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IN-MOLD INJECTION MOLDING PROCESS FOR PCBA SOFT MATERIAL

17/456,590 | U.S. Patent Application

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Filed Nov. 25, 2021
Examiner Thiem D Phan
Class 29
Art Group 3729
Patent No. 12,023,840
Case Type Utility
Status Patented Case
Last Updated: 2 days, 19 hours ago
Date # Transaction