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QCIA THERMALFABRIC

50061795 | Trademark

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Filed Aug. 20, 2026
Serial No. 50061795
Class Semiconductor substrates incorporating integrated thermal-management structures; semiconductor substrates supporting heat spreading, heat transport, thermal routing and heat dissipation; silicon and silicon carbide substrates incorporating thermally conductive structures; semiconductor package substrates supporting integrated thermal management and heterogeneous integration; semiconductor substrates incorporating thermal-interface structures, heat-distribution pathways, thermal-routing structures and heat-spreading structures; semiconductor substrates for AI, HPC, communications, aerospace, defense, and advanced semiconductor packaging applications.; 021; 023; 026; 036; 038
QCIA THERMALFABRIC
Case Type Trademark
Status New application awaiting assignment to an examining attorney. <a href="https://www.uspto.gov/dashboard/trademarks/application-timeline.html">See current trademark processing wait times </a> for more information.
Last Updated: 2 days, 5 hours ago
Filing Date # Docket Text