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`05/21/2019
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`PATENT ASSIGNMENT COVER SHEET
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`Electronic Version v1.1
`Stylesheet Version v1.2
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`EPAS ID: PAT5533419
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`SUBMISSION TYPE:
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`NATURE OF CONVEYANCE:
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`RELEASE OF SECURITY INTEREST
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`CONVEYING PARTY DATA
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`JEFFERIES FINANCE LLC
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`RECEIVING PARTY DATA
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`Execution Date
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`05/17/2019
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`[Name:___—‘[LATTICESEWIGONDUCTORCORPORATION
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`Name:[SIBEAMSINGS
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`DELL/HP/LENOVO EXHIBIT 1002
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`DELL/HP/LENOVO EXHIBIT 1002
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`DELL/HP/LENOVO EXHIBIT 1002
`Page 31
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`Page 31
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`

`

`Fax Number:
`Correspondencewill be sent to the e-mail addressfirst; if that is unsuccessful, it will be sent
`using a fax number, if provided; if that is unsuccesstul, it will be sent via US Mail.
`Phone:
`4159472482
`Email:
`ukarandikar@wsgr.com
`Correspondent Name:
`URMILA KARANDIKAR
`AddressLine1:
`139 TOWNSEND STREET SUITE 150
`
`AddressLine 4:
`
`SAN FRANCISCO, CALIFORNIA 94107
`
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`source=Release of Patent Security Interest Payoff Executed 5-17-19#page21.tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page22.tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page23.tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page24.tif
`source=Releaseof Patent Security Interest Payoff Executed 5-17-19#page25.tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page26.tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page27.tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page28.tif
`source=Releaseof Patent Security Interest Payoff Executed 5-17-19#page29.tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page30.tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page31.tif
`source=Releaseof Patent Security Interest Payoff Executed 5-17-19#page32.tif
`
`PO This document serves as an Oath/Declaration (37 CFR 1.63).
`
`Total Attachments: 97
`
`DELL/HP/LENOVO EXHIBIT 1002
`Page 32
`
`DELL/HP/LENOVO EXHIBIT 1002
`Page 32
`
`

`

`source=Releaseof Patent Security Interest Payoff Executed 5-17-19#page81.tif
`
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page34.tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page35.tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page36.tif
`source=Releaseof Patent Security Interest Payoff Executed 5-17-19#page37.tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page38.tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page339.tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page40.tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page41.tif
`source=Release otf Patent Security Interest Payoff Executed 5-17-19#page42.tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page43.tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page44.tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page45.tif
`source=Release ot Patent Security Interest Payoff Executed 5-17-19#page46.tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page4/7.tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page48.tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page49.tif
`source=Release ot Patent Security Interest Payoff Executed 5-17-19#page50. tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page51.tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page52.tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page53.tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page54.tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page55.tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page56.tif
`source=Releaseof Patent Security Interest Payoff Executed 5-17-19#page57.tif
`source=Releaseof Patent Security Interest Payoff Executed 5-17-19#page58.tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page59.tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page60.tif
`source=Releaseof Patent Security Interest Payoff Executed 5-17-19#page61.tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page62. tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page63.tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page64.tif
`source=Releaseof Patent Security Interest Payoff Executed 5-17-19#page65.tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page66.tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page67tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page6s.tif
`source=Releaseof Patent Security Interest Payoff Executed 5-17-19#page69.tif
`source=Releaseof Patent Security Interest Payoff Executed 5-17-19#page70.tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page71.tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page72.tif
`source=Releaseof Patent Security Interest Payoff Executed 5-17-19#page73.tif
`source=Releaseof Patent Security Interest Payoff Executed 5-17-19#page74.tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page75.tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page76.tif
`source=Releaseof Patent Security Interest Payoff Executed 5-17-19#page77.tif
`source=Releaseof Patent Security Interest Payoff Executed 5-17-19#page78.tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page79.tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#pages0.tif
`
`DELL/HP/LENOVO EXHIBIT 1002
`Page 33
`
`DELL/HP/LENOVO EXHIBIT 1002
`Page 33
`
`

`

`source=Releaseof Patent Security Interest Payoff Executed 5-17-19#page97.tif
`
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page82.tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page8s3.tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page84.tif
`source=Releaseof Patent Security Interest Payoff Executed 5-17-19#page85.tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#pages6.tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page87.tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page88.tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page839.tif
`source=Release ot Patent Security Interest Payoff Executed 5-17-19#page90. tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page91.tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page92.tif
`source=Releaseof Patent Security Interest Payoff Executed 5-17-19#page93.tif
`source=Release ot Patent Security Interest Payoff Executed 5-17-19#page94.tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page95.tif
`source=Release of Patent Security Interest Payoff Executed 5-17-19#page96.tif
`
`DELL/HP/LENOVO EXHIBIT 1002
`Page 34
`
`DELL/HP/LENOVO EXHIBIT 1002
`Page 34
`
`

`

`RELEASE OF A SECURITY INTEREST -- PATENTS
`
`May 17, 2019
`
`WHEREAS,pursuantto that certain (i) Grant of Security Interest in United States
`Patents, dated as of March 10, 2015, Reel 035222, Frame 0866, (11) Grant of Security Interest in
`United States Patents, dated as of March 10, 2015, Reel 035308, Frame 0428, (iii) Grant of
`Security Interest in United States Patents, dated as of March 10, 2015, Reel 035223, Frame 0001,
`(iv) Grant of Security Interest in United States Patents, dated as of March 10, 2015, Reel 035226,
`Frame 0289, (v) Grant of Security Interest in United States Patents, dated as of March 10, 2015,
`Reel 035223, Frame 0387, (vi) Grant of Security Interest in United States Patents, dated as of
`March 10, 2015, Reel 035226, Frame 0147, (vii) Grant of Security Interest in United States
`Patents, dated as of March 10, 2015, Reel 035220, Frame 0048, (viii) Grant of Security Interest
`in United States Patents, dated as of March 10, 2015, Reel 035220, Frame 0226, (ix) Grant of
`Security Interest in United States Patents, dated as of March 10, 2015, Reel 035309, Frame 0142,
`(x) Grant of Security Interest in United States Patents, dated as of March 10, 2015, Reel 035308,
`Frame 0345, (xi) Grant of Security Interest in United States Patents, dated as of March 10, 2015,
`Reel 035225, Frame 0839 and (xii) Grant of Security Interest in United States Patents, dated as
`of March
`10,
`2015, Reel
`035225,
`Frame
`0352, LATTICE SEMICONDUCTOR
`CORPORATION, SILICON IMAGE,INC., SIBEAM,INC. and DVDO, INC., each a Delaware
`corporation (each, a “Releasee”), granted to JEFFERIES FINANCE LLC, as collateral agent for
`the ratable benefit of the Secured Creditors (the “Releasor”), a continuing security interest in all
`right, title and interest of the Releasees in, to and under United States Patents listed on the
`attached Schedule A (the “Patents”), and all Proceeds in respect thereof (with all of the
`Releasee’s rights listed above being collectively referred to as the “Collateral”) to secure the
`payment, performance and observance of the Obligations;
`
`WHEREAS,the Releasees havesatisfied their Obligations; and
`
`WHEREAS,the Releasee has requested and the Releasor has agreed to provide a
`document suitable for recording in the United States Patent and Trademark Office evidencing
`and effecting the release, relinquishment and discharge ofits security interest in the Collateral.
`
`NOW, THEREFORE,in consideration of and in exchange for good and valuable
`consideration, the Releasor hereby agreesas follows:
`
`Defined Terms. All capitalized terms used but not otherwise defined herein have
`1.
`the meanings given to them in the Grants of Security Interests in United States Patents.
`
`Release of Security Interest. The Releasor hereby, without any representation and
`2.
`warranty and without any recourse to the Releasor, releases, relinquishes and dischargesall ofits
`security interest in the Collateral.
`
`[Signature Page Follows]
`
`67051376v3
`
`DELL/HP/LENOVO EXHIBIT 1002
`Page 35
`
`DELL/HP/LENOVO EXHIBIT 1002
`Page 35
`
`

`

`IN WITNESS WHEREOPF, the undersigned has executed and delivered this Release as of
`the date first written above.
`
`JEFFERIES FINANCE LLC,
`as Collateral Agent and Releasor
`
`By: Thus Ub
`
`Name:
`Title:
`
`Paul Chisholm
`Managing Director
`
`[Signature Page to Release of Patent Security Interest]
`
`DELL/HP/LENOVO EXHIBIT 1002
`Page 36
`
`DELL/HP/LENOVO EXHIBIT 1002
`Page 36
`
`

`

`SCHEDULE A
`
`08/396,994
`
`Lattice
`Continuous Time
`Semiconductor
`Programmable Analog Block
`Architecture
`Corporation
`
`5574678
`
`United States
`
`08/403,359
`
`5510738
`
`United States
`
`Lattice
`CMOS Programmable
`Semiconductor
`Resistor-Based
`Transconductor
`Corporation
`
`Issued
`
`08/403 ,354
`
`5493205
`
`United States
`
`08/403,352
`
`5617064
`
`United States
`
`Low Distortion Differential
`Transconductor Output
`Current Mirror
`
`Issued
`
`Lattice
`Semiconductor
`Corporation
`
`Issued
`
`08/403,595
`
`5670907
`
`United States
`
`Lattice
`VBB Reference for Pumped
`Semiconductor
`Substrates
`Corporation
`
`Issued
`
`Issucd
`
`Lattice
`Active Resistor For Stability
`Semiconductor
`Compensation[of
`Corporation
`Transconductor & Op-Amp
`
`Based Gain & Filter Stages]
`
`Corporation
`
`08/423,303
`
`5490074
`
`United States
`
`Lattice
`Constant delay interconnect
`Semiconductor
`for coupling configurable
`logic blocks Corporation
`
`
`08/427,117
`
`5596524
`
`United States
`
`CMOS memory cell with gate
`oxide of both NMOS and
`PMOS transistors as tunneling
`windowfor program and
`erase
`
`Issued
`
`Lattice
`Semiconductor
`Corporation
`
`08/444,306
`
`5491433
`
`United States
`
`Lattice
`Cascodearray cell
`Semiconductor
`partitioning for a sense
`Corporation
`amplifier of a programmable
`
`logic device
`
`Issued
`
`08/449,384
`
`5756367
`
`United States
`
`Lattice
`Method of making a spacer
`Semiconductor
`based antifuse structure for
`Corporation
`low capacitance and high
`
`reliability
`
`Issued
`
`08/447,991
`
`5594687
`
`United States
`
`Completely complementary
`MOS memorycell with
`tunneling through the NMOS
`and PMOS transistors during
`program and erase
`
`Issucd
`
`Lattice
`Semiconductor
`
`DELL/HP/LENOVO EXHIBIT 1002
`Page 37
`
`DELL/HP/LENOVO EXHIBIT 1002
`Page 37
`
`

`

`Very high-density complex
`programmable logic device
`with a multi-tiered
`hierarchical switch matrix and
`optimized flexible logic
`allocation
`
`
`Issued Lattice
`
`08/458,865
`
`5589782
`
`United States
`
`08/459,570
`
`—
`
`08/461,196
`
`5586044
`
`Macrocell and clock signal
`allocationcircuit for a
`programmable logic device
`(PLD)enabling PLD
`resources lo provide multiple
`functions
`
`Programmable optimized-
`distribution logic allocator for
`a high-density complex PLD
`
`Array of configurable logic
`blocks including cascadable
`lookup tables
`
`08/462,934
`
`5469368
`
`United States
`
`Array of configurable logic
`blocks each includinga first
`
`Issued
`
`
`
`08/453, 184
`
`5570046
`
`United States
`
`Lead frame with noisy and
`quiet Vss and Vdd leads
`
`Issued
`
`Lattice
`Semiconductor
`Corporation
`
`08/453,479
`
`5583451
`
`United States
`
`Lattice
`Polarity control circuit which
`Semiconductor
`may be used with a ground
`bounce limiting buffer Corporation
`
`
`Issued
`
`08/456,946
`
`5621650
`
`United States
`
`Programmable gate array with
`improved interconnect
`structure, input/output
`structure and configurable
`logic block
`
`Issued
`
`Lattice
`Semiconductor
`Corporation
`
`08/459,960
`
`5521529
`
`United States
`
`Issued
`
`Lattice
`Semiconductor
`Corporation
`
`08/459,230
`
`5818254
`
`United States
`
`Multi-tiered hierarchical high
`speed switch matrix structure
`for very high-density complex
`programmable logic devices
`
`Issued
`
`Lattice
`Semiconductor
`Corporation
`
`08/459,234
`
`5781030
`
`United States
`
`Lattice
`Programmable uniform
`Scmiconductor
`symmmctrical distribution logic
`Corporation
`allocator for a high-density
`
`complex PLD
`
`Tssued.
`
`08/459,786
`
`5638018
`
`United States
`
`Lattice
`Semiconductor
`Corporation
`
`P-type flip flop
`
`Issued
`
`Semiconductor
`Corporation
`
`Lattice
`Semiconductor
`Corporation
`
`Lattice
`Semiconductor
`Corporation
`
`Lattice
`Semiconductor
`
`DELL/HP/LENOVO EXHIBIT 1002
`Page 38
`
`DELL/HP/LENOVO EXHIBIT 1002
`Page 38
`
`

`

`
`
`lookup table coupled to
`selectively replace an output
`of second lookup with an
`alternate function output
`
`Corporation
`
`08/486,178 United States|Family of multiple segmented5764078 Issued Lattice
`
`
`
`
`
`programmable logic blocks
`Semiconductor
`interconnected by a high
`Corporation
`speed centralized switch
`matrix
`
`
`
`08/474,629
`
`5612631
`
`United States
`
`An I/O macrocell for a
`programmable logic device
`
`Issued
`
`Lattice
`Semiconductor
`Corporation
`
`08/479,872 Uniled States|A High density programmable5869981 Issued Lattice
`
`
`
`
`
`logic device
`Semiconductor
`
`Corporation
`
`
`
`08/486,174
`
`5594365
`
`United States
`
`Architecture of a multiple
`array high density
`programmable logic device
`with a plurality of
`programmable switch
`matrices
`
`Issued
`
`Lattice
`Semiconductor
`Corporation
`
`08/474,635
`
`5811986
`
`United States
`
`Flexible
`synchronous/asynchronous
`cell structure for a high
`density programmable logic
`device
`
`
`Issucd
`
`Lattice
`Semiconductor
`Corporation
`
`
`
`08/466,438 United States|Reference for CMOS memory5754471 Issued Lattice
`
`
`
`cell having PMOS and NMOS
`Semiconductor
`transistors with a common
`Corporation
`floating gate
`
`
`
`
`
`Corporation
`
`
`
`08/466,438 United States|Low power CMOS array fora5754471 Issued Lattice
`
`
`
`PLD with programand erase
`Semiconductor
`using controlled avalanche
`injection
`
`08/473,620
`
`5594657
`
`United States
`
`Field Programmable Gate
`Array Using Look-Up Tables,
`Multiplexers and Decoders
`
`Issued
`
`Lattice
`Semiconductor
`Corporation
`
`08/483,623 United States|Multiple array programmable5617042 Issucd Lattice
`
`
`
`
`
`
`
`logic device with a plurality
`Semiconductor
`of programmable switch
`Corporation
`matrices
`
`
`
`
`
`08/492,604 United States|System for Synthesizing Field5526278 Issued Lattice
`
`
`Programmable Gate Array
`Semiconductor
`
`3
`
`DELL/HP/LENOVO EXHIBIT 1002
`Page 39
`
`DELL/HP/LENOVO EXHIBIT 1002
`Page 39
`
`

`

`
`
`Corporation
`Implementations From High
`Level Circuit Descriptions
`
`
`08/493,640
`
`5679599
`
`United States
`
`Issucd
`
`08/494,271
`
`5565794
`
`United States
`
`08/497,992
`
`5742542
`
`United States
`
`Voltage range tolerant CMOS
`output buffer with reduced
`input capacitance
`
`Issued
`
`Nonvolatile memory cells
`using only positive charge to
`store data
`
`Lattice
`Semiconductor
`Corporation
`
`Lattice
`Semiconductor
`Corporation
`
`08/500,295
`
`5700698
`
`United States
`
`Lattice
`Method for screening non-
`Semiconductor
`volatile memory and
`
`programmable logic devices Corporation
`
`Issued
`
`Lattice
`Isolation using sclf-aligned
`Semiconductor
`trench formation and
`conventional LOCOS
`Corporation
`
`Corporation
`
`08/501,230
`
`5604370
`
`United States
`
`Field Implant For
`Semiconductor Device
`
`Issued
`
`08/505,837
`
`5635855
`
`United States
`
`08/507,893
`
`3570039
`
`United States
`
`Method for Simultaneous
`Programming of In-System
`Programmable Integrated
`Circuits
`
`Method and Apparatus for
`Converting Field-
`Programmable Gate Array
`Implementations Into Mask-
`Programmable Logic Cell
`Implementations
`
`Lattice
`Semiconductor
`Corporation
`
`Lattice
`Semiconductor
`Corporation
`
`Lattice
`Semiconductor
`Corporation
`
`08/507,957
`
`5559450
`
`United States
`
`Lattice
`Programmable Function Unit
`Semiconductor
`AsParallel Multiplier Cell
`Corporation
`
`Issued
`
`08/528,030
`
`5581126
`
`United States
`
`Interlaced layout
`configuration for differential
`pairs of interconnect lines
`
`Issued
`
`Lattice
`Semiconductor
`Corporation
`
`08/535,362
`
`5528170
`
`United States
`
`Lattice
`Low-Skew Signal Routing In
`Semiconductor
`A Programmable Array
`Corporation
`
`Issued
`
`08/55 1,974
`
`5615150
`
`United States
`
`control gate-addressed cmos
`non-volatile cell that
`programs through gates of
`CMOS transistors
`
`Issued
`
`Lattice
`Semiconductor
`
`DELL/HP/LENOVO EXHIBIT 1002
`Page 40
`
`DELL/HP/LENOVO EXHIBIT 1002
`Page 40
`
`

`

`
`
`08/554,092
`
`5587945
`
`United States
`
`08/560,038
`
`5666309
`
`United States
`
`CMOS EEPROMcell with
`tunneling windowin the read
`path
`
`Memory cell for a
`programmable logic device
`(PLD)avoiding pumping
`programming voltage above
`an NMOS threshold
`
`Issued
`
`Issued
`
`Lattice
`Semiconductor
`Corporation
`
`Lattice
`Semiconductor
`Corporation
`
`08/560,933
`
`5587921
`
`United States
`
`Lattice
`Array of configurable logic
`Semiconductor
`blocks each including a
`Corporation
`lookup table having inputs
`coupledtoafirst multiplexer
`and having outputs to a
`second multiplexer
`
`Issued
`
`08/561,306
`
`5672521
`
`United States
`
`08/573,622
`
`5809522
`
`United States
`
`08/574.776
`
`5739713
`
`United States
`
`Microprocessor system with
`process identification tag
`entries to reduce cache
`flushing after a context switch
`
`Deconvolution input buffer
`compensating for capacitance
`of a switch matrix of a high
`density programmable logic
`device
`
`Issued
`
`Issued
`
`Tssued
`
`Lattice
`Semiconductor
`Corporation
`
`Lattice
`Semiconductor
`Corporation
`
`08/575,898
`
`5736888
`
`United States
`
`Lattice
`Semiconductor
`Corporation
`
`
`Capacitance elimination
`circuit
`
`Issued
`
`
`
`Lattice
`Method of forming multiple
`Semiconductor
`gate oxide thicknesses ona
`
`wafer substrate Corporation
`
`Corporation
`
`08/575,852 Uniled States|Clock generator circuit for use5719516 Issued Lattice
`
`
`
`
`
`with a dual edge register that
`Semiconductor
`provides a separate enable for
`Corporation
`each edge over aninput clock
`signal
`
`08/596,679
`
`5598346
`
`United States
`
`08/606,702
`
`5623217
`
`Unite

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