111111
`
`(19) United States
`(12) Patent Application Publication
`Mansky et ai.
`
`11111111111111111111111111111111111111111111111111111111111111
`US 20020032531Al
`
`(10) Pub. No.: US 2002/0032531 Al
`Mar. 14,2002
`(43) Pub. Date:
`
`(54) SENSOR ARRAY FOR RAPID MATERIALS
`CHARACTERIZATION
`
`(57)
`
`ABSTRACT
`
`(75)
`
`Inventors: Paul Mansky, San Francisco, CA (US);
`James Bennett, Santa Clara, CA (US)
`
`Correspondence Address:
`Loletta L. Darden
`Dobrusin Darden Thennisch & Lorenz PC
`Suite 311
`401 South Old Woodward Avenue
`Birmingham, MI 48009 (US)
`
`(73) Assignee: SYMYX TECHNOLOGIES
`
`(21) Appl. No.:
`
`09/863,532
`
`(22) Filed:
`
`May 23, 2001
`
`Related U.S. Application Data
`
`(63) Continuation of application No. 09/210,428, filed on
`Dec. 11, 1998.
`
`Publication Classification
`
`Int. CI? ..................................................... G01N 33/48
`(51)
`(52) U.S. CI.
`................................................................ 702/21
`
`A sensor-array based materials characterization apparatus
`includes a sensor array disposed on a substrate; electronic
`test circuitry for sending electrical signals to and receiving
`electrical signals from the sensor array; electronic circuitry
`for routing signals between selected sensors and the elec(cid:173)
`tronic test circuitry; and a computer or processor. All or part
`of the electronic test and signal routing circuitry is contained
`on the same substrate as the sensor array, comprising an
`integrated apparatus disposed on a substrate. Additional
`circuitry and a processor or computer may be physically
`separate from the substrate carrying the sensor array, and
`connected to the sensor array substrate by a standardized
`interconnection method. The method of using the apparatus
`comprises applying multiple samples to the multiple sensors
`in the array, and sending and receiving signals to and from
`selected sensors, where the signals correspond to the mate(cid:173)
`rial properties of samples in contact with the sensors. The
`sensor array is preferably arranged in a standardized format
`used in combinatorial applications for rapid deposition of
`sample materials on the sensor array. By integrating the
`electronic test and signal routing circuitry onto the same
`substrate as the sensor array, a high density of sensors can
`be situated on a single substrate, permitting the rapid analy(cid:173)
`sis of libraries containing thousands of material samples or
`more.
`
`Exhibit 1032
`Abbott Diabetes Care Inc. v. Dexcom Inc.
`IPR2022-00917, -00918
`
`

`

`Patent Application Publication Mar. 14,2002 Sheet 1 of 25
`
`US 2002/0032531 Al
`
`12
`
`52
`
`40
`
`30,129
`
`Deposition of _~
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`
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`
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`
`52
`
`lFig-1D
`
`Deposition of
`multiple samples
`
`lFig-1 E
`
`10,16,127,129
`
`52
`
`Exhibit 1032
`Abbott Diabetes Care Inc. v. Dexcom Inc.
`IPR2022-00917, -00918
`
`

`

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`Exhibit 1032
`Abbott Diabetes Care Inc. v. Dexcom Inc.
`IPR2022-00917, -00918
`
`

`

`Patent Application Publication Mar. 14,2002 Sheet 3 of 25
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`Exhibit 1032
`Abbott Diabetes Care Inc. v. Dexcom Inc.
`IPR2022-00917, -00918
`
`

`

`Patent Application Publication Mar. 14,2002 Sheet 4 of 25
`
`US 2002/0032531 Al
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`Exhibit 1032
`Abbott Diabetes Care Inc. v. Dexcom Inc.
`IPR2022-00917, -00918
`
`

`

`Patent Application Publication Mar. 14,2002 Sheet 5 of 25
`
`US 2002/0032531 Al
`
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`
`Exhibit 1032
`Abbott Diabetes Care Inc. v. Dexcom Inc.
`IPR2022-00917, -00918
`
`

`

`Patent Application Publication Mar. 14,2002 Sheet 6 of 25
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`Exhibit 1032
`Abbott Diabetes Care Inc. v. Dexcom Inc.
`IPR2022-00917, -00918
`
`

`

`Patent Application Publication Mar. 14,2002 Sheet 7 of 25
`
`US 2002/0032531 Al
`
`I Computer l
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`
`Exhibit 1032
`Abbott Diabetes Care Inc. v. Dexcom Inc.
`IPR2022-00917, -00918
`
`

`

`Patent Application Publication Mar. 14,2002 Sheet 8 of 25
`
`US 2002/0032531 Al
`
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`
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`
`Exhibit 1032
`Abbott Diabetes Care Inc. v. Dexcom Inc.
`IPR2022-00917, -00918
`
`

`

`Patent Application Publication Mar. 14,2002 Sheet 9 of 25
`
`US 2002/0032531 Al
`
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`
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`
`Exhibit 1032
`Abbott Diabetes Care Inc. v. Dexcom Inc.
`IPR2022-00917, -00918
`
`

`

`Patent Application Publication Mar. 14,2002 Sheet 10 of 25 US 2002/0032531 Al
`
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`
`Exhibit 1032
`Abbott Diabetes Care Inc. v. Dexcom Inc.
`IPR2022-00917, -00918
`
`

`

`Patent Application Publication Mar. 14,2002 Sheet 11 of 25
`
`US 2002/0032531 Al
`
`2000-.-----------------.
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`
`Exhibit 1032
`Abbott Diabetes Care Inc. v. Dexcom Inc.
`IPR2022-00917, -00918
`
`

`

`Patent Application Publication Mar. 14,2002 Sheet 12 of 25 US 2002/0032531 Al
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`
`Exhibit 1032
`Abbott Diabetes Care Inc. v. Dexcom Inc.
`IPR2022-00917, -00918
`
`

`

`Patent Application Publication Mar. 14,2002 Sheet 13 of 25 US 2002/0032531 Al
`
`127 l,------_
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`
`Exhibit 1032
`Abbott Diabetes Care Inc. v. Dexcom Inc.
`IPR2022-00917, -00918
`
`

`

`Patent Application Publication Mar. 14,2002 Sheet 14 of 25
`
`US 2002/0032531 Al
`
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`Exhibit 1032
`Abbott Diabetes Care Inc. v. Dexcom Inc.
`IPR2022-00917, -00918
`
`

`

`Patent Application Publication Mar. 14,2002 Sheet 15 of 25 US 2002/0032531 Al
`
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`Exhibit 1032
`Abbott Diabetes Care Inc. v. Dexcom Inc.
`IPR2022-00917, -00918
`
`

`

`Patent Application Publication Mar. 14, 2002 Sheet 16 of 25 US 2002/0032531 Al
`
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`
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`
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`
`Exhibit 1032
`Abbott Diabetes Care Inc. v. Dexcom Inc.
`IPR2022-00917, -00918
`
`

`

`Patent Application Publication Mar. 14,2002 Sheet 17 of 25
`
`US 2002/0032531 Al
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`35
`
`-5
`
`0
`
`5
`
`10
`
`15
`20
`arne, seconds
`1FiQ,-13E
`
`25
`
`30
`
`35
`
`0
`
`0
`
`100
`
`200
`
`400
`300
`temperature, centigrade
`lFii-13F
`
`T g
`
`500
`
`600
`
`Exhibit 1032
`Abbott Diabetes Care Inc. v. Dexcom Inc.
`IPR2022-00917, -00918
`
`

`

`Patent Application Publication Mar. 14,2002 Sheet 18 of 25 US 2002/0032531 Al
`
`I(t)=IO (t)+~Csin(m t)
`
`1
`
`-
`
`'---
`
`-
`
`lFig-13G
`
`10000
`
`7500
`
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`
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`
`5000
`
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`
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`
`o
`
`100
`
`400
`
`500
`
`200
`
`300
`
`T(°C)
`lFig-14
`
`Exhibit 1032
`Abbott Diabetes Care Inc. v. Dexcom Inc.
`IPR2022-00917, -00918
`
`

`

`Patent Application Publication Mar. 14,2002 Sheet 19 of 25 US 2002/0032531 Al
`
`lFig-15A
`
`RTDI4-pt.
`Resistance -
`temperature of
`each sample
`
`To, from
`sensors
`RAPID
`SCAN
`
`Single-point measurement!
`control of block
`temperature
`
`~54
`
`100
`sensors
`
`lFig-15B
`
`Exhibit 1032
`Abbott Diabetes Care Inc. v. Dexcom Inc.
`IPR2022-00917, -00918
`
`

`

`Patent Application Publication Mar. 14,2002 Sheet 20 of 25 US 2002/0032531 Al
`
`-Temperature/exotherm
`-Dielectric spectorscopy
`
`Glass
`(insulates) ~ r------'--c:rDL::n:t-~T,D;"C:::r,d----'--c:::rcJl::::n:j------n
`
`sensor
`160
`
`Heat flow
`J-.6.T
`
`T=TO
`
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`
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`
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`
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`5-minute epoxy curing
`
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`--0-- B only
`-o-Aonly
`
`--o---O---o __ {)
`
`o
`
`2
`
`4
`'time(min)
`lFig-16B
`
`6
`
`8
`
`10
`
`Exhibit 1032
`Abbott Diabetes Care Inc. v. Dexcom Inc.
`IPR2022-00917, -00918
`
`

`

`Patent Application Publication Mar. 14,2002 Sheet 21 of 25
`
`US 2002/0032531 Al
`
`I
`
`I
`
`I
`
`160 )
`
`lFig-16D
`
`Exhibit 1032
`Abbott Diabetes Care Inc. v. Dexcom Inc.
`IPR2022-00917, -00918
`
`

`

`Patent Application Publication Mar. 14,2002 Sheet 22 of 25 US 2002/0032531 Al
`
`SINGLE-POINT MEASUREMENT/
`CONTROL OF BLOCK
`TEMPERATURE
`
`IFig-16£
`
`r:::-==r-J
`
`t-~-'---
`
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`SENSORS(cid:173)
`RAPID
`SCAN
`
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`
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`
`--~-~
`I (172
`
`fFig-17A
`
`/170
`1=====================,====~~176
`em
`
`IFig-17B
`
`172
`
`Exhibit 1032
`Abbott Diabetes Care Inc. v. Dexcom Inc.
`IPR2022-00917, -00918
`
`

`

`Patent Application Publication Mar. 14,2002 Sheet 23 of 25
`
`US 2002/0032531 Al
`
`--VH
`/Fig-18A
`
`/Fig-19A
`
`!
`
`/Fig-t8B
`
`180,182
`
`1--/186
`
`1:11,',1111,11:11'
`
`/Fig-t8C
`
`180, 182
`
`Exhibit 1032
`Abbott Diabetes Care Inc. v. Dexcom Inc.
`IPR2022-00917, -00918
`
`

`

`Patent Application Publication Mar. 14,2002 Sheet 24 of 25 US 2002/0032531 Al
`
`/Fig-1gB
`
`L
`
`194
`
`T1
`
`191
`
`196
`
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`
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`
`192
`
`198
`
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`
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`
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`
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`
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`
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`
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`
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`
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`
`205
`
`208
`
`/Fi~-20B
`
`202
`
`208a
`
`Exhibit 1032
`Abbott Diabetes Care Inc. v. Dexcom Inc.
`IPR2022-00917, -00918
`
`

`

`Patent Application Publication Mar. 14,2002 Sheet 25 of 25 US 2002/0032531 Al
`
`/214
`
`212
`
`~210
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`
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`
`V2 + L..--_--,
`
`lFig-21 A
`
`/220
`
`222
`
`lFig-21 B
`
`~226
`
`Exhibit 1032
`Abbott Diabetes Care Inc. v. Dexcom Inc.
`IPR2022-00917, -00918
`
`

`

`US 2002/0032531 A1
`
`Mar. 14, 2002
`
`1
`
`SENSOR ARRAY FOR RAPID MATERIALS
`CHARACTERIZATION
`
`RELATED CASES
`
`[0001] The present application is related to co-pending
`U.S. patent application Ser. No. ___ (Attorney Docket
`No. 65304-39/SYMYX 98-23) and U.S. patent application
`Ser. No. ___ (Attorney Docket No. 65304-055/SYMYX
`98-37), all filed on Dec. 10, 1998 and which are incorporated
`herein by reference.
`
`TECHNI CAL FIELD
`
`[0002] The present invention is directed to an apparatus
`and method for characterizing a plurality of organic or
`inorganic materials, and more particularly to a modular,
`electrically-driven sensor array that can be coupled to a
`selected standardized integrated electronic platform to char(cid:173)
`acterize a plurality of materials simultaneously and rapidly.
`
`BACKGROUND
`
`[0003] Companies are turning to combinatorial materials
`science techniques for developing new compounds or mate(cid:173)
`rials (including formulations, materials having different pro(cid:173)
`cessing histories, or mixtures of compounds) having novel
`physical and chemical properties. Combinatorial materials
`science refers generally to methods and apparatuses for
`creating a collection of chemically diverse compounds or
`materials and to methods and apparatuses for rapidly testing
`or screening such compounds or materials for desired per(cid:173)
`formance characteristics and/or properties. The collections
`of chemical compounds or materials are commonly called
`"libraries". See U.S. Pat. No. 5,776,359, herein incorporated
`by reference, for a general discussion of combinatorial
`methodologies.
`
`[0004] A virtually infinite number of useful materials or
`compounds can be prepared by combining different ele(cid:173)
`ments of the Periodic Table of Elements in varying ratios, by
`creating compounds with different arrangements of ele(cid:173)
`ments, and by creating materials comprising mixtures of
`compounds or formulations with differing processing histo(cid:173)
`ries. Discovery of useful materials for a particular applica(cid:173)
`tion may require preparation or characterization of many
`candidate materials or compounds. Preparing and screening
`a large number of candidates increases the probability of
`useful discoveries. Thus, any system that can analyze and
`characterize the properties of combinatorially prepared
`library members quickly and accurately is highly desirable.
`
`[0005] Many conventional measurement systems com(cid:173)
`prise a distinct specialized machine for characterizing a
`particular material property, so that testing of a candidate
`material can use many machines and be cumbersome and
`time-consuming. Also, most known materials characteriza(cid:173)
`tion devices measure only one material sample at a time,
`severely limiting the number of samples that can be char(cid:173)
`acterized per unit time.
`
`[0006] Optical screening methods and devices have been
`preferred for many combinatorial chemistry and combina(cid:173)
`torial materials science applications because they are non(cid:173)
`contact and non-destructive. See for example WO 98/15805,
`incorporated herein by reference. For example, lumines(cid:173)
`cence may be screened optically. When monitoring chemical
`
`reactions, for example, thermal imaging with an infrared
`camera can detect heat released during relatively fast exo(cid:173)
`thermic reactions. See WO 98/15813, incorporated herein by
`reference. Although optical methods are particularly useful
`for characterizing materials or properties in certain circum(cid:173)
`stances, many materials characterization techniques are dif(cid:173)
`ficult or impossible to perform using optical methods. There(cid:173)
`fore, there is still a need for a more direct materials
`characterization method that involves more intimate contact
`between the material samples and the sensing apparatus.
`
`[0007] Conventional sensors that generate electrical data
`corresponding to material properties are typically designed
`as individual, discrete units, each sensor having its own
`packaging and wiring connections. Many materials charac(cid:173)
`terization sensors are designed to be used individually in or
`with a machine that characterizes one sample at a time.
`Linking a plurality of these individual sensors in an array
`format, assuming that it is physically possible, would be
`expensive and often creates overly complicated wiring
`schemes with minimal gains in operating efficiency for the
`overall sensing system.
`
`[0008] One structure using multiple material samples is a
`microfabricated array containing "microhotplates". The
`microhotplates act as miniature heating plates for supporting
`and selectively heating material samples placed thereon.
`U.S. Pat. No. 5,356,756 to Cavicchi et al and U.S. Pat. No.
`5,345,213 to Semancik et al. as well the article entitled
`"Kinetically Controlled Chemical Sensing Using Microma(cid:173)
`chined Structures," by Semancik and Cavicchi, (Accounts of
`Chemical Research, Vol. 31, No.5, 1998), all illustrate the
`microhotplate concept and are incorporated herein by ref(cid:173)
`erence. Although arrays containing microhotplates are
`known, they have been used primarily to create varied
`processing conditions for preparing materials. A need still
`exists for an array-based sensor system that can actually
`characterize material properties.
`
`It is therefore an object of the invention to provide
`[0009]
`a materials characterization system that can measure prop(cid:173)
`erties of many material samples quickly, and in some
`embodiments simultaneously.
`
`It is also an object of the invention to construct a
`[0010]
`materials characterization system having a modular struc(cid:173)
`ture that can be connected to a flexible electronic platform
`to allow many different material properties to be measured
`with minimal modification of the apparatus.
`
`SUMMARY OF THE INVENTION
`
`[0011] This invention provides an apparatus (or system)
`and method for testing materials in an array format using
`sensors that contact the materials being tested. Accordingly,
`the present invention is directed to an electronically-driven
`sensor array system for rapid characterization of multiple
`materials. A plurality of sensors are disposed on a substrate
`to form a sensor array. The embodiment of the invention
`herein is directed to a system having an integrated substrate
`including the sensors and either signal selection and routing
`circuitry (or multiplexers) or circuitry to generate or read
`signals or both.
`
`[0012] Properties that can be measured include thermal,
`electrical and mechanical properties of samples. Regardless
`of the property being measured or the specific apparatus, the
`
`Exhibit 1032
`Abbott Diabetes Care Inc. v. Dexcom Inc.
`IPR2022-00917, -00918
`
`

`

`US 2002/0032531 A1
`
`Mar. 14, 2002
`
`2
`
`materials characterization system of the invention includes a
`multiple sensors carrying multiple samples, means for rout(cid:173)
`ing signals to and from the sensors, electronic test circuitry,
`and a computer or processor to receive and interpret data
`from the sensors. In a preferred embodiment, a modular
`system is constructed including a single sensor array format,
`and signal routing equipment compatible with this format
`which can be used with multiple sensor types and multiple
`electronic test equipment types, permitting maximum flex(cid:173)
`ibility of the system while preserving the general advantages
`of sensor array-based characterization. Alternatively, some
`or all of the different parts of the system may be integrated
`together into a single physical component of the system.
`
`[0013] The sensors can be operated in serial or parallel
`fashion. A wide range of electronically driven sensors may
`be employed, which those of skill in the art will appreciate
`provide the opportunity to design an apparatus or method for
`specific applications or property measurements. The envi(cid:173)
`ronment in which the measurement is made by the sensor
`can be controlled.
`
`[0014] This invention allows for rapid screening of com(cid:173)
`binatoriallibraries or large numbers of samples prepared by
`other means. This invention allows for property measure(cid:173)
`ments that cannot be done optically. However, optical mea(cid:173)
`surements may be made in conjunction with the sensor
`based electronic measurements of this invention. One poten(cid:173)
`tially important feature is the speed of the property mea(cid:173)
`surements made with this invention. Two independent rea(cid:173)
`sons for this speed are that one can measure samples in
`parallel or with smaller sample sizes than with conventional
`measurement techniques. Moreover, automated sample han(cid:173)
`dling, array preparation and/or sensor operation allows for a
`completely automated rapid property measurement system
`in accord with this invention.
`
`[0025] FIGS. l1A through llF are sample traces of
`thermal analysis scans conducted according to the present
`invention;
`
`[0026] FIGS. 12A through 121 illustrate one system for
`conducting thermal analysis according to the present inven(cid:173)
`tion;
`
`[0027] FIGS. 13A through 13G illustrate another system
`for conducting thermal analysis according to the present
`invention;
`
`[0028] FIG. 14 illustrates a thermal decomposition mea(cid:173)
`surement according to the invention;
`
`[0029] FIGS. 15A and 15B illustrate dynamic thermal
`analysis conducted according to the present invention;
`
`[0030] FIGS. 16A through 16E illustrate dielectric spec(cid:173)
`troscopy conducted according to the present invention;
`
`[0031] FIGS. 17A and 17B show an example of a
`mechanical resonator structure that can be used in the
`invention;
`
`[0032] FIGS. 18A through 18C illustrate electrical trans(cid:173)
`port characterization conducted according to the present
`invention;
`
`[0033] FIGS. 19A through 19C illustrate thermoelectric
`property characterization conducted according to the present
`invention;
`
`[0034] FIGS. 20A and 20B illustrate thermal conductivity
`characterization conducted according to the present inven(cid:173)
`tion; and
`
`[0035] FIGS. 21A and 21B illustrate magnetic property
`characterization conducted according to the present inven(cid:173)
`tion.
`
`BRIEF DESCRIPTION OF THE DRAWINGS
`
`DETAILED DESCRIPTION
`
`[0015] FIGS. lA through IE are diagrams illustrating the
`overall system of the present invention;
`
`[0016] FIGS. 2A through 2D are diagrams illustrating
`examples of sensor array and contact configurations in the
`present invention;
`
`[0017] FIGS. 3A and 3B are examples of a printed circuit
`board in the invention;
`
`[0018] FIG. 4 is one embodiment of a sensor array/circuit
`board assembly in the invention;
`
`[0019] FIG. 5 is a representative diagram of a matrix
`switch in the invention;
`
`[0020] FIGS. 6A and 6B are representative diagrams
`illustrating two contemplated sensor addressing schemes in
`the invention;
`
`[0021] FIG. 7 illustrates one alternative contact structure
`for the sensor array;
`
`[0022] FIG. 8 illustrates another embodiment of the
`invention;
`
`[0023] FIGS. 9A through 9C are examples of a sensor
`structure for thermal analysis in the present invention;
`
`[0024] FIG. 10 illustrates an alternative thermal analysis
`sensor substrate structure;
`
`[0036] FIG. 1A illustrates the generic apparatus or system
`concept of the materials characterization system of the
`present invention, and FIGS. IB through IE illustrates
`possible variations of the system. Regardless of the property
`being measured or the specific hardware in the apparatus, the
`materials characterization system of the invention includes
`multiple sensors in contact with multiple samples, means for
`routing signals to and from the sensors, electronic test
`circuitry, and a computer or processor to receive and inter(cid:173)
`pret data from the sensors or the electronic test circuitry.
`FIG. IB is a representative diagram of an apparatus where
`each component is separate and interchangeable, allowing
`maximum flexibility and interchangeability of parts. FIGS.
`lC through IE illustrate variations where portions of the
`apparatus, such as the sensor array and electronic test
`circuitry, are integrated into one part, allowing for a more
`compact design, but with a greater degree of customization
`of the apparatus for a particular application or property
`measurement. Regardless of the degree to which compo(cid:173)
`nents in the apparatus are integrated into one unit, the overall
`operation of the sensor-array based apparatus remains the
`same, as will be explained in further detail below.
`
`In one embodiment that those of skill in the art will
`[0037]
`appreciate provides a great deal of flexibility, each sensor
`has adjacent to it a plurality of associated sensor contact
`pads. Alternatively, the contact pads can be arranged near the
`
`Exhibit 1032
`Abbott Diabetes Care Inc. v. Dexcom Inc.
`IPR2022-00917, -00918
`
`

`

`US 2002/0032531 A1
`
`Mar. 14, 2002
`
`3
`
`edges of the sensor array, with leads on the substrate
`connecting the sensors to the contact pads, to prevent the
`contact pads from being contaminated with the materials
`being tested. The system in this embodiment also includes a
`printed circuit board having a plurality of board contact pads
`arranged in the same configuration as the sensor contact
`pads in the sensor array. Connectors, such as conducting
`elastomers, stick probes, cantilever probes, conducting
`adhesives, wafer-to-board bonding techniques, or other con(cid:173)
`tact devices, couple the sensor array with the printed circuit
`board by creating contacts between the sensor contact pads
`and the board contact pads, preferably the contacts are
`reversible and non-permanent. Thus, sensor arrays incorpo(cid:173)
`rating different sensor functionalities can be created using
`the same array and contact pad format and contacted using
`the same circuit board and connections.
`
`[0038] The printed circuit board in the inventive system
`also includes traces that connect the individual contact pads
`to standard multi -pin connectors placed near the edges of the
`board. This construction allows easy connection between the
`printed circuit board assembly and the rest of the system
`using standard multi-wire ribbon cable assemblies compat(cid:173)
`ible with the chosen multi-pin connectors. In the system
`according to a preferred embodiment, the multiwire cables
`and connectors couple the printed circuit board assembly to
`a multiplexer or other signal routing means for selecting one
`or more sensors to be activated, depending on the specific
`software instructions to the signal routing means. The mul(cid:173)
`tiplexer or signal routing means is, in turn, coupled to a
`flexible electronic platform, which can include electronic
`test and measurement circuitry, a computer, or both. The
`electronic platform can also include a switch matrix, pref(cid:173)
`erably under control of the computer, for connecting the
`multiplexer outputs to a variety of different electronics test
`instruments without manually reconnecting cables. Thus,
`when a sensor array incorporating a different sensor func(cid:173)
`tionality is needed, to test for a different material property,
`only minimal reconfugration of the electronic platform is
`needed. In this manner, the same system can be used to test
`for a wide variety of material properties.
`
`In other cases, it may be desirable to collect infor(cid:173)
`[0039]
`mation from many sensors simultaneously, rather than in a
`rapid serial fashion. In the preferred embodiment of the
`invention for such cases, the multi-wire cables and connec(cid:173)
`tors themselves serve as the signal routing means and are
`directly attached to an electronics module having a multi(cid:173)
`plicity of independent electronics channels for driving and
`reading the sensors. The outputs of these independent chan(cid:173)
`nels are then collected by the computer.
`
`[0040] The sensor array itself may contain different types
`of sensors designed to measure different material properties
`in the different operation modes as well. Further, standard(cid:173)
`izing the sensor array configuration, the contact format, and
`the connections from the board to the multiplexer and/or the
`electronic platform allows easy "plug-and-play" intercon(cid:173)
`nection as well as simplification of the sensor structures
`themselves. In one embodiment of the invention, no active
`circuitry is included in the sensor array, reducing the manu(cid:173)
`facturing cost of the sensor array enough to make the sensor
`array disposable, if desired.
`
`In a preferred embodiment, the sensor array has the
`[0041]
`same format as a standardized format used in combinatorial
`
`chemistry applications (e.g., an 8x12 grid with 9 mm
`spacing in between each sensor). By using a standardized
`format, substances to be tested by the sensors in combina(cid:173)
`torial applications can be placed on multiple sensors simul(cid:173)
`taneously rather than one sensor at a time, e.g., via simul(cid:173)
`taneous transfer from a standard micro titer plate, further
`increasing testing and processing speed in the apparatus. The
`sensors in a single array can be constructed so that they all
`measure the same material property, or alternatively a single
`array can contain several different types of sensors that
`measure different material properties. The modular format of
`the sensor array, the standardized interconnection means,
`and the flexible electronic platform allows a great deal of
`flexibility in determining what types of sensors to include in
`the array since the same general electronic platform (e.g.
`electronic test circuitry and computer) and array format is
`used, regardless of the specific property being measured.
`
`[0042] Alternatively, the sensors can be suspended at the
`end of an array of rods or plates that hang vertically from a