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SHB2 NANO

79456107 | Trademark

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Filed June 11, 2026
Serial No. 79456107
Examining Attorney null
Class Bonding machine for semiconductor processing; machines for assembling semiconductor components; die bonder for semiconductor manufacturing; electronic chip assembly and packaging device for semiconductor manufacturing; flip-chip bonder for semiconductor manufacturing; hybrid bonder for semiconductor manufacturing; semiconductor processing machines; apparatus for manufacturing semiconductors; cluster tool integration platform for integrated circuit and semiconductor device manufacturing; cluster tool integration platform for manufacturing integrated circuits and semiconductor devices including a hybrid bonder; integrated tool for performing hybrid bonding chip packaging technology (semiconductor wafer processing equipment); integrated platform for cluster tools used in the manufacturing of integrated circuits and semiconductor devices for hybrid bonding chip packaging technology.; 013; 019; 021; 023; 024; 031; 034; 035
SHB2 NANO
Case Type Trademark
Status New application awaiting assignment to an examining attorney. <a href="https://www.uspto.gov/dashboard/trademarks/application-timeline.html">See current trademark processing wait times </a> for more information.
Last Updated: 4 days, 7 hours ago
Filing Date # Docket Text