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Microelectronic element bonding with deformation of leads in rows

09/727,161 | U.S. Patent Application

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Location FILE REPOSITORY (FRANCONIA)
Filed Nov. 30, 2000
Examiner THAO P LE
Class 438
Art Group 2818
Case Type Utility - 438/110000
Status Abandoned -- Failure to Respond to an Office Action
Parent 09/330,859 Abandoned
Parent 09/57,125 Patented
Parent 08/440,665 Patented
Parent 08/271,768 Patented
Parent 60/1,782 Expired
Last Updated: 5 years, 7 months ago
Date # Transaction