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SILICON-ON-SILICON WAFER BONDING PROCESS USING A THIN FILM BLISTER-SEPARATION METHOD

09/25,967 | U.S. Patent Application

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Location FILE REPOSITORY (FRANCONIA)
Filed Feb. 19, 1998
Examiner KIN CHAN CHEN
Class 438
Art Group 1765
Patent No. 6,159,824
Case Type Utility - 438/455000
Status Patented Case
Parent 60/46,276 Expired
Child 11/841,970 Patented
Child 12/218,149 Patented
Child 60-046276
Last Updated: 3 years, 5 months ago
Date # Transaction