I 1111111111111111 11111 1111111111 1111111111 1111111111 111111111111111 IIII IIII
`US009640733B2
`
`c12) United States Patent
`Hsieh et al.
`
`(IO) Patent No.:
`(45) Date of Patent:
`
`US 9,640,733 B2
`May 2, 2017
`
`(54) CARRIER, CARRIER LEADFRAME, AND
`LIGHT EMITTING DEVICE
`
`(71) Applicant: Everlight Electronics Co., Ltd., New
`Taipei (TW)
`
`(72)
`
`Inventors: Chung-Chuan Hsieh, New Taipei
`(TW); Yung Chieh Chen, New Taipei
`(TW)
`
`(56)
`
`References Cited
`
`U.S. PATENT DOCUMENTS
`
`8,137,999 B2 *
`
`9,024,514 B2 *
`
`3/2012 Wang .................... H0lL 33/486
`257 /E21.499
`H05B 33/06
`257/99
`
`5/2015 Kato
`
`(Continued)
`
`(73) Assignee: Everlight Electronics Co., Ltd. (TW)
`
`FOREIGN PATENT DOCUMENTS
`
`( *) Notice:
`
`Subject to any disclaimer, the term ofthis
`patent is extended or adjusted under 35
`U.S.C. 154(b) by O days.
`
`CN
`JP
`
`1/2009
`101346584 A
`1/2014
`2014017460 A
`(Continued)
`
`(21) Appl. No.: 14/720,230
`
`(22) Filed:
`
`May 22, 2015
`
`(65)
`
`Prior Publication Data
`US 2015/0340568 Al
`Nov. 26, 2015
`
`(30)
`
`Foreign Application Priority Data
`
`May 23, 2014
`Feb. 3, 2015
`
`(TW) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103118060 A
`(TW) ............................. 104103527 A
`
`(51)
`
`Int. Cl.
`HOJL 33/48
`HOJL 33162
`
`(2010.01)
`(2010.01)
`(Continued)
`
`(52) U.S. Cl.
`CPC ............ HOJL 33/483 (2013.01); HOJL 24197
`(2013.01); HOJL 33162 (2013.01); HOJL 33/60
`(2013.01);
`
`(Continued)
`( 58) Field of Classification Search
`None
`See application file for complete search history.
`
`Primary Examiner - Ali Naraghi
`(74) Attorney, Agent, or Firm - Han IP Corporation;
`Andy M. Han
`
`(57)
`
`ABSTRACT
`A carrier leadframe, including a frame body and a carrier, is
`provided. The frame body includes at least one supporting
`portion, and the carrier includes a shell and at least one
`electrode portion and is mechanically engaged with the
`frame body via the supporting portion. A method for manu(cid:173)
`facturing the carrier leadframe as described above, as well as
`a light emitting device made from the carrier leadframe and
`a method for manufacturing the device, are also provided.
`The carrier leadframe has carriers that are separate in
`advance and mechanically engaged with the frame body,
`thereby facilitating the quick release of material after encap(cid:173)
`sulation. Besides, in the carrier leadframe as provided, each
`carrier is electrically isolated from another carrier, so the
`electric measurement can be performed before the release of
`material. Therefore, the speed and yield of production of the
`light emitting device made from the carrier leadframe is
`improved.
`
`12 Claims, 28 Drawing Sheets
`
`llO
`
`IKEA Supply AG
`Exhibit 1001 Page 1 of 37
`
`

`

`US 9,640,733 B2
`Page 2
`
`(51)
`
`Int. Cl.
`H0JL 23100
`H0JL 33/60
`(52) U.S. Cl.
`CPC ................. H0JL 2933/0033 (2013.01); H0JL
`2933/0066 (2013.01)
`
`(2006.01)
`(2010.01)
`
`(56)
`
`References Cited
`
`U.S. PATENT DOCUMENTS
`
`2007/0261374 Al* 11/2007 Nelson.
`
`2007 /0246841 Al * 10/2007 Yamamoto ........ B29C 45/14639
`257/784
`B0lD 46/0004
`55/434
`2009/0261374 Al* 10/2009 Hayashi .................. H0lL 33/62
`257/99
`5/2012 Watari .................... H0lL 33/54
`257/99
`2013/0270588 Al* 10/2013 Wang ...................... H0lL 33/62
`257/91
`
`2012/0132949 Al*
`
`FOREIGN PATENT DOCUMENTS
`
`JP
`KR
`KR
`TW
`TW
`TW
`TW
`
`2014060343 A
`3020070049380
`20100083907 A
`D149221
`D154432
`D1154430
`201340410 A
`
`4/2014
`11/2007
`7/2010
`9/2012
`7/2013
`7/2013
`10/2013
`
`* cited by examiner
`
`IKEA Supply AG
`Exhibit 1001 Page 2 of 37
`
`

`

`U.S. Patent
`
`May 2, 2017
`
`Sheet 1 of 28
`
`US 9,640,733 B2
`
`H10
`
`122
`
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`' 130
`
`IKEA Supply AG
`Exhibit 1001 Page 3 of 37
`
`

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`U.S. Patent
`
`May 2, 2017
`
`Sheet 2 of 28
`
`US 9,640,733 B2
`
`FI(i 3
`
`IKEA Supply AG
`Exhibit 1001 Page 4 of 37
`
`

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`U.S. Patent
`
`May 2, 2017
`
`Sheet 3 of 28
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`US 9,640,733 B2
`
`1
`
`IKEA Supply AG
`Exhibit 1001 Page 5 of 37
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`IKEA Supply AG
`Exhibit 1001 Page 9 of 37
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`U.S. Patent
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`IKEA Supply AG
`Exhibit 1001 Page 10 of 37
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`

`

`US 9,640,733 B2
`
`1
`CARRIER, CARRIER LEADFRAME, AND
`LIGHT EMITTING DEVICE
`
`CROSS-REFERENCE TO RELATED
`APPLICATIONS
`
`This application claims the priority benefit of Taiwan
`Patent Application No. 103118060, filed on May 23, 2014,
`and Taiwan Patent Application No. 104103527, filed on Feb.
`3, 2015, both of which are incorporated herein by reference
`in their entirety.
`
`TECHNICAL FIELD
`
`The present disclosure relates to a carrier leadframe and
`a light emitting device made from the carrier leadframe.
`More particularly, the present disclosure relates to a carrier
`leadframe for receiving a light emitting diode (LED) chip
`and a light emitting device made from the leadframe.
`
`BACKGROUND
`
`2
`following summary is not intended to identify essential
`features of the claimed subject matter, nor is it intended for
`use in determining the scope of the claimed subject matter.
`In view of the aforesaid problems, the present invention
`5 provides a carrier and a carrier leadframe, which has at least
`one carrier that is separated in advance and mechanically
`engaged with the leadframe, thereby facilitating quick
`release of material after die bonding, wire bonding and
`encapsulation. Besides, in the carrier leadframe of the pres-
`IO ent invention, each carrier is electrically isolated from other
`carriers, so after LEDs are die bonded and wire bonded to
`the carriers, the electric measurement can be performed
`before the release of material. Furthermore, a light emitting
`15 device made from the carrier leadframe is also provided in
`the present invention, and with the advantages of the afore(cid:173)
`said carrier leadframe, the production speed and yield of the
`light emitting device can be greatly improved.
`
`20
`
`BRIEF DESCRIPTION OF THE DRAWINGS
`
`Unless otherwise indicated herein, approaches described
`in this section are not prior art to the claims listed below and
`are not admitted to be prior art by inclusion in this section.
`Light emitting diodes (LEDs) have such advantages as a
`long service life, a small volume, high resistance to shock,
`low heat generation and low power consumption, so they
`have been widely used as indicators or light sources in
`household appliances and various other appliances. In recent
`years, LEDs have developed towards multicolor and high
`brightness, so applications thereof have been extended to
`large-sized outdoor signboards, traffic signal lamps and
`related fields. In the future, it is even possible that the LEDs
`become mainstream illumination light sources having both
`power-saving and environmental protection functions. To
`impart the LEDs with good reliability, most of the LEDs are
`subjected to a packaging process to form durable light
`emitting devices.
`In recent years, a dicing-type carrier leadframe has been 40
`developed by manufacturers in the art to which the present
`disclosure belongs. Specifically, a plastic body is molded on
`a metal sheet material, then a die bonding process, a wire
`bonding process and an encapsulation process are per(cid:173)
`formed, and then the metal sheet material and the plastic 45
`body are diced away simultaneously to form individual light
`emitting devices that are separate from each other. However,
`a large amount of plastic and metal dusts tend to be produced
`during the dicing process, which seriously pollute the sur(cid:173)
`faces of the final products and thus degrade the reliability of 50
`the products. Additionally, this process does not allow for a
`light-on test prior to the encapsulation process, and mea(cid:173)
`surements can only be made after the products are singu(cid:173)
`lated. However, the final products that have been singulated
`are piled randomly, and machine measurements on them can 55
`only be made after surface orientation and direction adjust(cid:173)
`ment. This requires use of additional instruments and is time
`consuming.
`
`SUMMARY
`
`The following summary is for illustrative purpose only
`and is not intended to be limiting in any way. That is, the
`following summary is provided to introduce concepts, high(cid:173)
`lights, benefits and advantages of the novel and non-obvious
`techniques described herein. Select implementations are
`further described below in the detailed description. Thus, the
`
`The accompanying drawings are included to provide a
`further understanding of the disclosure, and are incorporated
`in and constitute a part of the present disclosure. The
`25 drawings illustrate implementations of the disclosure and,
`together with the description, serve to explain the principles
`of the disclosure. It is appreciable that the drawings are not
`necessarily in scale as some components may be shown to
`be out of proportion than the size in actual implementation
`30 in order to clearly illustrate the concept of the present
`disclosure.
`FIG. 1 is a partial schematic view of an embodiment of a
`carrier leadframe according to the present disclosure.
`FIG. 2 is a partial schematic view of a conductive sheet
`35 used in the carrier leadframe of FIG. 1.
`FIG. 3 is a partial schematic view of the carrier leadframe
`of FIG. 1 after a plastic body is formed.
`FIG. 4 and FIG. 4A are partial schematic views of the
`carrier leadframe of FIG. 1 after the residual material is
`removed.
`FIG. 5 is a partial schematic view of another embodiment
`of the carrier leadframe according to the present disclosure.
`FIG. 6 is a top view of a light emitting device according
`to an embodiment of the present disclosure.
`FIG. 7 is a top view of a light emitting device according
`to another embodiment of the present disclosure.
`FIG. 8 is a top view of a light emitting device according
`to a further embodiment of the present disclosure.
`FIG. 9 is a top view of a light emitting device according
`to yet another embodiment of the present disclosure.
`FIG. 10 is a top view of a light emitting device according
`to yet a further embodiment of the present disclosure.
`FIG. 11 is a top view of a light emitting device according
`to still another embodiment of the present disclosure.
`FIG. 12A to FIG. 12D are respectively a top view, a
`cross-sectional view taken along the front-to-back direction,
`a cross-sectional view taken along the left-to-right direction,
`and a partially enlarged view of a carrier leadframe accord(cid:173)
`ing to an embodiment of the present disclosure.
`FIG. 13A to FIG. 16 are schematic views illustrating steps
`of a method for manufacturing a carrier leadframe according
`to an embodiment of the present disclosure.
`FIG. 17A to FIG. 17D are respectively a top view, a
`cross-sectional view taken along the front-to-back direction,
`65 a cross-sectional view taken along the left-to-right direction,
`and a partially enlarged view of a carrier leadframe accord(cid:173)
`ing to an embodiment of the present disclosure.
`
`60
`
`IKEA Supply AG
`Exhibit 1001 Page 31 of 37
`
`

`

`US 9,640,733 B2
`
`3
`FIG. 18A to FIG. 22 are schematic views illustrating steps
`of a method for manufacturing a carrier leadframe according
`to an embodiment of the present disclosure.
`
`DETAILED DESCRIPTION OF PREFERRED
`EMBODIMENTS
`
`A carrier leadframe of the present invention comprises a
`frame body and a carrier, and the carrier includes a housing
`and at least one electrode portion. In the present invention,
`the frame body includes at least one supporting portion and
`is mechanically engaged with the carrier so that the carrier
`is supported on the frame body. In a specific embodiment of
`the present invention, the housing may have a concave
`portion mating with the supporting portion, and the carrier
`is supported on the frame body through the engagement
`between the supporting portion and the concave portion. The
`position of the concave portion is not particularly limited in
`the present invention, and the concave portion may be
`located at a side surface or at the border between a bottom
`surface and the side surface of the carrier. The supporting
`portion goes deep into the carrier or is only positioned on the
`bottom surface of the carrier with a half thereof being
`exposed outside.
`FIG. 1 is a partial schematic view of an embodiment of a 25
`carrier leadframe according to the present disclosure. As
`shown in FIG. 1, a carrier leadframe 100 comprises a carrier
`110 and a frame body 120, and the carrier 110 comprises a
`housing 111 and two electrode portions 112. The frame body
`120 comprises a plurality of supporting portions 121. As 30
`shown in FIG. 1, the frame body 120 beneath the carrier
`leadframe 100 comprises four supporting portions 121, and
`four concave portions are formed at the border between the
`side surfaces and the bottom surface of the housing 111
`(corresponding to positions of the supporting portions 121) 35
`so that each of the four supporting portions 121 is positioned
`on the bottom surface of the carrier 110 with a half thereof
`being exposed outside. In an embodiment, the carrier 110
`further comprises a reflection concave cup to expose a part
`of each of the electrode portions 112. The electrode portion
`112 extends outwardly from the reflection concave cup
`through the housing 111 to the outside.
`The frame body 120 may also have a rumier area 122 and
`a side portion 123, and the runner area 122 is disposed on the
`side portion 123. The runner area 122 is a through area that
`allows a plastic body 150 (as shown in FIG. 3) to be
`described later to flow therethrough, and the supporting
`portion 121 is disposed also on the side portion 123.
`Additionally, each of the electrode portions 112 may also
`be formed with pinholes, grooves (linear slits on the surface
`of the electrode portion) and steps in the present disclosure.
`The mechanical binding force between the housing and the
`electrode portion of the carrier can be increased due to the
`pinholes, the grooves and the steps. As shown in FIG. 1,
`each of the two electrode portions 112 in the carrier 110
`comprises two pinholes 141 and three grooves 143, and
`steps 142 are provided on edges of the two electrode
`portions 112 that are surrounded by the housing 111, thereby
`increasing the binding strength between the housing 111 and
`the electrode portions 112.
`Each carrier in the carrier leadframe of the present dis(cid:173)
`closure is supported on the frame body via the mechanical
`engagement between the concave portion and the supporting
`portion, and the electrode portions of different carriers are
`electrically isolated from each other. Thus, after the die
`bonding process, the wire bonding process and the encap(cid:173)
`sulation process subsequently performed on the light emit-
`
`4
`ting devices, the electric measurement can be made on the
`light emitting devices that have not been singulated (i.e., the
`light emitting devices that are still supported on the frame
`body in a regular way). Since the light emitting devices are
`5 arranged regularly, equipment and time required for surface
`orientation and direction adjustment are eliminated and the
`production speed of the light emitting devices can be greatly
`improved.
`The carrier leadframe of the present disclosure may be
`10 manufactured in the following way. First, a conductive sheet
`is provided. The conductive sheet comprises a frame body,
`at least one void area and at least one extending portion, and
`the frame body comprises at least one supporting portion.
`15 Then, a plastic body is formed on the conductive sheet to
`cover at least a part of the extending portion and at least a
`part of the supporting portion and to fill at least a part of the
`void area. Subsequently, the part of the extending portion
`exposed outside the housing and a part of the plastic body
`20 filled within the void area are respectively removed so as to
`form the carrier. In particular, after the two removing steps,
`the housing of the carrier is formed by the remaining plastic
`body, and the electrode portion of the carrier is formed by
`the extending portion remaining on the plastic body.
`Hereinafter, the manufacturing process of the carrier
`leadframe 100 of FIG. 1 will be detailed with reference to
`FIG. 2 to FIG. 4. First, a conductive sheet 160 as shown in
`FIG. 2 is provided. The conductive sheet 160 comprises a
`frame body 120, a plurality of void areas 130 and a plurality
`of extending portions 140. The frame body 120 also com(cid:173)
`prises a plurality of supporting portions 121, and each of the
`extending portions 140 comprises a plurality of pinholes
`141, grooves 143 and steps 142. Finally, the part of each of
`the extending portions 140 exposed outside the housing is
`removed to form the carrier leadframe 100 of FIG. 1.
`In the present disclosure, the conductive sheet may be
`made of a metal sheet, including a pure metal sheet, an alloy
`sheet, and a metal composite sheet, and the composite sheet
`is preferably a metal sheet cladded with a conductive layer
`40 having a relatively high resistance to oxidation or a rela(cid:173)
`tively high solder binding force ( e.g., a silver-plated copper
`sheet, or the like). The frame body, the extending portion and
`the void portion are formed in an appropriate way. When the
`conductive sheet is made of a metal sheet, the frame body,
`45 the extending portion and the void portion may be preferably
`formed through a stamping process; however, they may also
`be formed through a dicing process or a mold casting
`process. Moreover, if the conductive sheet has insufficient
`conductivity, a conductive layer (not shown) may be formed
`50 on the conductive sheet after the conductive sheet is pro(cid:173)
`vided (the conductivity of the conductive layer is higher than
`that of the conductive sheet) so as to increase the reliability
`of the subsequent test. The material of the conductive layer
`may include materials having high conductivity (e.g., silver,
`55 or the like).
`After the conductive sheet is provided, a plastic body is
`then formed on the conductive sheet. The way in which the
`plastic body is formed is not limited. For Example, the
`plastic body may be formed through transfer molding,
`60 injection molding, etc. The material of the plastic body is not
`limited. For example, it may be selected from plastic mate(cid:173)
`rials commonly used in this industry, e.g., epoxy composi(cid:173)
`tions, silicon compositions, polyphthalamide compositions,
`or polyethylene terephthalate compositions. In a specific
`65 embodiment of the present disclosure, the plastic body is
`made of an epoxy composition through transfer molding. In
`another embodiment, the plastic body may be a thermoset-
`
`IKEA Supply AG
`Exhibit 1001 Page 32 of 37
`
`

`

`US 9,640,733 B2
`
`5
`ting material and may further comprise a reflective material,
`e.g., titanium dioxide (Ti02), zinc oxide (ZnO) or boron
`nitride (BN).
`Next, a plastic body 150 is formed on the conductive sheet
`160 as shown in FIG. 3. The plastic body 150 covers a part 5
`of each of the extending portions 140 and completely covers
`all of the pinholes 141 and grooves 143. The plastic body
`150 also fills a part of the void area 130 (the part of the void
`area 130 above and below the extending portion 140 is not
`filled) and completely covers all of the supporting portions 10
`121. The plastic body 150 also fills the runner area 122 and
`is formed integrally with another adjacent plastic body 150.
`Further speaking, during the formation of the plastic body
`150 in the present disclosure, the material of the plastic body
`150 will fill the mold cavity of the mold and the void area. 15
`In this step, the housing 111 and the residual material 151 are
`still held together. The scope of the residual material 151 is
`defined depending on the subsequent application of the
`product. As shown in FIG. 3, what denoted by dotted lines
`is the residual material 151 defined in this embodiment. 20
`Thereafter, the defined residual material 151 is removed as
`shown in FIG. 4, thereby forming the housing 111 of the
`carrier 110.
`If the runner area 122 is filled with the plastic body 150,
`the residual material 151 may be removed in at least two
`steps, e.g., by firstly removing the residual material 151
`filled in the runner area 122 and then removing the residual
`material 151 filled in the void area 130 or vice versa. This
`can simplify the arrangement of knives for removing the
`residual material 151 in each step so that the knives have
`sufficient distances therebetween and desirable strength.
`Finally, the part of each of the extending portions 140
`exposed outside the housing 111 is removed to form the
`carrier leadframe 100 as shown in FIG. 1. Before the part of
`each of the extending portions 140 is removed, the part of
`the frame body 120 at two sides of the runner area 122 may
`be removed optionally with a knife of a length larger than
`that of the runner area 122 so as to thoroughly remove the
`residual material 151 possibly left in the runner area 122;
`thus, the damage to the electrode portions 112 or the light 40
`emitting diode (LED) chips can be avoided by preventing
`the residual material 151 from falling off onto the electrode
`portions 112 or the LED chips. After the part of the frame
`body 120 at the two sides of the runner area 122 is removed,
`the length of the runner area 122 is increased as shown in
`FIG. 4B.
`Therefore, the manufacturing method of this embodiment
`may optionally perform two or more removing steps on the
`conductive sheet 160 and may also perform two or more
`removing steps on the plastic body 150 (the residual material
`151).
`In the present disclosure, the residual material 151 and
`parts of the extending portions 140 are removed separately.
`In particular, the order in which the residual material 151
`and the parts of the extending portions 140 are removed is
`not particularly limited as long as they are separately
`removed. For example, it may be that all the parts of the
`extending portions 140 are simultaneously removed after all
`the residual material 151 is simultaneously removed, or all
`the residual material 151 is removed after all the parts of the
`extending portions 140 are simultaneously removed, or part
`of the residual material 151 and parts of the extending
`portions 140 are removed alternately in different stages. The
`way in which the removing steps are performed is not
`limited, and the removing steps may be accomplished for
`example through a dicing process or a stamping process but
`preferably be accomplished through the stamping process.
`
`6
`The stamping process is taken as an example in the embodi(cid:173)
`ments of the present disclosure.
`The tools and the working strength can be adjusted
`depending on the mechanical properties of the parts to be
`removed in the present disclosure. In particular, the respec(cid:173)
`tive removing steps can avoid drawbacks resulting from
`removing different materials simultaneously, e.g., plane
`defects or damage to the removing tools (knives) due to
`non-uniform stresses. Additionally, dusts of the plastic body
`tend to be produced during the removal of the plastic body
`as compared to the removal of the extending portion. The
`dusts can only be removed by a strong external force, e.g.,
`through strong air blowing, shaking, or ultrasonic waves. If
`the cleaning step is to be performed after the residual
`material and the extending portion are simultaneously
`removed, it is possible that the bonding force between the
`carrier and the frame body is insufficient to avoid falling off
`of the material. Thus, in the present disclosure, the cleaning
`step (i.e., the cleaning of the plastic body) is preferably
`performed after the residual material is removed and before
`the extending portion is removed. This can enhance the
`connection strength between the carrier and the leadframe
`by means of the extending portion so as to avoid falling off
`of the material during the cleaning step, and finally the
`25 extending portion is removed.
`After the removing steps, at least one electrode portion
`cross section will be formed on the electrode portion of the
`carrier, and a housing cross section will be formed by the
`residual material on the housing of the carrier. In the present
`30 disclosure, the electrode portion cross section and the hous(cid:173)
`ing cross section may be located on a same surface or
`different surfaces of the carrier depending on the safety
`specification of the final product or depending on the cus(cid:173)
`tomer requirements. Further speaking, when the electrode
`35 portion cross section and the housing cross section are
`located on the same surface of the carrier, the electrode
`portion cross section and the housing cross section may be
`level with each other (i.e., form a flat surface) or may not be
`level with each other (i.e., do not form a flat surface).
`As shown in FIG. 1, the electrode portion 112 has a wing
`portion 112A exposed outside the housing, and the wing
`portion 112A comprises a central protruding area ( or called
`central area) 112Al and two outer edge areas ( or called edge
`areas) 112A2. In the embodiment of FIG. 1, each of the edge
`45 areas 112A2 comprises an electrode portion cross section,
`and the electrode portion cross sections are level with a part
`of the housing cross section 111A of the housing 111; and in
`this case, the carrier has a relatively flat appearance. How(cid:173)
`ever, as shown in FIG. 5, the wing portion 112A of the
`50 electrode portion 112 comprises a central protruding area
`112Al and two outer edge areas 112A2, and the electrode
`portion cross section of the electrode portion 112 is not level
`with the housing cross section 111A of the housing 111; and
`in this case, the electrode portion 112 has an additional
`55 lateral area that can increase the binding force with the
`solder so as to increase the component bonding strength of
`the light emitting devices after the subsequent component
`bonding process.
`Moreover, in case where the conductive sheet is a metal
`60 composite sheet with an antioxidant layer, a cross section
`uncovered with the antioxidant layer will be formed on the
`electrode portion cross section. In the present disclosure, the
`cross section uncovered with the antioxidant layer is pref(cid:173)
`erably formed integrally with the central area of the elec-
`65 trade portion. During the subsequent component bonding
`process, the solder may climb along the side surface of the
`wing portion and cover the side surface, and in this case, at
`
`IKEA Supply AG
`Exhibit 1001 Page 33 of 37
`
`

`

`US 9,640,733 B2
`
`7
`least a part of