RU 2500013 C1
`
`RUSSIAN FEDERATION
`
`
`
`[Coat of Arms of the
`Russian Federation]
`
`FEDERAL SERVICE
`FOR INTELLECTUAL PROPERTY
`
`(12) ABSTRACT OF INVENTION
`
`(19) RU (11) 2 500 013 (13) C1
`
`(51) IPC
`G06F 1/20 (2006.01)
`
`(72) Inventor(s):
`Gryzhin Mikhail Vladimirovich (RU)
`
`
`
`(73) Patent Holder(s):
`Limited Liability Company
`“EKOFLOPS” (RU)
`
`
`
`
`(21)(22) Application: 2012110138/08, 19/03/2012
`
`(24) Patent effective date:
`19/03/2012
`
`
`Priority(ies):
`(22) Application filing date: 19/03/2012
`
`(45) Date of publication: 27/11/2013 Bul. No. 33
`
`(56) List of the documents referenced in the Search
`Report: US 2010/0246118 А1, 30/09/2010. US
`6,371,157 B1, 16/04/2002. US 2011/0075353 A1,
`31/03/2011. RU 2 297 661 C2, 20/04/2007. RU 2
`284 051 C2, 20/09/2006. RU 2 289 841 C1,
`20/12/2006.
`
`
`Mail address:
`140181, Moscow Region, Zhukovsky,
`P.O. Box 341, S. A. Platonov
`
`
`(54) LIQUID-COOLING SYSTEM FOR ELECTRONIC DEVICES
`
`(57) Abstract:
`The invention relates to cooling systems and, in
`particular, to liquid-cooling systems for electronic
`devices. The technical result is to increase the
`efficiency of the technological process for the
`maintenance of complex electronic devices. In a
`liquid-cooling system for cooling several electronic
`devices, each container additionally contains a
`device for fast removal (discharging) of liquid
`coolant from the container, while the device for fast
`removal of coolant contains at least a drainage hole
`which is sealed during normal operation of the device
`
`and open at the initial phase of removing the
`container with the electronic device from the support,
`and the drainage hole of the device for fast removal
`of coolant is made on the container and provided with
`a seal, and the drain cover is rigidly attached to the
`support such that when mounting the electronic
`device with the container on the support, the drainage
`hole on the container is sealed. 3 dependent claims,
`13 figures.
`
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`RU 2500013 C1
`
`Immersion Systems LLC – Ex. 1011
`PGR 2021-00104 (U.S. 10,820,446 B2)
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`FIG. 3
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`RUSSIAN FEDERATION
`
`
`
`[Coat of Arms of the
`Russian Federation]
`
`FEDERAL SERVICE
`FOR INTELLECTUAL PROPERTY
`
`(12) ABSTRACT OF INVENTION
`
`(19) RU (11) 2 500 013 (13) C1
`
`(51) Int. Cl.
`G06F 1/20 (2006.01)
`
`
`(21)(22) Application: 2012110138/08, 19/03/2012
`
`(24) Effective date for property rights:
`19/03/2012
`
`
`Priority:
`(22) Date of filing: 19/03/2012
`
`(45) Date of publication: 27/11/2013 Bull. 33
`
`Mail address:
`140181, Moskovskaja obl., g. Zhukovskij, a/ja
`341, S.A. Platonovu
`
`(72) Inventor(s):
`Gryzhin Mikhail Vladimirovich (RU)
`
`
`
`(73) Proprietor(s):
`Obshchestvo s ogranichennoj otvetstvennost'ju
`"EhKOFLOPS" (RU)
`
`
`
`RU 2500013 C1
`
`B
`
`
`
`
`
`
`(54) LIQUID-COOLING SYSTEM FOR ELECTRONIC DEVICES
`
`(57) Abstract:
`FIELD: information technology.
`SUBSTANCE: in a liquid-cooling system for
`cooling multiple electronic devices, each container
`further
`includes a device
`for
`fast
`removal
`(discharging) of liquid coolant from the container,
`wherein the device for fast removal of liquid coolant
`has at least a drainage hole which is sealed during
`normal operation of the device and open at the initial
`phase of removing the container with the electronic
`device from the support, and said drainage hole is
`made on the container and is provided with a seal,
`and the cover of the drainage hole is rigidly attached
`to the support such that when mounting the electronic
`device with the container on the support, the drainage
`hole on the container is sealed.
`EFFECT: high efficiency of maintaining complex
`electronic devices.
`4 cl, 14 dwg
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`The claimed technical solution relates to cooling systems and, in particular, to liquid-cooling
`systems for cooling electronic devices.
`It is known that during operation, computer equipment generates a significant amount of heat.
`Overheated electronic components age more rapidly. The higher the temperature of a working
`electronic component, the higher the likelihood of its failure. Therefore, the probability of failure of the
`entire electronic unit that controls the data, due to the failure of one of its constituent electronic
`components, increases. With the current trend of increasing the computing performance of equipment,
`the level of heat generation of computing components is increasing. An increase in the performance
`and power consumption of processors entails an increase in the power of the equipment power
`supplies, which leads to an increase in their heat release.
`Devices for cooling electronic functional units of computing systems are known from the prior art.
`As a rule, they are a system of electronic units installed in a support (cabinet), each or a group of which
`is enclosed in a sealed container equipped with a system for supplying and removing liquid coolant, a
`heat exchanger for cooling the liquid, and a supercharger.
`From the prior art, cooling systems using liquids are known. These are closed systems in which the
`cooled liquid is piped to a hot plate (radiator) in contact with the central processor or another
`component, and then the liquid is diverted to the heat exchanger so that it circulates in a closed loop.
`There are also immersion liquid systems in which the server units are immersed in containers with
`dielectric fluid, which is piped to heat exchangers, where it is cooled and then sent back.
`A system for cooling equipment by immersion in a liquid means placing electronic components
`heated in the process of operation in individual sealed containers. One container may contain
`- one or more computing units (a motherboard with one or more multi-core processors, memory
`modules and, if necessary, other expansion devices, such as graphics accelerators),
`- one or several graphics accelerators,
`- one or more RAID controllers,
`- expansion modules of the system RAM,
`- media (usually hard drives or solid state drives),
`- one or more power supplies,
`- switchboards, switches, wired, optical and wireless transmission devices, devices with cellular
`processors, measurement systems, including manual systems, etc.
`The liquid cooling process can be implemented in several methods:
`M. 1 – the liquid coolant is fed through the pipe to strongly heated elements with further forced
`draining of the liquid into the drainage system and at the same time the container is filled with coolant,
`thus cooling the rest of the elements (Fig. 6, 7);
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`M. 2 – the liquid coolant is fed through the pipe to strongly heated elements with the further
`discharge of liquid into the container space and at the same time filling the container with coolant and,
`thus, cooling the remaining elements (Fig. 8);
`M. 3 – the liquid coolant is supplied through a pipe to strongly heating elements with the further
`forced discharge of liquid into the drainage system (Fig. 9);
`M. 4 – the container is filled with liquid coolant, which cools all the elements (Fig. 10).
`Several devices are known for cooling electronic modules assembled on a support. The closest in
`design is the device according to US patent No. 7911793 dated 22/03/2011, in which for each
`electronic unit that needs to be cooled, there is a sealed container equipped with inlet and outlet quick
`disconnect fittings. A pipe is laid from the inlet pipe, supplying coolant initially directly to the most
`heat-stressed elements. After passing through the most heat-generating elements, the liquid enters the
`internal cavity of the container. The liquid fills the container also through a separate tube – cold liquid
`also enters the space of the unit, fills it, cooling the remaining elements, and leaves the container
`through the outlet union located at the upper point.
`This device is selected as a prototype.
`The most significant drawback of this and other known devices is insufficient suitability for
`discharging the coolant from the sealed container when removing the electronic unit from the support.
`When using known solutions, upon removing the electronic unit, the liquid remains in the container.
`For complete discharge of the liquid, it is necessary, after removal, to transfer the container to a
`separate container and pour out the coolant there. It results in the additional inconvenience of
`operation, unreasonable loss of working time, the need to create a separate station for draining the
`liquid.
`The technical result of the claimed invention is the improvement of the technological process of
`servicing complex electronic devices requiring liquid cooling by immersion in a coolant, reduction of
`labour costs when replacing electronic components, acceleration of the discharge of coolant,
`improvement of the “purity” of the production process, including in terms of reducing spillage, spatter,
`etc. of the coolant, which may be unhealthy for people on contact.
`Known technical solutions do not allow to achieve the claimed technical result.
`To achieve the claimed technical result, a device is proposed of the electronic module shown in Fig.
`1 and Fig. 2, the heat-generating components of which are cooled by immersion method, enclosed in a
`sealed container equipped with a quick disconnect inlet fitting, disconnected at the initial stage of
`removing the unit from the support, and a hole or pipes for draining the coolant. The container is
`additionally equipped with a sealed hole located at the lower point of the container. The size of the hole
`allows for fast drainage of all the coolant, and the location of the hole allows to completely drain the
`liquid directly into the collection tank at the initial stage of container removal from the support.
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`BRIEF DESCRIPTION OF THE DRAWINGS
`Fig. 1. General layout of a universal support with containers.
`Fig. 2. General layout of a universal support with containers (rear view).
`Fig. 3. The proposed functional scheme of circulation (A) and drainage (B) of the coolant in the
`container using the example of the system (M. 4).
`Fig. 4. Image of the supply unit and the proposed coolant drainage unit.
`Fig. 5. Universal support without containers.
`Fig. 6. Coolant distribution diagram using the example of an open computer module (M. 1).
`Fig. 7. Schematic diagram of a cooling device in case of placement (M. 1).
`Fig. 8. Functional diagram of a point-immersion cooling system for equipment (M. 2).
`Fig. 9. Functional diagram of a point cooling system for equipment (M. 3).
`Fig. 10. Functional diagram of an immersion cooling system for equipment (M. 4).
`Fig. 11. Interconnection diagram of the power supply housing and universal support.
`Fig. 12. Coolant drain assembly for the power supply and universal support.
`Fig. 13. Block diagram of a closed circuit cooling system.
`AGREED SYMBOLS
`11 – chassis body,
`12 – cooled containers of standard width,
`13 – containers of a different (non-standard) width,
`14 – compartment for horizontal placement of the main power supplies of the entire chassis,
`15 – fitting of the inlet pipe of the support,
`16 – inlet manifold (collecting tank),
`17 – supply pipe located on the support,
`20 – busbar for electronic units,
`27 – connector block,
`28 – plate,
`29 – pressure pipe fitting located on the container,
`34 – pressure fitting located on the support,
`35 – drain channel during operation,
`36 – drain channel during maintenance,
`37 – back wall of the container (partition),
`39 – base of the drain hole cover,
`40 – drain plug,
`41 – drain hole in the container when it is taken out for quick removal of the coolant,
`42 – pressure pipe,
`43 – drain pipe,
`44 – cooled device,
`54 – outlet pipe fitting of the support,
`55 – power supply electrical connectors,
`56 – heat exchanger,
`57 – container for collecting heated liquid.
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`DETAILED DESCRIPTION OF THE INVENTION
`The cooling system of a heat source by immersing it in a liquid coolant is suitable for various
`electronic devices, including computer servers and their complexes, which use electronic components
`that intensively generate heat. In the case of cooling systems of server hardware, the cooling system by
`immersion in a liquid differs in a scalable architecture. All cooled electronic components are enclosed
`in sealed containers installed in the chassis and can be combined into a single array used for parallel
`computing. The number of chassis combined into a single computing array is unlimited.
`The required number of chassis, with the containers installed, is filled with dielectric coolant, which
`does not interfere with the normal operation of the electronics, removes heat and has fire-suppressing
`properties. Thus, the equipment is simultaneously protected from fire in case of failure of the
`electronics. This allows to use simpler and cheaper automatic fire extinguishing systems in data
`centres. The coolant is silicone oil of the following types: Syltherm 800, Duratherm S, Sofexil TSZh-v.
`This list can be expanded with liquids based on mineral oils, as well as natural or synthetic oils based
`on compound ethers, and include any other liquids with dielectric properties, high boiling points, as
`well as the required heat capacity and thermal conductivity.
`Fig. 1 shows a chassis with cooled containers of different types, the body 11 with containers 12 and
`containers of type 13 for electronics. It is possible to install up to 11 (sometimes more) containers of
`standard width 12 or 22 containers of type 13 in one chassis. Depending on the geometrical dimensions
`and configuration of the liquid-cooled equipment, the width of the container 12 can be increased with a
`decrease of their total number in the chassis. The following equipment can be placed inside the
`containers:
`- computer modules – server boards with RAM and processors;
`- graphic computing devices;
`- media – classic and solid state hard drives;
`- network equipment – switches, routers;
`- other equipment for processing and transmission of information heated up during operation.
`The compartment 14 is intended for horizontal placement of power supplies for the entire chassis
`and is located at the bottom of it and the manifold 16. Containers with equipment 12, 13 and blocks
`located in the compartment 14 are filled with dielectric coolant, which is in direct contact with all
`components located inside them. The liquid cools them while contacting the heat-generating elements.
`Fig. 2 shows a rear view of the chassis. There is a fitting for connecting the cooled liquid pipe 15
`and the fitting for connecting to the heated liquid outlet pipe 54. The inlet fitting for cooled liquid 15 is
`equipped with a quick disconnect valve and a pressure control sensor. The diameter of the fitting 54 is
`selected so that the volume of liquid fed through the inlet fitting 15 into all containers 12, 13 and 14
`does not accumulate in the manifold 16 of the chassis 11. The external supply voltage is supplied to the
`chassis via connectors 55.
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`Fig. 3 and 4 show the principle of operation of the device – routes of feeding, pouring, and draining
`of liquid in the container of the liquid-cooling system by immersion. Two positions of the container
`“A” – operation and “B” – maintenance – liquid discharge are considered.
`The common pipe 17 for feeding cooled liquid with quick disconnect valves 34. The container 12 is
`equipped with a cooling system inlet fitting with a quick disconnect valve 29.
`The walls of the container 12 with the computer module are a partition between the container – the
`working area, in which all the electronics are located in contact with the coolant, and the drain channel
`35 and 36, through which the heated liquid from the working area flows into the “hot” liquid manifold
`16 located in the lower rear part of the chassis.
`When the server unit is in operating position “A”, a plug 40, rigidly fixed to the base 39, closes the
`drain hole 36 of the unit. In this position, the coolant enters the container from the fitting 29 and,
`depending on the implementation of the selected method of liquid cooling, spreads inside the working
`area. Because the working area is sealed from below, it gradually fills up to the upper edge of the
`partition 37 and begins to overflow into the drain channel 35 of the container, and from there into the
`common “hot” liquid collector 16.
`When removing the container 12 from the chassis, after its disconnection and disconnecting the
`external switching and electrical connectors from the module, it is required to first pull out the
`container slightly so that the drain hole 41 in the working part of the container opens (when the
`container is pulled out, the plug 40 remains immovable in the support) and it goes into position “B”, in
`which the liquid is rapidly discharged from it through the channel 36 into the collector 16. The
`container, emptied of the coolant, is ready to be completely removed from the chassis.
`Fig. 5 shows the cooling system chassis. All containers 12 are removed from the body 11. A
`common power bus 20 runs at the top of the chassis. Coolant is fed to the containers in pipe 17.
`Through the fittings 34, equipped with a quick disconnect drip-free valve, the liquid is fed to the
`containers 12.
`Fig. 6 shows an example of a container for a computer module with the cover removed and its
`switch connectors. The computer module is connected by output connectors to the connector block 27,
`which is part of the body 12 and ensures its tightness at the back. The installation of the container 14 is
`carried out by inserting it all the way into the free seat in the lower horizontal part of the universal
`support 11. At that, the connector block of the container 27 is connected to the connector block of the
`chassis, through which the computer module receives voltage from the external circuit. The coolant is
`fed into the container 14 through the pipe 21. The pipe 21, equipped with a quick disconnect fitting, is
`connected to the counterpart of the quick disconnect connector 34 located in the chassis 11, into which
`the liquid is supplied from the common pipe 17. The liquid, coming through the pipe 21, fills the
`container 14 with the cooled liquid. During operation, the computer module emits heat into the liquid,
`and the warm layers of the liquid mix with the less heated ones. The container becomes almost
`completely filled with liquid. When the level of the upper edge of the drain device is reached, the
`liquid flows down to the inclined surface into the inlet pipe 35 and enters the manifold 16.
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`Fig. 7 shows the device of the container 12 for cooling various types of heat-generating devices
`according to method M. 1, in this case, a server computer module. The figure shows the motherboard
`28 with the processors 44 installed. Depending on the purpose, the container 12 may contain other
`components, such as: media – hard drives (solid state and conventional), switching equipment –
`routers, switches, etc. Through the fitting 29, the liquid flows through the pipes 42 inside the container
`to the processors, the pipes 43 remove the heated liquid from each processor.
`Fig. 8 shows the container device 12 for cooling various types of heat-generating devices according
`to method M. 2.
`Fig. 9 shows the container device 12 for cooling various types of heat-generating devices according
`to method M. 3.
`Fig. 10 shows the container device 12 for cooling various types of heat-generating devices
`according to method M. 4.
`Fig. 11 shows containers 14 for power supplies and their switch connectors. The power supply is
`placed in the case of the container 11 and connected with the output connectors to the electrical
`connector block. Then the case is closed with a top lid, and it becomes airtight. The installation of the
`container 14 is carried out by inserting it all the way into the free seat in the lower horizontal part of the
`universal support 11.
`Fig. 11 shows the internal structure of the container for the power supply 14. The electronics
`located inside is one of the power supplies of the system. The installation of the container 14 is carried
`out by inserting it all the way into the free seat in the lower horizontal part of the universal support 11.
`In this case, the electrical connector block of the container becomes connected to the electrical
`connector block of the chassis, through which the power supply receives voltage from the external 220
`V circuit, and through the same connector block, a reduced operating constant voltage of 12 V is
`supplied to the chassis power bus 08. Coolant is fed into the container 14 through the pipe 42. This
`pipe, equipped with the quick disconnect connector 29, is connected to the counterpart of the quick
`disconnect connector 34 located in the support 11, into which fluid is supplied from the common pipe
`17. The liquid, flowing over the edge (or, possibly, holes will be made along the entire length of the
`tube) of the pipe 42, fills the container 14 from the lower corner with the cooled liquid. During
`operation, the power supply emits heat into the liquid, and the warm layers of the liquid rise above the
`less heated ones. The body becomes almost completely filled with liquid. The liquid level is
`determined by the flat clearance of the drain device 35. In working condition, the drain device 35 goes
`with its drain channel into the manifold for the heated liquid 16. When the liquid reaches the level of
`the upper edge of the drain device 35, the subsequent liquid entering from the bottom displaces the
`upper layers, which flow into the manifold 16.
`Fig. 12 shows an additional perspective of the process of installing containers 14 in the universal
`support 11. The shutter of the outlet drain hole is spring-loaded and when the container 14 is removed,
`it is in the normal closed position. When the container 14 is installed, the protruding part of the drain
`device 35 enters the corresponding opening and raises the shutter.
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`Fig. 13 shows a block diagram of a complete cooling system using the example of one support 11
`with equipment. The system consists of three main components: heat exchanger 56, cooled equipment
`and the container for collecting heated liquid 57. The heat exchanger 56 can be made, for example, on
`the basis of a radiator with electric fans. The presence and number of radiators in the system are
`determined by the requirement of the temperature conditions for the operation of the entire system and
`the required amount of heat removed. This unit can remain in an air-conditioned room if the support is
`small and does not generate much heat, or it can be moved outside the room, such as outdoors. Possible
`embodiments are not limited to the listed options. The cooled equipment unit is the support 11 filled in
`accordance with the computational problem to be solved. Obviously, the system is scalable and the
`number of such blocks can be unlimited. The block 57 is, as a rule, a container for collecting heated
`liquid flowing down from refrigerated containers, conventionally shown in the form of a tank. Also,
`the block 57 contains filter elements and a pump that supplies coolant to the heat exchanger 56. All
`these blocks are interconnected by pipes. The principle of operation of the device is as follows. To
`quickly and conveniently remove the coolant from the container 12 at its lowest point (usually closer to
`the drain container), the quick-opening hole 41 is made, which is hermetically closed by the lid 40
`when the electronic unit is fully inserted into the support and is fully opened when the electronic unit
`starts to move along the rails from support. When removing the electronic unit at the same time or
`immediately after disconnecting the electrical connector(s) and the quick disconnect fittings for the
`coolant feeding and discharging, the hole 41 located at the lowest point of the sealed container opens.
`When removing the container with the electronic unit immediately after disconnecting from the
`electrical connectors and from the supply and outlet cooling lines, upon opening the drain hole, the
`movement of the container is suspended, waiting for the complete drainage of the liquid. Then the
`movement is continued until the empty container is completely removed. At the same time, the nozzle
`of the cooling supply pipe 34 is closed by a valve that closes the pipe when the device is not installed
`in the support cell. For greater ease of operation, it is possible to install a straight-through lock
`indicating and stopping the movement of the removed unit in a position in which full opening of the
`drain hole 41 is achieved.
`The device for quick removal of the coolant may further comprise a device for directing the flow of
`the drained liquid into a heat exchange device for organizing the flow of the drained liquid, for
`example, in the form of a tray.
`The drain hole of the device 41 for quick removal of the coolant can be made on the container and
`provided with a seal, and the drain hole lid 40 is rigidly fixed to the support on the base 39, so that
`when the electronic device with the container is installed in the support, the drain hole 41 on the
`container 12 is airtight.
`The claimed device is industrially applicable, since it can be made using the same means as the
`other elements of the described devices, on the same production base, and its production can be
`incorporated into the existing technological process.
`
`
`Claims
`1. A liquid-cooling system for cooling multiple electronic devices including (characterized by the
`following devices):
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` one or more containers adapted to contain the coolant inside;
`- several electronic devices, each of which consists of electronic components that generate heat
`during operation;
`- each of the specified electronic devices is enclosed in the specified container and placed parallel to
`each other in the support;
`- said electronic devices are immersed in a dielectric coolant, so that said dielectric coolant removes
`heat generated by said electronic components of each of said electronic devices;
`- each of said electronic devices contains its own cooling system for directing the flow of liquid,
`which includes at least the inlet and outlet pipes;
`- each of said cooling systems is configured to direct the flow of the cooling dielectric fluid to at
`least one electronic component;
`- a device for distributing the coolant connected to each of the said containers and designed to feed
`and discharge the coolant;
`- a device for heat exchange connected to each of the devices for distributing the cooling dielectric
`liquid, made with the possibility of at least partial removal of heat from said cooling dielectric liquid;
`- a device for pumping coolant from the heat exchange device to the coolant distribution devices,
`characterized in that
`- each said container additionally contains a device for quick removal (discharge) of the coolant
`from the container;
`- the device for quick removal of the coolant contains at least a drain hole, sealed during normal
`operation of the device and open in the initial phase of removing the container with the electronic
`device from the support;
`- the drain hole of the device for quick removal of the coolant made on the container and provided
`with a seal, and the drain hole lid is rigidly fixed to the support, so that when the electronic device with
`the container is installed in the support, the drain hole on the container is airtight.
`2. The system according to claim 1, characterized in that the device for quick removal of the coolant
`further comprises a device for directing the flow of the drained liquid into the device for heat exchange
`(for organizing the flow of the drained liquid).
`3. The system according to any one of claims 1, 2, characterized in that it is additionally equipped
`with a straight-through lock, stopping the movement of the block during removal in a position in which
`full opening of the drain hole is achieved.
`4. The system according to claim 1, characterized in that the device for distributing the coolant
`comprises a pipe for feeding the liquid with a valve that closes when the electronic device is removed
`with a container for stopping the supply of the coolant.
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`5
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`10
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`15
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`20
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`25
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`30
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`35
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`Immersion Systems LLC – Ex. 1011
`PGR 2021-00104 (U.S. 10,820,446 B2)
`12 of 18
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`Fig. 1
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`Fig. 2
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`Immersion Systems LLC – Ex. 1011
`PGR 2021-00104 (U.S. 10,820,446 B2)
`13 of 18
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`Fig. 4
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`Fig. 5
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`Immersion Systems LLC – Ex. 1011
`PGR 2021-00104 (U.S. 10,820,446 B2)
`14 of 18
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`Fig. 6
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`Fig. 7
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`Immersion Systems LLC – Ex. 1011
`PGR 2021-00104 (U.S. 10,820,446 B2)
`15 of 18
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`Fig. 8
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`Fig. 9
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`Immersion Systems LLC – Ex. 1011
`PGR 2021-00104 (U.S. 10,820,446 B2)
`16 of 18
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`Fig. 10
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`Fig. 11
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`Immersion Systems LLC – Ex. 1011
`PGR 2021-00104 (U.S. 10,820,446 B2)
`17 of 18
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`Fig. 12
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`Fig. 13
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`Immersion Systems LLC – Ex. 1011
`PGR 2021-00104 (U.S. 10,820,446 B2)
`18 of 18
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