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TESTING SYSTEM FOR LID-LESS INTEGRATED CIRCUIT PACKAGES

15/471,390 | U.S. Patent Application

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Filed March 28, 2017
Examiner Tung X Nguyen
Class 324
Art Group 2868
Patent No. 10,527,670
Case Type Utility
Status Patented Case
Last Updated: 3 days, 17 hours ago
Date # Transaction