`
`25.1
`
`A Digitally Enhanced 1.8V 15b 40MS/s
`CMOS Pipelined ADC
`
`E. Siragusa, I. Galton
`
`University of California at San Diego, La Jolla, CA
`
`The trends toward increased digital signal processing and
`tighter integration in communications and imaging systems
`have created a need for high-resolution, low-voltage ADCs with
`sample-rates above 20MHz. Pipelined ADCs are well-suited to
`such applications, but are sensitive to component mismatches
`and interstage gain errors, especially at low supply voltages.
`This paper demonstrates two digital background calibration
`techniques that address these problems in the context of a 1.8V
`CMOS pipelined ADC. Together, they enable the ADC to achieve
`90dB SFDR and 72dB peak SNR over the full 20MHz Nyquist
`band. The INL and DNL are 1.5LSB and 0.25LSB, respectively.
`
`As shown in Fig. 25.1.1, the ADC consists of 7 pipeline stages.
`Each stage resolves 9 levels with a gain of 4, so the ideal resolu-
`tion of the ADC is slightly above 15 bits. The calibration tech-
`niques, referred to as DAC noise cancellation (DNC) and gain
`error correction (GEC), respectively, are applied to the first three
`pipeline stages [1,2]. These stages, which are shown in Fig.
`25.1.2, differ from a conventional pipeline stage in 3 respects: 1)
`a dynamic element matching (DEM) DAC is used in place of a
`thermometer-encoded DAC, 2) a 1-bit pseudo-random number
`(PN) sequence, rGEC[n], which takes on values of ±Δ/4 referred to
`the DAC output is added to the input of the DAC, where Δ is the
`step-size of the flash ADC, and 3) the resolution of the DAC is
`increased to accommodate rGEC[n]. These modifications allow the
`DNC/GEC logic blocks to estimate and largely cancel the error
`sequences in the uncorrected ADC output resulting from DAC
`noise and non-ideal interstage gains. The estimation and cancel-
`lation are performed digitally in the background, transparent to
`normal ADC use.
`
`The DEM DAC consists of a DEM encoder followed by a segment-
`ed bank of 10 1-bit switched-capacitor DACs, 8 with a step-size
`of Δ and 2 with a step-size of Δ/2. For each input sample, the
`DEM encoder selects its 10 output bits such that the sum of the
`1-bit DAC outputs would equal the input value if there were no
`capacitor mismatches. For most input values, there are several
`different 10 bit combinations with this outcome. The choice of
`which such combination to use is made pseudo-randomly.
`
`The details of the DEM encoder are best described in terms of its
`9 switching blocks labeled Sseg and Sk,r. Ignoring the Δ/2 LSB fac-
`tor, the DAC input, xin[n], can be viewed as an integer in the
`range -8 to 8. At each sample time n, the top and bottom outputs
`of switching block Sseg are set to (xin[n]+sseg[n])/2 and −sseg[n],
`respectively, where sseg[n] is zero if xin[n] is even, and chosen
`pseudo-randomly to be ±1 otherwise. Similarly, the top and bot-
`tom outputs of switching block Sk,r are set to (xk,r[n]±sk,r[n])/2,
`respectively, where sk,r[n] is zero if xk,r[n] is even, and chosen
`pseudo-randomly to be ±1 otherwise. Each pseudo-random choice
`is driven by one of the 9 PN sequences which are designed to well
`approximate white, uncorrelated random processes. Thus, the
`sk,r[n] sequences are also white and uncorrelated. The PN
`sequences along with the parity of each switching block input are
`passed to the corresponding DNC/GEC logic block, thereby giv-
`ing it access to the sseg[n] and sk,r[n] sequences.
`
`It can be shown that capacitor mismatches cause the DEM DAC
`to introduce additive DAC noise of the form
`= Δ
`+
`Δ∑
`[ ]
`[ ]
`[ ],
`e
`n
`s
`n
`s
`n
`,
`,
`DAC
`seg seg
`k r k r
`
`,
`k r
`
`where the Δseg and Δk,r terms are constants that depend only on the
`capacitor mismatches. The objective of the DNC logic is to digital-
`ly estimate and cancel the DAC noise component from the uncor-
`rected ADC output. This is possible because the sseg[n] and sk,r[n]
`sequences are white and uncorrelated, are restricted to values of
`0 and ±1, and are known to the DNC logic. A simple correlation
`algorithm, similar to that of a digital spread spectrum receiver, is
`used to estimate eDAC[n] in the background as described in [1].
`
`As described in [2], GEC operates on a related principle.
`Capacitor mismatches, finite open-loop op-amp gain, incomplete
`settling, charge injection, and clock feed-through all give rise to
`interstage gain error, which causes coarse quantization error
`from the individual stages to appear in the uncorrected ADC out-
`put. Each GEC logic block estimates the non-ideal interstage
`gains by correlating the digitized residue against the rGEC[n]
`sequence added in the corresponding pipeline stage, and uses the
`estimate to scale the digitized residue so as to generate a
`sequence with which to cancel the associated error term in the
`uncorrected ADC output.
`
`To minimize latency, the rGEC[n] adder and DEM encoder are
`implemented together as shown in Fig. 25.1.3. The input-output
`functionality is as described above, but the logic has been flat-
`tened so the critical path is a single layer of transmission gates
`preset by 40MHz clocked logic.
`
`Standard switched-capacitor circuits are used in all stages. The
`continuous-time input is sampled separately for the main signal
`path and the flash ADC [3]. Critical switches are implemented
`with the bootstrapped switch shown in Fig. 25.1.4, which is a mod-
`ification of that presented in [4]. Separate DAC and input capaci-
`tors are used to avoid signal dependent loading of the references
`at the expense of increased residue amplifier requirements and
`kT/C noise. The DAC capacitors sample the reference voltages on
`both clock phases, thereby allowing half-size capacitors. The first
`stage capacitor sizes were chosen just large enough to meet kT/C
`noise requirements, and matching issues were not considered crit-
`ical during layout with the view that DNC and GEC would com-
`pensate for capacitor mismatches. Indeed, simulations suggest
`that to achieve the reported performance without DNC and GEC
`using this design and circuit technology would have required 25
`times larger first-stage capacitors.
`
`A two-stage Miller-compensated OTA with a PMOS folded-cas-
`code input stage is used in each residue amplifier. Without GEC,
`better than 100dB of open-loop gain would be required, which
`would necessitate gain boosting. However, GEC relaxes the gain
`requirement to the point that gain boosting is not necessary. To
`demonstrate this point, gain boosting circuitry that can be dis-
`abled digitally is included in the first stage. The reported exper-
`imental results are with gain boosting disabled.
`
`The ADC was tested at input signal frequencies across the 20
`MHz Nyquist band, and no significant performance degradation
`was observed as a function of frequency. A representative PSD
`plot from the ADC with a 19.03MHz input signal is shown in Fig.
`25.1.5. Additional fabrication and measurement details are pro-
`vided in Fig. 25.1.6, and a die photo is shown in Fig. 25.1.7.
`
`References:
`[1] I. Galton, “Digital Cancellation of D/A Converter Noise in Pipelined
`A/D Converters,” IEEE Trans. Circ. Syst. II, pp. 185-196, Mar. 2000.
`[2] E. J. Siragusa and I. Galton, “Gain Error Correction Technique for Pipelined
`Analogue-to-Digital Converters,” Elect. Let., pp. 617-618, Mar. 2000.
`[3] I. Mehr and L. Singer, “A 55-mW, 10-bit, 40-Msample/s Nyquist-Rate
`CMOS ADC,” IEEE J. Solid-State Circuits., no. 3, pp. 318-325, Mar. 2000.
`[4] M. Dessouky and A. Kaiser, “Input Switch Configuration Suitable for Rail-
`to-Rail Operation of Switched Opamp Circuits,” Elect. Let., pp. 8-10, Jan. 1999.
`
`Authorized licensed use limited to: OREGON STATE UNIV. Downloaded on March 10,2021 at 05:37:07 UTC from IEEE Xplore. Restrictions apply.
`
`IPR2021-00294 - Xilinx, Inc. v. Analog Devices, Inc. - Analog 2002
`
`1
`
`
`
`ISSCC 2004 / February 18, 2004 / Salon 8 / 1:30 PM
`
`E
`'$&
`
`E
`'$&
`
`'
`
`'
`
`E
`'$& '
`
`E
`'$& '
`
`E
`'$& '
`
`E
`'$& '
`
`E
`'$& '
`
`E
`'$& '
`
`'
`
`'
`
`E
`'$&
`
`E
`'$&
`
`6
`
`
`6
`
`
`6
`
`
`6
`
`
`6
`
`
`6
`
`
`6
`
`
`6
`
`
`î
`
`'\QDPLF (OHPHQW
`0DWFKLQJ 'LJLWDO
`(QFRGHU
`
`3DVVLYH
`6DPSOLQJ
`1HWZRUN
`
`3DVVLYH
`6DPSOLQJ
`1HWZRUN
`
`'
`OHYHO
`)ODVK
`$'&
`
`'
`OHYHO
`'(0
`'$&
`
`
`
`
`
`7KHUPRPHWHU
`WR %LQDU\
`(QFRGHU
`
`
`
`
`U
`
`>Q@
`*(&
`
`
`
`>Q@
`
`[
`
`LQ
`
`6
`VHJ
`
`
`
`6WDJH GHWDLOV VDPH IRU 6WDJHV DQG
`
`9
`LQ
`9
`LQ
`
`OHYHO
`3LSHOLQH
`6WDJH
`
`OHYHO
`3LSHOLQH
`6WDJH
`
`OHYHO
`3LSHOLQH
`6WDJH
`
`
`
`
`
`
`
`
`
`
`
`
`
`OHYHO
`3LSHOLQH
`6WDJH
`
`
`
`OHYHO
`3LSHOLQH
`6WDJH
`
`
`
`OHYHO
`3LSHOLQH
`6WDJH
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`OHYHO
`)ODVK
`$'&
`
`'1&
`*(&
`/RJLF
`
`'1&
`*(&
`/RJLF
`
`'1&
`*(&
`/RJLF
`
`
`
`
`
`
`
`&RUUHFWHG
`$'& 2XWSXW
`
`$'& 2XWSXW
`8QFRUUHFWHG
`
`Figure 25.1.1: Block diagram of the implemented pipelined ADC.
`
`Figure 25.1.2: Behavioral details of the first three pipeline stages.
`
`OHYHO '(0 '$& ZLWK /6% VWHSVL]H '
`
` 7JDWH GHOD\
`
` /D\HU RI
`7JDWHV
`
`E
`'$&
`
`E
`'$&
`
`E
`'$&
`
`'
`
`'
`
`'
`
`9
`
`&
`
`I
`
`I
`
`7UDFN
`
`6ZLWFK 2II
`&KDUJH &
`
`6DPSOH
`
`9
`LQ
`
`I
`
`I
`
`7KLFN2[LGH 'HYLFHV
`
`6DPSOLQJ
`6ZLWFK
`
`9
`RXW
`
`E
`'$&
`
`'
`
`E
`'$& '
`
`E
`'$& '
`
`E
`'$& '
`
`E
`'$& '
`
`'
`
`'
`
`E
`'$&
`
`E
`'$&
`
`
`
`
`
`
`
`&RQWURO /RJLF
`7LPLQJ QRW FULWLFDO
`
`/6% 6HJPHQW
`6ZLWFK
`
`
`
` 1$1'JDWH GHOD\V
`
`'
`OHYHO
`)ODVK
`$'&
`
`'
`OHYHO
`'(0
`'$&
`
`
`
`
`
`7KHUPRPHWHU
`WR %LQDU\
`(QFRGHU
`
`
`
`
`U
`
`>Q@
`*(&
`
`Figure 25.1.3: Implementation of the GEC adder and DEM digital
`encoder.
`
`Figure 25.1.4: Bootstrapped switch details.
`
`5HVROXWLRQ
`
`6DPSOH 5DWH
`
` ELWV
`
` 0+]
`
`,QSXW 9ROWDJH 5DQJH
`
` 9SS GLIIHUHQWLDO
`
`6)'5
`
`7+'
`
`3HDN 615
`
`'1/
`
`,1/
`
`6)'5 ,PSURYHPHQW
`ZLWK '1& *(&
`
`3HDN 61'5 ,PSURYHPHQW
`ZLWK '1& *(&
`
`3RZHU &RQVXPSWLRQ
`
`$QDORJ
`'LJLWDO
`2XWSXW 'ULYHUV
`
`7RWDO
`
`'LH 6L]H
`
`7HFKQRORJ\
`
`3DFNDJH
`
` G%
`
` G%
`
` G%
`
` /6%
`
` /6%
`
`! G%
`
`! G%
`
` P:
` P:
` P:
`
` P:
`
` PP î PP LQFOXGLQJ SDGV DQG (6' FLUFXLWU\
`
` ȝP 30 &026
`
` 3LQ 4)1 ZLWK JURXQG GRZQERQGLQJ
`
`,QSXW 6LJQDO
`615)6
`615
`6)'5
`QGRUGHU VSXU
`UGRUGHU VSXU
`7+'
`
` G%)6 # 0+]
` G%
` G%
` G%
` G%F # 0+]
` G%F # 0+]
` G%
`
`
`
`
`/*\
`
`
`
`
`
`
`
`
`
`
`
`
`
`F$
`
`
`
`
`
`
`
`
`
`Figure 25.1.5: Representative measured PSD plot with DNC and GEC
`enabled.
`
`Figure 25.1.6: Performance summary.
`
`Authorized licensed use limited to: OREGON STATE UNIV. Downloaded on March 10,2021 at 05:37:07 UTC from IEEE Xplore. Restrictions apply.
`
`2
`
`
`
`%LDV
`
`6WDJH
`
`6WDJHV
`
`'LJLWDO /RJLF
`
`&ON %XII*HQ
`
`3RUW
`6HULDO
`
`Figure 25.1.7: Die micrograph.
`
`0-7803-8267-6/04 ©2004 IEEE
`• 2004 IEEE International Solid-State Circuits Conference
`Authorized licensed use limited to: OREGON STATE UNIV. Downloaded on March 10,2021 at 05:37:07 UTC from IEEE Xplore. Restrictions apply.
`
`3
`
`
`
`9
`LQ
`9
`LQ
`
`OHYHO
`3LSHOLQH
`6WDJH
`
`OHYHO
`3LSHOLQH
`6WDJH
`
`OHYHO
`3LSHOLQH
`6WDJH
`
`
`
`
`
`
`
`
`
`
`
`
`
`OHYHO
`3LSHOLQH
`6WDJH
`
`
`
`OHYHO
`3LSHOLQH
`6WDJH
`
`
`
`OHYHO
`3LSHOLQH
`6WDJH
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`OHYHO
`)ODVK
`$'&
`
`'1&
`*(&
`/RJLF
`
`'1&
`*(&
`/RJLF
`
`'1&
`*(&
`/RJLF
`
`
`
`
`
`
`
`&RUUHFWHG
`$'& 2XWSXW
`
`$'& 2XWSXW
`8QFRUUHFWHG
`
`Figure 25.1.1: Block diagram of the implemented pipelined ADC.
`
`0-7803-8267-6/04 ©2004 IEEE
`• 2004 IEEE International Solid-State Circuits Conference
`Authorized licensed use limited to: OREGON STATE UNIV. Downloaded on March 10,2021 at 05:37:07 UTC from IEEE Xplore. Restrictions apply.
`
`4
`
`
`
`E
`'$&
`
`E
`'$&
`
`'
`
`'
`
`E
`'$& '
`
`E
`'$& '
`
`E
`'$& '
`
`E
`'$& '
`
`E
`'$& '
`
`E
`'$& '
`
`'
`
`'
`
`E
`'$&
`
`E
`'$&
`
`6
`
`
`6
`
`
`6
`
`
`6
`
`
`6
`
`
`6
`
`
`6
`
`
`6
`
`
`î
`
`'\QDPLF (OHPHQW
`0DWFKLQJ 'LJLWDO
`(QFRGHU
`
`3DVVLYH
`6DPSOLQJ
`1HWZRUN
`
`3DVVLYH
`6DPSOLQJ
`1HWZRUN
`
`'
`OHYHO
`)ODVK
`$'&
`
`'
`OHYHO
`'(0
`'$&
`
`
`
`
`
`7KHUPRPHWHU
`WR %LQDU\
`(QFRGHU
`
`
`
`
`U
`
`>Q@
`*(&
`
`
`
`>Q@
`
`[
`
`LQ
`
`6
`VHJ
`
`
`
`6WDJH GHWDLOV VDPH IRU 6WDJHV DQG
`
`OHYHO '(0 '$& ZLWK /6% VWHSVL]H '
`
`Figure 25.1.2: Behavioral details of the first three pipeline stages.
`
`0-7803-8267-6/04 ©2004 IEEE
`• 2004 IEEE International Solid-State Circuits Conference
`Authorized licensed use limited to: OREGON STATE UNIV. Downloaded on March 10,2021 at 05:37:07 UTC from IEEE Xplore. Restrictions apply.
`
`5
`
`
`
`E
`'$&
`
`E
`'$&
`
`E
`'$&
`
`E
`'$&
`
`'
`
`'
`
`'
`
`'
`
`E
`'$& '
`
`E
`'$& '
`
`E
`'$& '
`
`E
`'$& '
`
`'
`
`'
`
`E
`'$&
`
`E
`'$&
`
` 7JDWH GHOD\
`
` /D\HU RI
`7JDWHV
`
`
`
`
`
`
`
`&RQWURO /RJLF
`7LPLQJ QRW FULWLFDO
`
`/6% 6HJPHQW
`6ZLWFK
`
`
`
` 1$1'JDWH GHOD\V
`
`'
`OHYHO
`)ODVK
`$'&
`
`'
`OHYHO
`'(0
`'$&
`
`
`
`
`
`KHUPRPHWHU
`WR %LQDU\
`(QFRGHU
`
`
`
`
`U
`
`>Q@
`*(&
`
`Figure 25.1.3: Implementation of the GEC adder and DEM digital encoder.
`
`0-7803-8267-6/04 ©2004 IEEE
`• 2004 IEEE International Solid-State Circuits Conference
`Authorized licensed use limited to: OREGON STATE UNIV. Downloaded on March 10,2021 at 05:37:07 UTC from IEEE Xplore. Restrictions apply.
`
`6
`
`
`
`9
`
`&
`
`I
`
`I
`
`7KLFN2[LGH 'HYLFHV
`
`6DPSOLQJ
`6ZLWFK
`
`9
`RXW
`
`I
`
`I
`
`7UDFN
`
`6ZLWFK 2II
`&KDUJH &
`
`6DPSOH
`
`9
`LQ
`
`Figure 25.1.4: Bootstrapped switch details.
`
`0-7803-8267-6/04 ©2004 IEEE
`• 2004 IEEE International Solid-State Circuits Conference
`Authorized licensed use limited to: OREGON STATE UNIV. Downloaded on March 10,2021 at 05:37:07 UTC from IEEE Xplore. Restrictions apply.
`
`7
`
`
`
`,QSXW 6LJQDO
`615)6
`615
`6)'5
`QGRUGHU VSXU
`UGRUGHU VSXU
`7+'
`
` G%)6 # 0+]
` G%
` G%
` G%
` G%F # 0+]
` G%F # 0+]
` G%
`
`
`
`
`/*\
`
`
`
`
`
`
`
`
`
`
`
`
`
`F$
`
`
`
`
`
`
`
`
`
`Figure 25.1.5: Representative measured PSD plot with DNC and GEC enabled.
`
`0-7803-8267-6/04 ©2004 IEEE
`• 2004 IEEE International Solid-State Circuits Conference
`Authorized licensed use limited to: OREGON STATE UNIV. Downloaded on March 10,2021 at 05:37:07 UTC from IEEE Xplore. Restrictions apply.
`
`8
`
`
`
`5HVROXWLRQ
`
`6DPSOH 5DWH
`
` ELWV
`
` 0+]
`
`,QSXW 9ROWDJH 5DQJH
`
` 9SS GLIIHUHQWLDO
`
`6)'5
`
`7+'
`
`3HDN 615
`
`'1/
`
`,1/
`
`6)'5 ,PSURYHPHQW
`ZLWK '1& *(&
`
`3HDN 61'5 ,PSURYHPHQW
`ZLWK '1& *(&
`
`3RZHU &RQVXPSWLRQ
`
`$QDORJ
`'LJLWDO
`2XWSXW 'ULYHUV
`
`7RWDO
`
`'LH 6L]H
`
`7HFKQRORJ\
`
`3DFNDJH
`
`Figure 25.1.6: Performance summary.
`
` G%
`
` G%
`
` G%
`
` /6%
`
` /6%
`
`! G%
`
`! G%
`
` P:
` P:
` P:
`
` P:
`
` PP î PP LQFOXGLQJ SDGV DQG (6' FLUFXLWU\
`
` ȝP 30 &026
`
` 3LQ 4)1 ZLWK JURXQG GRZQERQGLQJ
`
`0-7803-8267-6/04 ©2004 IEEE
`• 2004 IEEE International Solid-State Circuits Conference
`Authorized licensed use limited to: OREGON STATE UNIV. Downloaded on March 10,2021 at 05:37:07 UTC from IEEE Xplore. Restrictions apply.
`
`9
`
`
`
`%LDV
`
`6WDJH
`
`6WDJHV
`
`'LJLWDO /RJLF
`
`&ON %XII*HQ
`
`3RUW
`6HULDO
`
`Figure 25.1.7: Die micrograph.
`
`0-7803-8267-6/04 ©2004 IEEE
`• 2004 IEEE International Solid-State Circuits Conference
`Authorized licensed use limited to: OREGON STATE UNIV. Downloaded on March 10,2021 at 05:37:07 UTC from IEEE Xplore. Restrictions apply.
`
`10
`
`