Filed Sept. 2, 2026

Serial No. 50085775

Class Research and development in the field of thermal management and nanocomposite materials, specifically concerning the heat dissipation, thermal resistance, and thermal conductivity properties of solid-state materials used in electronic component packaging and semiconductor devices; Research and development in the field of technical consultancy in the field of thermal engineering, namely, advising manufacturers of electronic components, semiconductor devices, and data center server hardware on heat dissipation design and thermal resistance optimization for physical hardware components; Research and development in the field of design and testing services in the field of thermal materials engineering, namely, evaluating, characterizing, and qualifying the thermal performance of nanocomposite material systems for use in electronic component packaging, semiconductor chip assemblies, and data center hardware infrastructure; Research and development in the field of scientific research in the field of materials science and nanotechnology, specifically concerning the development of nanocomposite materials with enhanced thermal conductivity for electronic and semiconductor engineering applications; Research and development in the field of engineering services, namely, customizing thermal interface materials, thermal pads, and thermal compounds for integration into specific electronic assemblies, semiconductor packages, and printed circuit board assemblies; Research and development in the field of none of the foregoing services being in the fields of information technology, software, telecommunications, or network systems; 100; 101

Case Type Service mark