United States Patent (19)
`Krajewski et al.
`
`||||||||||||||III
`USOO516751 1A
`11
`Patent Number:
`5,167,511
`45
`Date of Patent:
`Dec. 1, 1992
`
`54
`
`75
`
`73
`21
`22
`(51)
`(52)
`58)
`
`(56)
`
`HGH DENSITY INTERCONNECT
`APPARATUS
`Inventors: Nicholas J. Krajewski, Chippewa
`Falls, Wis.; Carl D. Breske, Scandia,
`Minn.; David J. Johnson; David R.
`Kiefer, both of Chippewa Falls, Wis.;
`Kent T. McDaniel, Eau Claire, Wis.;
`William T. Moore, Jr., Elk Mound,
`Wis.; Michael R. Edwards, Eau
`Claire, Wis.; Bricky A. Stephenson,
`Chippewa Falls, Wis.; Anthony A.
`Vacca, Eau Claire, Wis.
`Assignee: Cray Research, Inc., Eagan, Minn.
`Appl. No.: 618,603
`Fied:
`Nov. 27, 1990
`Int. Cl. ........................ H01R 23/70; H05K 1/11
`U.S. C. ........................................ 439/61; 439/67;
`439/161; 439/260; 361/413
`Field of Search ............................. 439/65, 59-62,
`439/67, 77, 493, 161, 260; 361/413, 415
`References Cited
`U.S. PATENT DOCUMENTS
`2,701,346 2/1955 Powel .................................. 439/75
`3,139,559 6/1964 Heidler .
`3,187,210 6/1965 Ost .
`3,212,049 10/1965 Mittler et al. .
`3,526,869 9/1970 Conrad et al. ...................... 439/260
`3,529,23 9/1970 Farrand et al. .
`3,541,490 1 1/1970 Berg .
`3,541,494 11/1970 Berg.
`3,913,444 10/1975 Otte ....................................... 29/.447
`4,054,939 10/1977 Amnon ............................... 36A4
`4,220,382 9/1980 Ritchie et al. .
`4,272,143 6/1981 Weiss .
`4,400,049 8/1983 Schuck .
`4,462,651 7/1984 McGaffigar ........................ 439/16
`4,472,765 9/1984 Hughes ........
`... 36/393
`4,621,882 11/1986 Krumme ............................. 439/161
`4,626,056 2/1986 Andrews, Jr. et al. .
`4,629,270 12/1986 Andrews, Jr. et al. ............. 439/260
`
`
`
`4,744,764 5/1988 Rubenstein .......................... 439/260
`4,838,798 6/1989 Evans et al. ........................ 439/493
`4,881,908 11/1989 Perry et al.......................... 439/16
`FOREIGN PATENT DOCUMENTS
`54-53288 4/1979 Japan ................................... 439/161
`OTHER PUBLICATIONS
`Document, "Shape Memory Metal' published by Ray
`chem (no date).
`Document, "CryoTact Dip Socket' published by Ray
`chem (no date).
`Article "Titanium: for When you care enough to use
`the Very Best', Smithsonian Magazine, May 1987, vol.
`18 No. 2.
`The article “55-Nitinol: Unique Wire Alloy with a
`Memory”, Wire Journal, p. 41, Jun. 1969.
`The article “The Shape Memory Effect in Alloys",
`Metal Science Journal, p. 175, 1972.
`The article "Shape Memory Effect Alloys: Basic Prin
`ciples' (no date).
`Document "PGA Connector', published by Raychem
`(no date).
`Primary Examiner-Neil Abrams
`Attorney, Agent, or Firm-Merchant, Gould, Smith,
`Edell, Welter & Schmidt
`57
`ABSTRACT
`The invention comprises a plurality of stacked planar
`processing circuit boards surrounded on at least one
`side by a plurality of memory boards located substan
`tially perpendicular to the planar processing boards, the
`processing and memory boards connected by orthogo
`nal interconnect modules. The orthogonal interconnect
`modules allow closely-spaced orthogonal connection of
`the processing boards to the memory boards. The nem
`ory boards are of a densely packed design having a
`plurality of removeable memory chip stacks located on
`the memory boards.
`
`26 Claims, 20 Drawing Sheets
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`Dec. 1, 1992
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`Sheet 1 of 20
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`5,167,511
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`Sheet 2 of 20
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`FIG. 2
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`Dec. 1, 1992
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`Sheet 3 of 20
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`5,167,511
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`5,167,511
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`Sheet 10 of 20
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`66
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`62
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`F.G. 12
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`Dec. 1, 1992
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`Sheet 11 of 20
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`5,167,511
`
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`O O O O O O O
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`FIG. 16
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`3
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`Dec. 1, 1992
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`Sheet 15 of 20
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`F.G. 18
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`Sheet 17 of 20
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`5,167,511
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`Dec. 1, 1992
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`Sheet 18 of 20
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`5,167,511
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`
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`
`FIG. 21
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`Dec. 1, 1992
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`Sheet 20 of 20
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`5,167,511
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`
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`FIG. 23
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`1
`
`HIGH DENSITY INTERCONNECT APPARATUS
`TECHNICAL FIELD OF THE INVENTION
`The present invention relates to a high density inter
`connect apparatus for connecting a plurality of central
`processing boards with a plurality of memory boards in
`a close configuration. More particularly, the invention
`comprises a plurality of stacked central processing
`10
`boards surrounded on two sides by a plurality of mem
`ory boards located in planes perpendicular to the cen
`tral processing board planes and connected by orthogo
`nal interconnect modules.
`BACKGROUND OF THE INVENTION
`15
`Large electrical devices such as supercomputers of
`the type manufactured by Cray Research, Inc., the
`assignee of the present invention, are constructed of a
`large plurality of integrated circuit chips for both pro
`cessing and memory. In order to increase the processing
`20
`speed of these electrical devices, the processors are
`being connected closer to one another to increase the
`speed of the units.
`In the prior art, the connections between the central
`processing boards and memory boards of multiproces
`25
`sor systems have been both cumbersome and long. As a
`result, the processing speed of the systems has been
`limited by the speed with which electronic signals can
`physically travel along connections, which is approxi
`mately one nanosecond per foot of length traveled. In
`addition, such systems have been difficult to disassem
`ble for repair.
`Further adding to the physical length of connections
`between the processing units and memory is the con
`cept of a "completely connected system' as required in
`35
`multiprocessor computer systems. Completely con
`nected systems require that each central processing
`board be connected with each memory board, resulting
`in a large number of connections and increased dis
`tances between the central processing boards and men
`40
`ory boards. As a result, the delays caused by signals
`travelling between the boards have limited the speed of
`multiprocessor supercomputer systems of the type man
`ufactured by Cray Research, Inc.
`In order to overcome the problems of the prior art,
`45
`the present invention employs a novel system of orthog
`onal connectors to provide a large number of short
`connections between circuit boards. The connectors
`employ shape memory metals which are disclosed for
`use in electronic connectors in U.S. Pat. No. 4,621,882
`to Krumme, issued on Nov. 11, 1989, which is incorpo
`rated herein by reference. That reference discloses
`semi-circular connectors using shape memory metal
`primarily to provide zero-insertion-force connectors
`and include traces on flexible circuits to make connec
`55
`tion to traces on boards. That reference does not, how
`ever, refer to the use of such connectors in orthogonal
`connectors, nor does it refer to the use of such connec
`tors in close configured completely connected multi
`processor systems as described herein.
`SUMMARY OF THE INVENTION
`The present invention relates primarily to the organi
`zation and physical connection between a number of
`central processing (CP) boards with a number of com
`65
`mon memory module (CMM) boards in a completely
`connected multiprocessor computer system. More par
`ticularly, the present invention describes a plurality of
`
`5,167,511
`2
`stacked CP boards connected on opposing edges to
`CMM boards which are located in planes perpendicular
`to those of the CP boards. That orthogonal relationship
`between the CP boards and the CMM boards allows for
`a physically small package even though the system is
`completely connected by a sufficient number of inter
`connections to allow each CP board to adequately ac
`cess the memory contained in each CMM board.
`To accomplish the orthogonal connections between
`boards, the present invention further comprises an or
`thogonal interconnect module (OIM) which is particu
`larly well suited to connecting boards located in per
`pendicular planes with a large number of interconnec
`tions having a short length. The distance between the
`boards is critical to insure that the time needed for sig
`nal travel does not inordinately limit the processing
`speed of the system.
`In addition, the orthogonal interconnect modules also
`include memory metal connection devices which allow
`zero insertion force (ZIF) connections between the
`OIM and boards. Such zero insertion force connectors
`are advantageous in that boards may be removed as
`required for repairs or servicing without damaging
`them. In the preferred embodiment, the orthogonal
`interconnect modules with their memory metal connec
`tions can be controlled by heaters to allow the connec
`tions to open for removal or insertion of a board, but
`when cooled, provide an adequate force to make elec
`trical connection between the board and connector.
`In the preferred embodiment, the orthogonal inter
`connect modules further include two flex cables which
`together supply 520 separate traces terminating in
`contact bumps to connect the boards at each end of the
`OIM. The maximum trace length of the preferred flex
`cable is less than four inches, thus providing a closely
`spaced short path interconnect between the CP boards
`and the CMM boards of the preferred embodiment. In
`addition, individual cables can be replaced if damaged
`or otherwise inoperative.
`The resulting preferred package of stacked CP
`boards surrounded on two sides by CMM boards
`stacked in perpendicular planes is submerged in a ther
`mally conductive, electrically insulated bath to provide
`sufficient cooling of the boards during operation. In the
`preferred embodiment, the electrical power supplies for
`the system are located directly below the boards, result
`ing in a compact, high speed multiprocessor based
`supercomputer.
`Also in the preferred embodiment, each CMM board
`includes a plurality of memory chip stacks with each
`pair of stacks supported by a pair of common memory
`stack edge boards which, in turn, plug into memory
`stack connectors (MSC). Each preferred MSC includes
`a memory metal portion which allows the connector to
`open and close as desired to provide a zero insertion
`force (ZIF) connection between the edge boards and
`the CMM board, thus allowing for simplified off-board
`repair of the memory stacks.
`Each MSC preferably includes a flex connector at
`tached to the MSC having a plurality of trace lines that
`connects the edge boards to the CMM board to provide
`electrical communication lines between the stacked
`memory chips and the CMM board. The edge boards
`have a plurality of traces connected to the memory
`chips matching the pattern of those on the MSC flex
`connector. The edge boards also contain through-holes
`to connect with leads protruding from the memory
`
`30
`
`50
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`5,167,511
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`4.
`chips. The chip leads are preferably bent to provide
`board with the memory stack flex connector trace pat
`mechanical and thermal stability to the stacks.
`tern;
`In the preferred embodiment, the CP and CMM
`FIG. 20 is a cross section of an individual memory
`chip lead as attached to a CMM stack edge board;
`boards consist of multi-layer circuit boards whose con
`FIG.21 is a cross section of a memory stack connec
`struction is well-known to those skilled in the art. The
`tor showing the trace pattern attached thereto;
`preferred embodiment of the CP boards includes 10
`FIG.22 is a top view of the trace pattern of the mem
`locations (five on each of two opposing major sides) for
`ory stack flex connector; and
`interconnection with the orthogonal interconnect mod
`FIG. 23 is an enlarged view of the memory stack flex
`ules which are, in turn, each connected to a CMM
`connector traces at the CMM board window.
`board or other electrical component. Also in the pre
`10
`ferred embodiment, the CP boards contain areas on the
`DETAILED DESCRIPTION OF THE
`two edges not connected to CMM's for connection of
`PREFERRED EMBODEMENT
`power to the CP board and the logic chip packages
`The preferred embodiment of the present invention
`contained thereon. The preferred CMM boards include
`relates to the high density packaging of processors and
`sixteen locations (eight on each major side) for intercon
`memory in a multiprocessor system in which a plurality
`nection with the orthogonal interconnect modules,
`of CP circuit boards are connected to a plurality of
`which are connected to the CP boards.
`CMM circuit boards using orthogonal interconnect
`BRIEF DESCRIPTION OF THE DRAWINGS
`modules (OIM) to form a completely connected system
`in which each CP board is connected all CMM boards.
`FIG. 1 is a perspective view of a CP board stack,
`The application of this technology is designed for speed
`surrounding CMM boards and power supply cabinet;
`improvements, improved heat dissipation, improved
`FIG. 2 is a perspective view of the stacked CP boards
`packaging density and shortened distances between the
`surrounded on two sides by orthogonally connected
`CP boards and the full array of CMM boards required
`CMM boards;
`for modern multiprocessing supercomputers of the type
`25
`FIG. 3 is a top view of the CP board stack sur
`manufactured by Cray Research, Inc., assignee of the
`rounded on two sides by the orthogonally connected
`present invention.
`CMM boards;
`By stacking the CP boards in a closely spaced rela
`FIG. 4 is a side view of the CP board stack and or
`tionship and arraying CMM boards along two sides of
`thogonally connected CMM boards;
`the CP board stack in planes perpendicular to the planes
`30
`FIG. 5 is a perspective view of the array of orthogo
`occupied by the CP boards, each CP board can be con
`nal interconnect modules shown as connected to one of
`nected to each CMM board, thereby allowing each CP
`the CMM boards units;
`board access to all CMM boards as required to speed
`FIG. 6 is an assembly view of one column of orthogo
`the processing of the system. Previous attempts to com
`nal interconnect modules and associated T-beam and
`pletely connect such systems has met with limited suc
`35
`heater power supply structure;
`cess as either the number of connections between the
`FIG. 7 is an exploded assembly view of an orthogonal
`CP and CMM boards has been limited or the connec
`interconnect module without flex cables;
`tion lengths have been prohibitively long, thereby slow
`FIG. 8 is a perspective view of four orthogonal inter
`ing the computing speed of the unit.
`connect modules in the process of attachment to com
`By using the board stacking arrangements, orthogo
`mon memory module boards and central processing
`nal interconnect modules (OIM), and densely packed
`boards;
`memory boards disclosed in this application, the prob
`FIG. 9 is a cross-section of one end of an orthogonal
`lens associated with completely connected systems
`interconnect module;
`have been avoided. A more detailed description of the
`FIG. 10 is a cross-section of the rear central process
`entire system follows below.
`45
`ing board alignment showing the lock-out mechanism in
`the locked out position;
`SYSTEM PACKAGING
`FIG. 11 is a top view of the flexible circuit used in the
`As shown in FIGS. 1-4, the CP board stack 11 is
`orthogonal interconnect module of FIGS. 7 & 8;
`surrounded on two sides by CMM board stacks 13
`FIG. 12 is a top view of the interconnect pattern on
`which are aligned in planes perpendicular to the planes
`50
`each end of the flexible circuit of FIG. 11;
`of the CP board stack 11. In the preferred embodiment,
`FIG. 13 is a top view of the CP board showing the
`the CP board stack 11 contains eight CP boards 12 and
`alignment rails, interconnection pads, power pads, and
`each CMM board stack 13 contains four memory
`integrated circuit chip assemblies;
`boards 14 and space for one additional board 16 (see
`FIG. 14 is a side view of a CP board facing an edge
`FIG. 3) which can supply a number of required func
`55
`not connected to an orthogonal interconnect module;
`tions such as interprocessor communications, Input
`FIG. 15 is an enlarged view a portion of an orthogo
`/Output (I/0) translators, clock distribution and other
`nal interconnect pad on either a CP or CMM board;
`required system components.
`FIG. 16 is a top view of a CMM board;
`The CP and CMM board stacks 11,13 are preferably
`FIG. 17 is a partial end view of two CMM boards
`immersed in a cooling fluid (not shown) such as
`showing the memory stacks and associated memory
`FLUORINERT (R) or a comparable cooling fluid for
`stack connectors;
`electrical components. The fluid is preferably circulated
`FIG. 18 is a close up view of a memory stack showing
`such that it comes up through the area below the boards
`the memory chip edge boards, and memory stack con
`into a manifold 6 which directs it through the CP board
`nectors;
`stack 11 from the rear to the front and also in an upward
`65
`FIG. 19 is a side view of a memory stack edge board
`direction through the CMM board stacks 13. The fluid
`including the plated holes in the edge board as well as
`used to cool the boards then flows out the top of the
`the trace pattern used for interconnection of the edge
`inner wall 7 of the board stack container 4 and is re
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`ations of which will be recognized by those skilled in
`turned down between the inner 7 and outer walls 8 of
`the board stack container 4 and to the base 2 where it
`the art.
`Each opening 40 on the ends of the preferred embodi
`cools the power supplies (not shown) for the system.
`Once through the power supplies, the fluid is returned
`ment OIM 20 contains the means required to grasp
`either a CP 12 or CMM board 14. In the preferred
`to a reservoir and associated chiller (not shown). An
`embodiment, the springs 42,48; contact pressure pads
`example of such a cooling system is described in U.S.
`50; and OIM flex cable contact bumps 66 (see FIGS. 11
`Pat. No. 4,590,538 to Cray, Jr. issued May 20, 1986,
`& 12) cooperate to result in a normal force of a mini
`titled "Immersion Cooled High Density Electronic
`Assembly', assigned to the assignee of the present in
`mum of 60 grams between each flex cable contact bump
`vention and which is hereby incorporated by reference.
`66 and associated connection pad on either the CP 12 or
`CMM board 14. When open, the distance between the
`ORTHOGONAL INTERCONNECT MODULE
`opposing flex cable contact bumps 66 of the preferred
`ARRAY
`OM 20 is a minimum of 0.02' wider than the maximum
`An overall system view of the preferred embodiment
`assembled CP 12 or CMM board 14 thickness. As the
`of the orthogonal interconnect module (OIM) array is
`basic construction of either end of the OIM20 is similar,
`only one of the ends will be described in detail below.
`shown in FIG. 5 where each of the eight CMM boards
`14 (four per side) are connected to each of the eight
`The cross section of FIG. 9 shows heater leads 47
`located in a channel 49 formed within the module body
`stacked CP boards 12 by an OIM 20.
`Each column of OIM's 20 is located on a T-shaped
`opposite the cross-section line. The heater leads 47
`connect the heaters 46 located in the opening with an
`channel 22 which is used to precisely locate each OIM
`20
`20 and prevent it from moving in the system. In the
`electrical power source (not shown). In the preferred
`preferred embodiment, the OIM's 20 are located on
`embodiment of the OIM 20, each opening 40 contains
`centers approximately 1.2' apart along the T-shaped
`two heaters 46 although only one heater is used in nor
`mal operation, with the second heater operating as a
`channel 22.
`backup to protect against failure of the first heating
`In addition to the T-shaped channel 22, each OIM
`25
`element. The preferred heaters 46 are of a resistance
`column is also attached to an electronic heater connec
`type operating on principles well-known to those in the
`tion strip 24 as shown in FIG. 6. This strip 24 connects
`industry and, therefore, will not be described further.
`each orthogonal interconnect module's heaters 46 (see
`The actuation cycle required to activate the memory
`FIG. 6) to power supplies (not shown) to allow the
`metal spring 48 to open the OIM 20 is 2.5 amps for 15
`OIM's 20 to be opened as required. As will be under
`30
`stood by referring to the array of FIG. 5, groups of
`seconds in an ambient temperature of 25 degrees Centi
`grade. The preferred heater 46 requires 10 watts per
`OIM's 20 can be opened in either vertical columns to
`inch of length and reaches a temperature of 95 degrees
`remove a CMM board 14 or in horizontal rows to re
`Centigrade.
`move a CP board 12. Power is distributed to the heating
`In the preferred embodiment, a connector spring 42 is
`elements 46 of the OIM's 20 by a power board 18 lo
`35
`nested in the circular opening of the module 20. The
`cated on top of the CP board stack 11.
`connector spring 42 is preferably formed primarily of a
`ORTHOGONAL INTERCONNECT MODULE
`beryllium copper alloy which is chosen for its spring
`Referring to FIGS. 7-9, the preferred embodiment of
`characteristics. Two ends of the connector spring have
`the orthogonal interconnect module (OIM) 20 consists
`a rounded edge bar 44 soldered or otherwise attached to
`40
`of a connector body with openings 40 disposed on ei
`the connector spring 42. The rounded edge bars 44 are
`ther end but lying in orthogonal planes. The preferred
`formed of brass in the preferred embodiment.
`OIM has a cross-section approximately 1.1" square with
`In the preferred embodiment, the contact pressure
`an overall length of approximately 2.4". The contact
`pads 50 have grooves 45 in which the rounded edge
`pressure pads 50 on both ends of the preferred OIM are
`bars 44 of the connector spring 42 ride. Each contact
`pressure pad 50 is preferably formed of stainless steel
`located approximately 2.05" apart, center to center.
`and the groove 45 is preferably finished to prevent the
`In the preferred embodiment, the body of the OIM is
`bars 44 from binding in the groove 45. In the preferred
`formed of a cap 32 and head piece 30, both preferably of
`non-glass filled polyetheretherketone (PEEK), which
`embodiment, the grooves are peened to prevent bind
`are formed to nest together. In an alternate preferred
`ing. Also as shown in FIG. 9, the grooves 45 are also
`SO
`chamfered 57 to provide uniform pressure across the
`embodiment, the cap 32 and head piece 30 could be
`formed of a liquid crystal polymer (LCP). A T-shaped
`contact pressure pad 50 face 52. The chamfers 57 are
`slot 33 to receive the T-shaped channel 22 is formed at
`preferably formed at a 45° angle to the face 52. In the
`the junction of the cap 30 and head piece 32. That slot
`preferred embodiment, the faces 52 of the contact pres
`sure pads 50 are polished to a grade 16 finish to provide
`33 allows the modules 20 to be located on the T-shaped
`rails 22 within the computer assembly 10.
`substantially uniform pressure over their faces 52.
`The head piece 30 preferably contains two bores 38
`Nested within the connector spring 42 of the pre
`ferred embodiment are heaters 46 and a memory metal
`formed in it, each of which contain a coil spring 36 and
`spring 48 used to force the connector spring 42 open,
`ball bearing 34. When the cap 32 and head piece 30 are
`thereby moving the contact pressure pads 50 apart.
`assembled, the balls 34 and springs 36 are kept within
`the head piece 30 by the cap 32, with the balls 34 par
`When heated by the heaters 46, the memory metal
`spring 48 attempts to straighten or flatten itself out
`tially protruding into the T-shaped slot 33. The balls 34
`which tends to open the connector spring 42.
`are sized to cooperate with bores 23 formed in the T
`shaped channel 22 to accurately locate the modules 20
`The memory metal spring 48 used in the OIM's 20 of
`along the channel 22 at predetermined locations defined
`the preferred embodiment is given a flattened shape in
`the austenitic phase above the forming temperature.
`by the bores 23. Alternately, the connector body could
`be formed of a single piece of metal or other material
`The memory metal spring 48 is formed into a curled
`shape while in the martensitic phase and is maintained in
`and located by means other than balls and springs, vari
`
`45
`
`55
`
`65
`
`IS000317
`
`Immersion Systems LLC – Ex. 1007
`PGR 2021-00104 (U.S. 10,820,446 B2)
`24 of 33
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`5,167,511
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`that a number of other variations could be used to open
`the martensitic phase below the austenitic transforma
`and close the contact pressure pads 50, including me
`tion temperature when the OIM20 is closed on a circuit
`board. In use, the memory metal spring 48 is curled and
`chanical or electromechanical means.
`reforms to its flattened shape when heated to its austen
`OIM FLEX CABLE
`itic phase. After use, as the spring 48 cools into its mar
`To make the electrical connections between the
`tensitic region, it curls into its desired semi-circular
`boards connected by the OIM 20, its preferred embodi
`shape. The flattened shape can again be recovered
`ment includes two flex cables 60 as shown in FIG. 8.
`when the memory metal of the spring 48 is heated into
`The flex cables 60 are adapted to be routed along oppo
`its austenitic region.
`site sides of the connector 20. The OIM flex cable 60 as
`When the OIM 20 of the preferred embodiment is to
`shown in FIGS. 11 & 12 is provided with registration
`be opened to remove a circuit board, the heaters 46
`marks 61 in order to align the contact bumps 66 of the
`located next to the memory metal spring 48 are acti
`OEM flex cable 60 on the contact pressure pad faces 52
`vated to warm the spring above the transition tempera
`so that accurate connections can be made with the cor
`ture so that the alloy of the spring 48 enters the austen
`responding connection pads located on either the CP 12
`itic phase. In the austenitic phase, the memory metal
`spring 48 attempts to reestablish its flattened shape
`or CMM boards 14. After the cable 60 is attached to the
`contact pressure pad faces 52, the registration marks are
`which opens the connector spring 42, moving the
`trimmed away along with any additional excess material
`contact pressure pads 50 of the OIM20 away from each
`other, thereby allowing a circuit board to be removed
`from the flex cables 60.
`without damage.
`When in location, the flex cable interconnect areas 64
`20
`are located on the faces 52 of the OIM contact pressure
`After a circuit board is replaced, the heater 46 is
`pads 50. In the preferred embodiment, the flex cables 60
`turned off, allowing the memory metal spring 48 to cool
`are attached to the faces 52 of the contact pressure pads
`back to its martensitic phase. While cooling, the men
`50 with an epoxy-based adhesive (not shown). The
`ory metal spring 48 returns to its curled shape which
`flexibility of the cable 60 allows the contact pressure
`allows the connector spring 42 to move the contact
`25
`pads 50 to be opened and closed as required without
`pressure pads 50 and associated OIM flex cable contacts
`adversely affecting the electrical integrity of the cable
`66 together and into connection with associated
`contacts on a circuit board.
`60.
`The OIM flex cable 60 of the preferred embodiment
`To those skilled in the art, the unusual behavior of the
`memory metal spring 48 is called the shape-memory
`is shown in FIG. 11 before attachment to the OIM 20.
`30
`The flex cable 60 is preferably approximately 1.1' wide
`effect. Shape-memory behavior is connected with ther
`and approximately 3.3' long (as measured in a straight
`moelastic austenitic transformation. The preferred em
`bodiment of the present invention uses the shape mem
`line from end to end). The trace lines 62 of the flex cable
`60 follow the substantially rounded curves of the flex
`ory effect of the memory metal alloys. The use of men
`cable 60 to prevent any unwanted electrical problems
`ory metal in electronic connectors is also disclosed in
`35
`due to sharp bends in the flex cable 60. The minimum
`U.S. Pat. No. 4,621,882 to Krumme, issued on Nov. 11,
`trace length from one end of the preferred flex cable 60
`1989, which is incorporated herein by reference.
`to the other end is preferably approximately 3.65 inches
`The memory metal used for the spring 48 in the pre
`with the maximum trace length being approximately
`ferred embodiment of the present invention is a nickel
`titanium alloy which is sometimes referred to as Nitinol.
`3.99 inches.
`Although in the preferred embodiment of the present
`The OIM flex cable 60 preferably contains 260 trace
`lines across its top surface and has a bottom surface
`invention, Nitinol alloys are described as the best mode
`opposite the top trace layers which is essentially a con
`of practicing the invention, those skilled in the art will
`also readily recognize that a wide variety of shape mem
`tinuous ground layer (not shown). The traces 62 are
`formed by standard photolithography methods, using
`ory metals having super-elastic qualities could be substi
`45
`