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Inventors

Craig Mitchell Mike Warner Jim Behlen

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ROYAL BANK OF CANADA, AS COLLATERAL AGENT

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TESSERA, INC., Assignor

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METHOD FOR MAKING A SEMICONDUCTOR CHIP PACKAGE

09/672,208 | U.S. Patent Application

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Location FILE REPOSITORY (FRANCONIA)

Filed Sept. 28, 2000

Examiner HOAI PHAM, V

Class 438

Art Group 2814

Patent No. 6,521,480

Case Type Utility - 438/106000

Status Patented Case

Parent 09/246,056 Patented

Parent 08/842,313 Patented

Parent 08/365,699 Patented

Parent 08/309,433 Abandoned

Last Updated: 4 years, 3 months ago

Date	#	Transaction
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METHOD FOR MAKING A SEMICONDUCTOR CHIP PACKAGE

09/672,208 | U.S. Patent Application

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