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FLIP-CHIP BONDING STRUCTURE AND CIRCUIT BOARD THEREOF

18/134,082 | U.S. Patent Application citeCite Docket

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Filed April 13, 2023
Examiner Tuan T Dinh
Class 361
Art Group 2848
Patent No. 12,432,849
Case Type Utility
Status Patented Case
Last Updated: 2 weeks, 4 days ago
Date # Transaction
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