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Inventor

RAMASWAMY MAHADEVAN

Assignee

MEMSCAP S.A.

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CRONOS INTEGRATED MICROSYSTEMS, Assignor JDS UNIPHASE INC., Assignor JDS UNIPHASE CORPORATION, Assignor

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THERMALLY ACTUATED MICROELECTROMECHANICAL SYSTEMS INCLUDING THERMAL ISOLATION STRUCTURES

09/436,939 | U.S. Patent Application

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Location FILE REPOSITORY (FRANCONIA)

Filed Nov. 8, 1999

Examiner THOMAS M DOUGHERTY

Class 310

Art Group 2834

Patent No. 6,262,512

Case Type Utility - 310/307000

Status Patented Case

Last Updated: 4 years, 2 months ago

Date	#	Transaction
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THERMALLY ACTUATED MICROELECTROMECHANICAL SYSTEMS INCLUDING THERMAL ISOLATION STRUCTURES

09/436,939 | U.S. Patent Application

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