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Click below for detailed party information:

Inventors

DOMINIQUE SAVIGNAC HELMUT SCHNEIDER

Assignee

INFINEON TECHNOLOGIES AG

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SIEMENS AKTIENGESELLSCHAFT, Assignor POLARIS INNOVATIONS LIMITED, Assignor INFINEON TECHNOLOGIES AG, Assignor QIMONDA AG, Assignor

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INTEGRATED SEMICONDUCTOR CHIP WITH MODULAR DUMMY STRUCTURES

09/363,263 | U.S. Patent Application

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Location FILE REPOSITORY (FRANCONIA)

Filed July 29, 1999

Examiner JASMINE JHIHAN B CLARK

Class 257

Art Group 2815

Patent No. 6,307,263

Case Type Utility - 257/734000

Status Patented Case

Child 198 34 234.9

Last Updated: 5 years, 1 month ago

Date	#	Transaction
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INTEGRATED SEMICONDUCTOR CHIP WITH MODULAR DUMMY STRUCTURES

09/363,263 | U.S. Patent Application

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