JP 2014-41966 A 2014.3.6
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`(19) Japan Patent
`Office (JP)
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`(51)
`Int.Cl.
`H01L 33/62
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`(12) Published Patent
`Application (A)
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`(11) Patent Application Publication
`No.
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`JP 2014-41966
`(P2014-41966A)
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`(43) Publication Date March 6, 2014 (2014.3.6)
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`Theme Code (Reference)
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`(2010.01)
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` H01L 33/00 440
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`5F142
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`Examination Request: Not Yet Number of Claims: 9 OL (total 15 pages)
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`(21) Filing No. JP 2012-184309 (P2012-184309)
`(22)Filing Date August 23, 2012 (2012.8.23)
`
` Patent
`
`Shigeno,
`
`000006172
`(71) Applicant
`Mitsubishi Plastics, Inc.
`1-1-1 Marunouchi, Chiyoda-ku, Tokyo
`(74) Agent
`100086911
`Tsuyoshi
`Attorney
`(72) Inventor
`Kazunori Umeda
`2-1-35 Nishishindo, Hiratsuka City,
`Kanagawa Prefecture
`Mitsubishi Plastics, Inc. Hiratsuka Plant
`(72) Inventor Jun Matsui
`2-1-35 Nishishindo, Hiratsuka City,
`Kanagawa Prefecture
`Mitsubishi Plastics, Inc. Hiratsuka Plant
`(72) Inventor Yukio
`Kato
`Mitsubishi Plastics, Inc., 1-1-1
`Marunouchi, Chiyoda-ku, Tokyo
`
`Continued on Last Page
`(54) [Title of Invention] PACKAGE FOR LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE
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`(57) [Abstract]
`[Problem] To provide a package capable of
`preventing deformation centered on a resin
`portion between lead electrodes, and a light
`emitting device using such a package.
`[Resolution Means] A package 2 has lead
`electrodes 10 and 20, and a resin molded body 3
`for resin molding the lead electrodes 10 and
`20, wherein the resin molded body 3 is in an
`annular shape, and a cup portion 3a for
`disposing light emitting elements is provided
`inside the resin molded body 3. A light emitting
`device having a light emitting element 4 mounted
`on this package. A reinforcing piece 30
`extending along the side of the lead electrode
`10 is provided on the lead electrode 20. The
`reinforcing piece 30 is embedded in a corner
`portion 3C of the resin molded body 3.
`[Selected Drawings] FIG. 5
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`IKEA Supply AG
`Exhibit 1007 Page 1 of 17
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`

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`(2)
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`JP 2014-41966 A 2014.3.6
`
`[Scope of Patent Claims]
`[Claim 1]
`A package for a light emitting device, comprising a first and second lead electrode disposed
`having one side of each facing each other, and a resin molded body molded to be integrated with
`the lead electrodes, wherein:
`the resin molded body is in an annular shape and a cup portion for disposing a light emitting
`element is provided in the resin molded body, and
`a reinforcing piece extending from both ends in a longitudinal direction of the one side and
`extending along the vicinity of the first lead electrode is provided on the second lead electrode.
`[Claim 2]
`The package for a light emitting device according to claim 1, wherein a protruding portion
`protruding toward the first lead electrode is provided at a tip end side of the reinforcing piece
`in an extending direction.
`[Claim 3]
`The package for a light emitting device according to claim 1 or 2, wherein at least a tip end
`side of the reinforcing piece in an extending direction is embedded in the resin molded body.
`[Claim 4]
`The package for a light emitting device according to any one of claims 1 to 3, wherein the first
`lead electrode has a recessed portion provided in a portion of a side portion along the reinforcing
`piece that overlaps with the resin molded body.
`[Claim 5]
`The package for a light emitting device according to any one of claims 1 to 4, wherein the second
`lead electrode is provided with a second reinforcing piece extending in an opposite direction to
`the reinforcing piece on both ends of a side length direction of a side portion opposite the one
`side.
`[Claim 6]
`The package for a light emitting device according to any one of claims 1 to 5, wherein
`the second lead electrode has a central portion in a longitudinal direction of a side portion
`opposite to the one side, the central portion being an extending portion extending outward, and
`a recessed portion is provided in a portion of a side portion of the extending portion that
`overlaps with the resin molded body.
`[Claim 7]
`The package for a light emitting device according to any one of claims 1 to 6, wherein a tip end
`portion of a hanging lead is inserted into the resin molded body, and
`the tip end portion of the hanging lead is bent to break away from the bottom of the resin molded
`body toward the tip end side.
`[Claim 8]
`The package for a light emitting device according to claim 7, wherein the thickness of the
`hanging lead is reduced toward the tip end side.
`[Claim 9]
`A light emitting device comprising the package for a light emitting device according to any one
`of claims 1 to 8 and a light emitting element mounted to the package.
`[Detailed Description of Invention]
`[Technical Field]
`[0001]
`The present invention relates to a package for a light emitting device in which a light emitting
`element such as an LED element is mounted, and a light emitting device using such a package.
`[Background Art]
`[0002]
`An example of a resin sealed light emitting device incorporating an LED light emitting element
`is illustrated in FIGS. 17 to 19. FIG. 17 is a perspective view of a LIGHT emitting device 100, and
`FIGS. 18(a) and (b) are cross-sectional views taken along lines XVIIIa-XVIIIa and XVIIIb-XVIIIb in
`FIG. 17. FIG. 19 is a plan view of a package 110.
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`IKEA Supply AG
`Exhibit 1007 Page 2 of 17
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`(3)
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`JP 2014-41966 A 2014.3.6
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`[0003]
`The package 110 of the light emitting device 100 has a first lead electrode 101, a second lead
`
`electrode 102, and a resin molded body 103 configured to be integrated with the lead electrodes
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`101 and 102. The resin molded body 103 is in an annular shape having a hole-like cup portion 103a,
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`and a portion of each of the lead electrodes 101 and 102 is exposed at the bottom of the cup
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`portion 103a. The outer ends of the lead electrodes 101 and 102 extend outward from the outer
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`periphery of the resin molded body 103.
`
`[0004]
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`A light emitting element 104 such as an LED is fixed onto the lead electrode 102 in the cup
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`10
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`portion 103a. The light emitting element 104 is connected to the respective lead electrodes 101
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`and 102 by thin metal wires 105 and 106.
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`[0005]
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`A bridge portion 103b made of resin is filled between the facing edges of the lead electrodes
`101 and 102. The bridge portion 103b crosses the bottom of the cup portion 103a in a chord direction
`and is integrated with the resin molded body 103.
`[0006]
`The lead electrodes 101 and 102 are exposed at the bottom of the light emitting device 100. In
`order to prevent the lead electrodes 101 and 102 from separating or rising up from the bottom of
`the resin molded body 103, step portions 101a and 102a are provided on the side ends of the lead
`electrodes 101 and 102 as illustrated in FIG. 18(b) (the reference symbol 101a is not shown in the
`drawings. ). The edges of the step portions 101a and 102a are embedded in the resin molded body
`103, thereby preventing the lead electrodes 101 and 102 from separating or rising up. Instead of
`providing the step portions 101a and 102a , the end faces of the side ends of the lead electrodes
`101 and 102 may be made downwardly inclined, and the upper sides of the end faces may be embedded
`in the resin molded body 103.
`[0007]
`FIG. 21 is a cross-sectional view of a mold for molding the resin molded body 103 of the package
`110. While the lead electrodes 101 and 102 are interposed between an upper mold 111 and a lower
`mold 112, a resin is filled into a cavity 113 using an injection device or the like to form the
`resin molded body 103. Reference numeral 111a in FIG. 21 is a projecting portion provided on the
`upper mold 111 for forming the cup portion 103a. The lead electrodes 101 and 102 are held between
`the projecting portion 111a and the lower mold. A portion of the periphery of the lead electrodes
`101 and 102 extends into the cavity 113.
`[Prior Art Documents]
`[Patent Documents]
`[0008]
`[Patent Document 1] JP 2008-140944 A
`[Summary of Invention]
`[Problem to be Solved by Invention]
`[0009]
`As illustrated in FIG. 19, in the X direction in FIG. 19 (the direction connecting the
`(1)
`lead electrodes 101 and 102), the lead electrodes 101 and 102 are not present in the bridge portion
`103b portion. Therefore, due to the difference in the linear expansion coefficient between the
`resin molded body 103 and the lead electrodes 101 and 102 and the load force during handling, the
`package 110 may deform so as to bend in the Z direction (the vertical direction in FIG. 20) centered
`on the bridge portion 103b as illustrated in FIGS. 20(a) and (b), and may break as illustrated in
`FIG. 20(c). This tendency becomes more pronounced when the resin is soft, such as silicone resin.
`Moreover, this tendency also becomes more pronounced when the difference in linear expansion
`coefficient between the resin molded body 103 and the lead electrodes 101 and 102 is large.
`[0010]
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`IKEA Supply AG
`Exhibit 1007 Page 3 of 17
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`

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`JP 2014-41966 A 2014.3.6
`(4)
`A first object of the present invention is to provide a package for a light emitting device
`capable of preventing deformation centered on a bridge portion (including suppression thereof;
`same hereafter ), and a light emitting device using such a package.
`(2)
`As illustrated in FIG. 19 , the lead electrodes 101 and 102 are not present on the four
`corners (corner portions) in a plan view of the package 110, and the four corners of the package
`110 are made only of resin. As a result, the strength and bending rigidity of the four corners of
`package 110 are low, and the resin molded body may be damaged or deformed in the Z direction near
`the four corners, causing the step portions 101a and 102a of the lead electrodes 101 and 102 to
`lose their engagement with the resin molded body 103, making it easier for the lead electrodes 101
`and 102 to rise up from the resin molded body 103. When the lead electrodes 101 and 102 rise up
`from the resin molded body 103, outside air will enter the gaps, and the upper surfaces of the
`lead electrodes 101 and 102 will be prone to deterioration and discoloration. This tendency becomes
`more pronounced when the resin is soft, such as a silicone resin.
`[0011]
`A second object of the present invention is to provide a package for a light emitting device and
`a light emitting device wherein strength and rigidity are high near the corner portions, damage to
`the resin molded body near the corner portions is prevented, and the lead electrodes are prevented
`from separating or rising up from the resin molded body.
`[0012]
`As illustrated in FIG. 21 , in the mold for molding the resin molded body 103, a portion
`(3)
`of the edges of the lead electrodes 101 and 102 extend into the cavity 113 and are not restrained
`by the projecting portion 111a of the upper mold 111. Therefore, the resin gets into the gap
`between the edge portions of the lead electrodes 101 and 102 and the lower mold 112, and burrs
`103B are likely to occur as illustrated in FIG. 22. In a light emitting device 100 having burrs
`103B, securing an area for reflow soldering becomes unstable, resulting in reflow soldering defects.
`This tendency is particularly noticeable when the resin is a silicone resin or the like having
`high fluidity. Note that FIG. 22 is a bottom view of the package 110.
`[0013]
`In one aspect, the present invention has the object of providing a package for a light emitting
`device and a light emitting device that prevent burrs on a rear surface of the lead electrode.
`[0014]
`Additionally, in another aspect, the present invention has the object of providing a package for
`a light emitting device and a light emitting device in which holding of the hanging leads is
`stable.
`[Means for Solving Problem]
`[0015]
`The package of the present invention is a package for a light emitting device, provided with a
`first and second lead electrode disposed having one side of each facing each other, and a resin
`molded body molded to be integrated with the lead electrodes, wherein: the resin molded body is in
`an annular shape and a cup portion for disposing a light emitting element is provided in the resin
`molded body, and a reinforcing piece extending from both ends in a longitudinal direction of the
`one side and extending along the vicinity of the first lead electrode is provided on the second
`lead electrode.
`[0016]
`It is preferable that a protruding portion protruding toward the first lead electrode is provided
`at a tip end side of the reinforcing piece in an extending direction.
`[0017]
`It is preferable that at least a tip end side of the reinforcing piece in an extending direction
`is embedded in the resin molded body.
`[0018]
`It is preferable that the first lead electrode has a recessed portion provided in a portion of
`a side portion along the reinforcing piece that overlaps with the resin molded body.
`[0019]
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`IKEA Supply AG
`Exhibit 1007 Page 4 of 17
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`

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`JP 2014-41966 A 2014.3.6
`(5)
`It is preferable that the second lead electrode is provided with a second reinforcing piece
`extending in an opposite direction to the reinforcing piece on both ends of a side length direction
`of a side portion opposite the one side.
`[0020]
`It is preferable that the second lead electrode has a central portion in a longitudinal direction
`of a side portion opposite to the one side, the central portion being an extending portion extending
`outward, and that a recessed portion is provided in a portion of a side portion of the extending
`portion that overlaps with the resin molded body.
`[0021]
`It is preferable that a tip end portion of a hanging lead is inserted into the resin molded body,
`and the tip end portion of the hanging lead is bent to break away from the bottom of the resin
`molded body toward the tip end side.
`[0022]
`It is preferable that the thickness of the hanging lead is reduced toward the tip end side.
`[0023]
`The light emitting device of the present invention has the package of the present invention and
`a light emitting element mounted to this package.
`[Effect of Invention]
`[0024]
`In the package for a light emitting device of the present invention, a reinforcing piece extending
`along the side portion of the first lead electrode is provided on the second lead electrode. The
`reinforcing piece extends across a resin portion (bridge portion) formed between the first and
`second lead electrodes. Therefore, when a force is applied so as to bend the package around the
`bridge portion, this force is resisted by the reinforcing piece, and bending deformation of the
`package is prevented.
`[0025]
`Furthermore, by having this reinforcing piece reinforce the corner portion of the resin molded
`body, the strength and rigidity of the corner portion of the package are improved, thereby
`preventing deformation or damage to the resin molded body on the corner portion and preventing the
`lead electrodes from separating or rising up due to this.
`[0026]
`Furthermore, at least the tip end side of the reinforcing piece in the extending direction is
`embedded in the resin molded body, which is more effective against the deformation and damage to
`the resin molded body and the separating and rising up of the lead electrodes, also facilitates
`resin flow into the resin made portion (bridge portion) formed between the first and second lead
`electrodes when the resin molded body is molded, and prevents outside air from flowing in between
`the first and second lead electrodes due to resin filling defects of the bridge portion and
`preventing sealant leakage defects.
`[0027]
`Providing a protruding portion that protrudes toward the first lead electrode on the reinforcing
`piece makes it possible to increase the strength and rigidity of the package. Furthermore, this
`makes it possible to prevent a gap from forming in the resin portion (bridge portion) formed
`between the first and second lead electrodes.
`[0028]
`Providing not only a reinforcing piece extending to the first lead electrode side, but also a
`second reinforcing piece extending to the opposite side, makes it possible to further increase the
`strength and rigidity of the package, prevent deformation of the resin molded body, and prevent
`the lead electrodes from separating or rising up due to this.
`[0029]
`By providing a recessed portion in a portion of the side portion of the first lead electrode
`that overlaps with the resin molded body, the generation of burrs in this portion is prevented. By
`providing a similar recessed portion in the second lead electrode, the generation of burrs in that
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`Exhibit 1007 Page 5 of 17
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`

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`JP 2014-41966 A 2014.3.6
`(6)
`portion is prevented. This makes it possible to reliably secure a reflow soldering area for mounting
`on a substrate even in a resin molded body having good fluidity, and to prevent reflow soldering
`connection defects.
`[0030]
`By bending the tip end portion of the hanging lead that supports the package, the package is
`held more stably. In particular, by making the tip end portion (hook portion) of the hanging leads
`thinner toward the tip end side, the thickness of the resin present below the hook portion (on the
`bottom side of the package) increases, thereby increasing the holding strength of the package.
`Moreover, while ensuring the holding strength of the hanging leads, the electrode lead in the resin
`molded body can be secured near the tip end portion (hook portion) of the hanging lead, and the
`strength and rigidity of the resin molded body near the tip end portion (hook portion) of the
`hanging lead can be secured.
`[Brief Description of Drawings]
`[0031]
`[FIG. 1] is a plan view of the light emitting device according to an embodiment.
`[FIG. 2] is a cross-sectional view taken along line II-II in FIG. 1.
`[FIG. 3] is an arrow view taken along line III-III in FIG. 1.
`[FIG. 4] is a bottom view of the light emitting device in FIG. 1.
`[FIG. 5](a) is a plan view of a package configuring the light emitting device in FIG. 1, and (b)
`is a plan view of lead electrodes of the package.
`[FIG. 6] is a cross-sectional view taken along line VI-VI in FIG. 5(a).
`[FIG. 7] is a cross-sectional end view taken along line VII-VII in FIG. 5(b).
`[FIG. 8] is a cross-sectional end view taken along line VIII-VIII in FIG. 5(b).
`[FIG. 9] is a cross-sectional view taken along line IX-IX in FIG. 5(a).
`[FIG. 10] is a cross-sectional view taken along line X-X in FIG. 5(a).
`[FIG. 11](a) is a cross-sectional perspective view taken along line XI-XI in FIG. 5(b), and (b) is
`a cross-sectional view of the same.
`[FIG. 12] is a cross-sectional view taken along line XII-XII in FIG. 5(b).
`[FIG. 13] is a cross-sectional view taken along line XIII-XIII in FIG. 5(b).
`[FIG. 14] is a plan view of a package to which hanging leads are connected.
`[FIG. 15] is a cross-sectional view taken along line XV-XV in FIG. 14.
`[FIG. 16] is an expanded view of the vicinity of the hanging leads in FIG. 15.
`[FIG. 17] is a perspective view of a conventional light emitting device.
`[FIG. 18](a) is a cross-sectional view taken along line XVIIIa-XVIIIa in FIG. 17, and (b) is a
`cross-sectional view taken along line XVIIIb-XVIIIb.
`[FIG. 19] is a plan view of a package of the light emitting device in FIG. 17.
`[FIG. 20] is a cross-sectional view taken along line XX-XX in FIG. 19.
`[FIG. 21] is a cross-sectional view of a mold for manufacturing a package.
`[FIG. 22] is a bottom view of a manufactured package.
`[FIG. 23] is a cross-sectional view of an end portion of a lead electrode.
`[FIG. 24] is a cross-sectional view of an edge of the lead electrode.
`[FIG. 25] is a configuration diagram of a lead electrode.
`[FIG. 26] is a configuration diagram of a lead electrode and a package.
`[Modes For Carrying Out Invention]
`[0032]
`Embodiments will be described below with reference to FIGS. 1 to 16.
`[0033]
`A light emitting device 1 has a package 2 made up of a first lead electrode 10, a second lead
`electrode 20, and a resin molded body 3 molded to be integrated with the lead electrodes 10 and
`20. The resin molded body 3 is in an annular shape having a cup portion 3a, and the outer periphery
`thereof is substantially square.
`[0034]
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`IKEA Supply AG
`Exhibit 1007 Page 6 of 17
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`JP 2014-41966 A 2014.3.6
`(7)
`A portion of each of the lead electrodes 10 and 20 is exposed at the bottom of the cup portion
`3a. The outer ends of the lead electrodes 10 and 20 extend outward from the outer periphery of the
`resin molded body 3.
`[0035]
`In the cup portion 3a, a light emitting element 4 such as an LED is fixed on the lead electrode
`20. The light emitting element 4 is connected to the respective lead electrodes 10 and 20 by thin
`metal wires 5 and 6. A bridge portion 3b made of resin is filled between the facing edges of the
`lead electrodes 10 and 20. The bridge portion 3b crosses the bottom of the cup portion 3a in a
`chord direction and is integrated with the resin molded body 3. Note that there may be one or a
`plurality of light emitting elements 4 on the lead electrode 20. FIG. 1 illustrates an example
`having a plurality.
`[0036]
`The lead electrodes 10 and 20 are exposed at the bottom of the light emitting device 1. In order
`to prevent the lead electrodes 10 and 20 from separating or rising up from the resin molded body
`3, step portions 10a and 20a are provided on the required location on the periphery on the bottom
`side of the lead electrodes 10 and 20. The edges of the step portions 10a and 20a are embedded in
`the resin molded body 3, thereby preventing the lead electrodes 10 and 20 from separating or rising
`up.
`[0037]
`Note that the angle of the corners of the step portions 10a and 20a is not limited to a right
`angle. Moreover, as illustrated in FIG. 23, the corners may have an arc-shaped cross section.
`Instead of providing the step portions 10a and 20a, the end faces of the side ends of the lead
`electrodes 10 and 20 may be made downwardly inclined, and the upper sides of the end faces may be
`embedded in the resin molded body 3, as in FIG. 24.
`[0038]
`
`The configuration of the lead electrodes 10 and 20 will be described in detail with reference to
`FIGS. 5 to 8. Note that FIG. 5(a) is a plan view of a package for a light emitting device 2 before
`mounting the light emitting element 4, FIG. 5(b) is a plan view of the lead electrodes 10 and 20,
`and the arrangement of the lead electrodes 10 and 20 in FIG. 5(b) is the same as the arrangement
`of the lead electrodes 10 and 20 in the package 2 in FIG. 5(a).
`[0039]
`
`As illustrated in 5(b), the lead electrode 10 is a thin plate having a substantially trapezoidal
`shape in a plan view, having a rear edge 11 facing the bridge portion 3b, a front edge 12 protruding
`from the resin molded body 3, and side edges connecting these. Partway along these side edges, at
`part of a position overlapping the resin molded body 3, a recessed portion 13 is provided that
`sticks into the center direction of the plate (the direction connecting the side edges). As
`illustrated in detail in FIGS. 11 and 12, a step portion 10a is provided on the sides facing the
`recessed portion 13 on a first side edge 14 more to the front edge side than the recessed portion
`13 and a second side edge 15 more to the rear edge side. The step portion 10a is also provided
`across the entire side of the rear edge 11.
`[0040]
`It is preferable for the recessed portion 13 to be provided at positions that are not exposed to
`the bottom of the cup portion 3a of the resin molded body 3 and to arrange the recessed portions
`13 closer to each other with respect to the line VIII-VIII in FIG. 5(b), since this can suppress
`the occurrence of burrs. In this case, the recessed portion 13 may be extended and the edges
`thereof may be disposed closer to the VIII-VIII line, but it is particularly preferable to extend
`the second side edge 15 and provide the recessed portion 13 at the tip end thereof, thereby
`disposing the recessed portions 13 closer to each other relative to the VIII-VIII line, which also
`improves the effect of preventing separating and rising up due to the step portion 10a.
`[0041]
`Furthermore, the step portion 10a may be either a first side edge 14 on the front edge side or
`a second side edge 15 on the rear edge side. By providing both the first side edge 14 on the front
`edge side and the second side edge 15 on the rear edge side, reinforcement against separation and
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`IKEA Supply AG
`Exhibit 1007 Page 7 of 17
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`(8)
`
`JP 2014-41966 A 2014.3.6
`
`rising up is improved.
`[0042]
`The lead electrode 20 is a thin plate having a rear edge 21 facing the bridge portion 3b, a front
`edge 22 protruding from the resin molded body 3, and side edges connecting these. A center portion
`in the longitudinal direction of the front edge 22 forms an extending portion 28 that extends
`outward in a substantially trapezoidal shape. Partway along the side edge of the extending portion
`28, at a position overlapping the resin molded body 3, a recessed portion 23 is provided that
`sticks into the center direction of the plate (the direction connecting the side edges). A step
`portion 20a is provided on the sides facing the recessed portion 23 on a first side edge 24 more
`to the front edge side than the recessed portion 23 and a second side edge 25 more to the rear
`edge side. The step portion 20a is also provided across the entirety of each side of the rear edge
`21.
`[0043]
`It is preferable for the recessed portion 23 to be provided at positions that are not exposed to
`the bottom of the cup portion 3a of the resin molded body 3 and to arrange the recessed portions
`23 closer to each other with respect to the line VIII-VIII in FIG. 5(b), since this can suppress
`the occurrence of burrs. In this case, the recessed portion 23 may be extended and the edges
`thereof may be disposed closer to the VIII-VIII line, but it is particularly preferable to extend
`the second side edge 25 and provide the recessed portion 23 at the tip end thereof, thereby
`disposing the recessed portions 23 closer to each other relative to the VIII-VIII line, which
`improves the effect of preventing separating and rising up due to the step portion 20a.
`[0044]
`Furthermore, the step portion 20a may be either a first side edge 24 on the front edge side or
`a second side edge 25 on the rear edge side. By providing both the first side edge 24 on the front
`edge side and the second side edge 25 on the rear edge side, reinforcement against separation and
`rising up is improved.
`[0045]
`A protruding part 26 extending outward is provided on a side portion of a main plate portion 27
`between the rear edge 21 and the front edge 22 of the lead electrode 20. A step portion 20a is
`formed on the bottom side of the protruding part 26.
`[0046]
`Reinforcing pieces 30 respectively extend from both ends of the rear edge 21 of the lead electrode
`20 (both ends in the extending direction of the bridge portion 3b) in a direction perpendicular to
`the bridge portion 3b. The reinforcing pieces 30 extend near to the corner portion 3C of the resin
`molded body 3. Each reinforcing piece 30 has a base end portion 31 on the base end side in the
`extending direction, and the tip end portion 32 more to the tip end side than the base end portion
`31. The upper surface of the base end portion 31 is flush with the main plate portion 27, but the
`upper surface of the tip end portion 32 is higher than this, forming a step-shaped portion 33
`between the two.
`[0047]
`As in FIGS. 7 and 11(b), the bottom of the reinforcing piece 30 is higher than the bottom of the
`main plate portion 27 by a height difference d, and when the resin molded body 3 is molded, resin
`flows under the reinforcing piece 30, so the entire reinforcing piece 30 is embedded within the
`resin molded body 3. However, only the tip end portion 32 of the reinforcing piece 30 may be
`embedded in the resin molded body 3.
`[0048]
`The thickness of the tip end portion 32 may be thinned by coining or the like, so that the upper
`surface of the tip end portion 32 is flush with the main plate portion 27 and the bottom of the
`tip end portion 32 is higher than the bottom of the main plate portion 27 to ensure the height
`difference d.
`[0049]
`Furthermore, ensuring the height difference d is effective against the deformation and damage to
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`IKEA Supply AG
`Exhibit 1007 Page 8 of 17
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`

`

`JP 2014-41966 A 2014.3.6
`(9)
`the resin molded body and the separating and rising up of the lead electrodes, also facilitates
`resin flow from the gap in a portion of the height difference d into the resin portion (bridge
`portion) formed between the first and second lead electrodes, and prevents outside air from flowing
`in between the first and second lead electrodes due to resin filling defects of the bridge portion
`and preventing sealant leakage defects.
`[0050]
`The side portion of the tip end portion 32 on the lead electrode 10 side forms a protruding
`portion 34 that protrudes toward the lead electrode 10.
`[0051]
`Reinforcing pieces 40 respectively extend from both ends of the front edge 22 of the lead
`electrode 20 in the extension direction of the extending portion 28 (direction perpendicular to
`the bridge portion 3b). The reinforcing piece 40 extends near to the corner portion 3D of the resin
`molded body 3. Each reinforcing piece 40 has a base end portion 41 on the base end side in the
`extending direction, and the tip end portion 42 more to the tip end side than the base end portion
`41. The upper surface of the base end portion 41 is flush with the main plate portion 27, but the
`upper surface of the tip end portion 42 is higher than this, forming a step-shaped portion 43
`between the two.
`[0052]
`As in FIG. 7, the bottom of the reinforcing piece 40 is higher than the bottom of the main plate
`portion 27 by the height difference d, and when the resin molded body 3 is molded, resin flows
`under the reinforcing piece 40, so the entire reinforcing piece portion 40 is embedded within the
`resin molded body 3. However, only the tip end portion 42 of the reinforcing piece 40 may be
`embedded in the resin molded body 3. The side portion of the tip end portion 42 on the extending
`portion 28 side forms a protruding portion 44 that protrudes toward the extending portion 28.
`[0053]
`The thickness of the tip end portion 42 may be thinned by coining or the like, so that the upper
`surface of the tip end portion 42 is flush with the main plate portion 27 and the bottom of the
`tip end portion 42 is higher than the bottom of the main plate portion 27 to ensure the height
`difference d.
`[0054]
`The package 2 is manufactured by molding the resin molded body 3 by disposing lead electrodes 1
`and 2 in the mold as illustrated in FIG. 21 above and supplying resin to the cavity.
`[0055]
`In the present embodiment, because the recessed portions 13 and 23 are provided on the lead
`electrodes 10 and 20, no burrs occur on the recessed portions 13 and 23 when the resin molded body
`3 is molded. Note that the sides of the front edges 12 and 22 of the first side edges 14 and 24
`of the lead electrodes 10 and 20 are held between the upper mold and lower mold when the resin
`molded body 3 is molded, so no burrs occur on the bottom side of the first side edges 14 and 24.
`[0056]
`Because the second side edges 15 and 25 are disposed to follow the contour of the projecting
`portion 111a of the upper mold 111 provided for forming the cup portion 3a of the resin molded
`body 3, the closest portion thereof is interposed between the upper mold projecting portion 111a
`(FIG. 21) and the lower mold 112, so no burrs occur on the bottom side of the second side edges
`15 and 25.
`[0057]
`Because the spaces between the recessed portions 13 and 13 and between the recessed portions 23
`and 23 of each lead electrode 10 and 20 form a narrow neck-shaped portion, there is no rising up
`from the lower mold when molding the resin molded body 3 due to the spaces between 14 and 14 and
`24 and 24, being held between the upper mold and the lower mold, which are larger than the space
`between the recessed portions 13 and 13 and the recessed portions 23 and 23, and burrs are
`prevented.
`[0058]
`
`In the package 2 and the light emitting device 1 configured as described above, as illustrated
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`IKEA Supply AG
`Exhibit 1007 Page 9 of 17
`
`

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`JP 2014-41966 A 20