Thermometer”, Appl. Phys. Lett. 91,
`13505 (2007).
`J. Bower, C. Mehls, N. Vora, R. Torii, and T Kenny, “Effect of Surface Roughness on
`78.
`Thin Film Niobium Coatings”, IEEE Transactions on Applied Superconductivity 2, 768
`(2007).
`O. Ajakaiye, J. Grade, C. Shin, and T. Kenny, “Wafer-Scale Fabrication of Infrared
`79.
`Detectors based on Tunneling Displacement Transducers”, Sensors and Actuators A
`(Physical) 134, 575 (2007).
`C. M. Jha, G. Bahl, R. Melamud, S. A. Chandorkar, M. A. Hopcroft, B. Kim, M.
`80.
`Agarwal, J. Salvia, H. Mehta, and T. W. Kenny, “High Resolution microresonator-based
`digital temperature sensor”, Appl. Phys. Lett 91, 74101 (2007).
`R. Melamud, B. Kim, S.A. Chandorkar, M.A. Hopcroft, M. Agarwal, C.M. Jha and
`81.
`T.W. Kenny, “Temperature Compensated High-Stability Silicon Resonators”, Appl. Phys.
`Lett. 90, 244107 (2007).
`C.M. Jha, M.A. Hopcroft, S.A. Chandorkar, J.Salvia, M.Agarwal,R.N. Candler,
`82.
`R.Melamud, B.Kim, and Thomas W. Kenny, “Thermal Isolation of Encapsulated MEMS
`Resonators” Accepted with Minor Revision JMEMS (2007).
`83. M. Agarwal, K.K. Park, S.A. Chandorkar, R.N. Candler, B. Kim, M.A. Hopcroft, R.
`Melamud, T.W. Kenny, and B. Murmann, “Acceleration sensitivity in beam-type
`electrostatic microresonators”, Appl. Phys. Lett. 90, 14103 (2007).
`84. M. Agarwal, S.A. Chandorkar, R.N. Candler, B. Kim, M.A. Hopcroft, R. Melamud,
`C.M. Jha, T.W. Kenny and B. Murmann “Optimal drive condition for nonlinearity reduction
`in electrostatic MEMS resonators”, Appl. Phys. Lett., 89, (2006)
`R.N. Candler, M.A. Hopcroft, B. Kim, W.-T. Park, R. Melamud, M. Agarwal, G.
`85.
`Yama, A. Partridge, M. Lutz, and T.W. Kenny, “Long-Term and Accelerated Life Testing of a
`Novel Single-Wafer Vacuum Encapsulation for MEMS Resonators”, JMEMS 15, 1446
`(2006).
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`

`E.N. Wang, S. Devasenathipathy, H. Lin, C.H. Hidrovo, J.G. Santiago, K.E. Goodson,
`86.
`and T.W. Kenny, “A Hybrid Method for Bubble Geometry Reconstruction in Two-Phase
`Microchannels”, Experiments in Fluids 40, 847 (2006).
`C.H. Hidrovo, T.A. Kramer, E.N. Wang, S.Vigneron, J.E. Steinbrenner, J.M. Koo,
`87.
`F.M. Wang, D.W. Fogg, R.D. Flynn, E.S. Lee, C.H. Cheng, T.W. Kenny, J.K. Eaton, and
`K.E. Goodson, “Two-Phase Microfluidics for Semiconductor Circuits and Fuel Cells,” Heat
`Transfer Engineering, 27, 53 (2006).
`T.W. Kenny, K.E. Goodson, J.G Santiago, E.N.Wang, J-M Koo, L. Jiang, E. Pop, S.
`88.
`Sinha, L. Zhang, D. Fogg, S. Yao, R. Flynn, CH Chang, C.H. Hidrovo, “Advanced Cooling
`Technologies for Microprocessors”, International Journal of High Speed Electronics and
`Systems, 15, 301 (2006).
`A. Duwel, R.N. Candler, T.W. Kenny, M. Varghese, “Engineering MEMS Resonators
`89.
`with Low Thermoelastic Damping”, IEEE JMEMS 15, 1437 (2006).
`R.N. Candler, A. Duwel, M. Varghese, S. Chandorkar, M. Hopcroft, W.T. Park, B.
`90.
`Kim, G. Yama, A. Partridge, M. Lutz, and T.W. Kenny, “Impact of Geometry on
`Thermoelastic Dissipation in Micromechanical Resonant Beams”, IEEE JMEMS 15, 927
`(2006).
`91. W.T. Park, A. Partridge, R.N. Candler, V. Ayanoor-Vitikkate, G. Yama, M. Lutz, and
`T.W. Kenny, “Encapsulated Sub-Millimeter Piezoresistive Accelerometers”, JMEMS 15, 507
`(2006).
`E.N. Wang, S. Devasenathipathy, J.G. Santiago, K.E. Goodson, and T.W. Kenny,
`92.
`“Nucleation and Growth of Vapor Bubbles in a Heated Silicon Microchannel,” ASME
`Journal of Heat Transfer, Vol. 128, p. 497. (2004)
`93.
`B.W. King, T.W. Kenny, and K.E Goodson, “Comparison of Thermal and Piezoresistive
`Sensing Approaches for Atomic Force Microscopy Topography Measurements”, Appl. Phys.
`Lett. 85, 2086 (2004).
`E.N. Wang, L. Zhang, L. Jiang, J.M. Koo, J.G. Maveety, E.A. Sanchez, K.E. Goodson,
`94.
`and T.W. Kenny, “Micromachined Jets for Liquid Impingement Cooling of VLSI Chips”,
`JMEMS 13, 833 (2004).
`L. Zhang, E.N. Wang, K.E. Goodson, and T.W. Kenny, “Phase Change Phenomena in
`95.
`Silicon Microchannels”, International Journal of Heat and Mass Transfer 48, 1572 (2005).
`E.N. Renuart, A.M. Fitzgerald, T.W. Kenny, R. H. Dauskardt, “Fatigue Crack Growth in
`96.
`Micromachined Silngle Crystal Silicon”, Journal of Materials Research 19, 2635 (2004).
`97.
`J.P. Lynch, A. Sundararajan, K.H. Law, A.S. Kiremidjian, T. Kenny and S. Carryer,
`“Embedment of structural monitoring algorithms in a wireless sensing unit”, Structural
`Engineering and Mechanics, 15, 285-97 (2003).
`R.N. Candler, W.T. Park, H.M. Li, G. Yama, A. Partridge, M. Lutz, and T.W. Kenny,
`98.
`“Single Wafer Encapsulation of MEMS Devices”, IEEE Transactions on Advanced packaging
`26, 227 (2003).
`J.P. Lynch, A. Partridge, K.H. Law, T.W. Kenny, A.S. Kiremidjian,E. Carryer, “Design
`99.
`of Piezoresistive MEMS-based Accelerometer for Integration with Wireless Sensing Unit for
`Structural Monitoring”, Journal of AeroSpace Engineering, 16, 108 (2003).
`
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`

`100. Y. Hishinuma, T. Geballe, B. Moyzhes, and T.W. Kenny, “Measurements of Cooling by
`Room-Temperature Thermionic Emission across a Nanometer Gap” Journal of Applied
`Physics 94,4690 (2003).
`E.M. Chow, A. Partridge, V. Chandrasekaran, M. Sheplak, C.F. Quate, and T.W.
`101.
`Kenny, “Process-Compatible Polysilicon-Based Through-Wafer Interconnects in Silicon
`Substrates”, JMEMS, 11,631 (2002).
`102. K. Autumn, M. Sitti, Y.A. Liang, A.M. Peattie, W.R. Hansen, S. Sponberg, T.W. Kenny,
`R. Fearing, J.N. Israelachvili, and R.J. Full, “Evidence for van der Waals adhesion in gecko
`setae”, Proceedings of the National Academy of Science, 99, 12252 (2002).
`103. K.E. Goodson, J.G. Santiago, T.W. Kenny, L. Jiang,, S. Zeng, J.M. Koo, L. Zhang, S.
`Yao, and E.N. Wang, “Electroosmotic Microchannel Cooling System for Microprocessors,”
`Electronics Cooling, Vol. 8, No. 4, pp. 46-47. (2002)
`104. A.M. Fitzgerald, T.W. Kenny, and R.H Dauskardt, “Stress wave interference effects
`during fracture of silicon micromachined specimens," IEEE Special Issue on Experimental
`Mechanics 43,317, (2003).
`B.L. Pruitt, W.-T. Park, T. Kenny. Measurement System for Low Force and Small
`105.
`Displacement Contacts.” Journal of Micro-electro-mechanical Systems. 13, 220 (2004).
`106. W.P. King, T.W. Kenny, K.E. Goodson, G.L.W. Cross, M. Despont, U.T. Dürig, H.
`Rothuizen, G.K. Binnig, and P. Vettiger, “Design of Atomic Force Microscope Cantilevers
`For Combined Thermomechanical Writing and Thermal Reading in Array Operation,”
`Journal of MicroElectroMechanical Systems 11, 765 (2002).
`107. A.E. Herr, J.I. Molho, K.A. Drouvalakis, J.C. Mikkelsen, P.J. Utz, J.G. Santiago, and
`T.W. Kenny, “On-Chip Coupling of Isoelectric Focusing and Free Solution Electrophoresis
`for Multi-Dimensional Separations”, Analytical Chemistry 75, 1180 (2003)
`Jiang, L., Mikkelsen J., Koo J.-M., Huber D., Yao S., Zhang L., Zhou P., Maveety J.G.,
`108.
`Prasher R., Santiago J.G., Kenny T.W., & Goodson K.E., "Closed-loop electroosmotic
`microchannel cooling system for VLSI circuits", IEEE Transactions on Components &
`Packaging Technologies 25, 347 (2002).
`109. Y. Hishinuma, B.Y. Moyzhes, T.H. Geballe, and T.W. Kenny, “Vacuum Thermionic
`Refrigeration with a Semiconductor Heterojunction Structure”, Appl. Phys. Lett. 81, 4242
`(2002).
`B.L. Pruitt, T. Kenny. “Piezoresistive Cantilevers and Measurement System for Low
`110.
`Force Electrical Contact Measurements.” Sensors and Actuators, A 104, 68 (2003).
`111.
`J.Grade, H. Jerman, and T.W. Kenny, Design and Characterization of Large
`Displacement Electrostatic Actuators, JMEMS, 12, 335 (2003).
`E.M. Chow, G. Yaralioglu, C.F. Quate, and T.W. Kenny, Characterization of a Two-
`112.
`Dimensional Cantilever Array with Through-Wafer Electrical Interconnects, Appl. Phys Lett.
`80, 664 (2002).
`B.C. Stipe, H.J. Mamin, C.S. Yannoni, T.D. Stowe, T.W. Kenny and D. Rugar “Electron
`113.
`Spin Relaxation near a Micron-Sized Ferromagnet”, Phys. Rev. Lett. 87, 2776 (2001).
`B.C. Stipe, H.J. Mamin, T.D. Stowe, T.W. Kenny and D. Rugar, Non-contact friction and
`114.
`force fluctuations between closely spaced bodies, Phys. Lett. Rev. 8709, 6801 (2001).
`
`10
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`

`Rugar, B.C. Stipe, H.J. Mamin, C.S. Yannoni, T.D. Stowe, K.Y. Yasumura and T.W.
`115.
`Kenny Adventures in Attonewton Force Detection, Applied Physics A 72 [Suppl] S3-S10
`(2001).
`B. C. Stipe, H.J. Mamin, T.D.Stowe, T.W. Kenny and D. Rugar, Magnetic dissipation
`116.
`and fluctuations in individual nanomagnets measured by ultrasensitive cantilever
`magnetometry, Phys. Rev. Lett. 86 2874 (2001)
`L. Zhang, J.M. Koo, L. Jiang, K.E. Goodson, J.G. Santiago, and T.W. Kenny,
`117.
`Measurements and Modeling of Two-Phase Flow in Microchannels with Nearly-Constant
`Heat Flux Boundary Conditions, JMEMS 11,12 (2002).
`118.
`B.W. King, T.W. Kenny, K.E. Goodson, G. Cross, M. Despont, U. Durig, H. Rothuizen,
`G.K. Binnig, and P. Vettiger, Atomic Force Microscope Cantilevers for Combined
`Thermomechanical Data Writing and Reading, Appl. Phys. Lett. 78, 1300 (2001).
`119.
`T.W. Kenny, Nanometer-Scale Force Sensing with MEMS Devices, Invited Review ,
`IEEE Sensors 1,148 (2001).
`J.A. Harley and T.W. Kenny, A High-Stiffness Axial Resonant Probe for Atomic Force
`120.
`Microscopy, JMEMS 10, 434 (2001)
`121. Y. Hisunuma, T.H. Geballe , B.Y. Moyzhes, , and T.W Kenny, Refrigeration by
`Combined Tunneling and Thermionic Emission in Vacuum: Use of Nanometer Scale Design”,
`Appl. Phys. Lett. 78, 2572 (2001).
`J.I. Molho, A.E. Herr, B.P. Mosier, J.G. Santiago, T.W. Kenny, R.A Brennen, G.B.
`122.
`Gordon, B. Mohammadi, Optimization of Turn Geometries for On-Chip Electrophoresis,
`Analytical Chemistry 73, 1350 (2001).
`123. A.M. Fitzgerald, R.S. Iyer, R.H. Dauskardt, and T.W. Kenny, Sub-Critical Crack
`Growth in Single Crystal Silicon Using Micromachined Specimens, Journal of Materials
`Research 17, 683 (2002).
`124. C.H. Liu, and T.W. Kenny, A High-Precision, Wide-Bandwidth Micromachined
`Tunneling Accelerometer, JMEMS, 10,425 (2001)
`125. K. Autumn, Y. Liang, W.P. Chan, T. Hsieh, R. Fearing, T.W. Kenny, and R. Full, Dry
`Adhesive Force of a Single Gecko Foot-Hair, Nature. 405: 681-685 (2000).
`126. A.E. Herr, J.I. Molho, J.G. Santiago, M.G. Mungal, T.W. Kenny, and M.G. Garguilo,
`Electroosmotic Capillary Flow with Non-Uniform Surface Potential, Analytical Chemistry 72,
`1053-1057 (2000).
`E.M. Chow, H.T. Soh, H.C. Lee, J.D. Adams, S.C. Minne, G. Yaralioglu, A. Atalar, C.F.
`127.
`Quate, and T.W. Kenny, Integration of Through-Wafer Interconnects with a Two-
`Dimensional Cantilever Array, Sensors and Actuators 83, 118-123 (2000).
`128. K.Y. Yasumura, T.D. Stowe, E.M. Chow, T.E. Pfafman, T.W. Kenny, B. Stipe, and D.
`Rugar, Quality Factors in Micron- and Submicron-Thick Cantilevers, JMEMS 9, 117-125
`(2000).
`J.K. Reynolds, D.C. Catling, R.C. Blue, N. Maluf, T.W. Kenny, Packaging a
`129.
`piezoresistive pressure sensor for pressure and temperature stability in a Martian environment,
`Sensors and Actuators 83, 142-149 (2000).
`130. R. G. Rudnitsky, E.M. Chow, and T.W. Kenny, High-Speed Biological Screening with
`Magnetic Force Micro