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Click below for detailed party information:

Inventors

Kevin Harris Becker Harry Richard Kuder

Assignees

HENKEL KGAA HENKEL AG & CO. KGAA

Other Parties

INDOPCO, INC., Assignor NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION, Assignor HENKEL KGAA, Assignor

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Semiconductor assembly using dual-cure die attach adhesive

11/168,037 | U.S. Patent Application

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Filed June 27, 2005

Examiner Sanza L Mcclendon

Class 522

Art Group 1796

Case Type Utility

Status Abandoned -- Failure to Respond to an Office Action

Last Updated: 1 day, 6 hours ago

Date	#	Transaction
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Semiconductor assembly using dual-cure die attach adhesive

11/168,037 | U.S. Patent Application

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