Filed Feb. 10, 2026

Serial No. 99644876

Examining Attorney null

Class Semiconductor packaging platforms for integrating multiple semiconductor chips into a single package; Semiconductor packages, namely, semiconductor dies and interconnects; Multi-chip semiconductor packages; Semiconductor chips; Semiconductor wafers; Structured semiconductor wafers; Semiconductor substrates for semiconductor packaging; Semiconductor devices in the nature of substrates for semiconductor packaging, chips and circuit boards; Interposers for semiconductor packaging; Silicon bridges for semiconductor packaging; Semiconductor chip sets.; 021; 023; 026; 036; 038; 100; 103; 106; 100; 101

Case Type Trademark Service mark