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MICROELECTRONIC PACKAGES HAVING DEFORMED BONDED LEADS AND METHODS THEREFOR

09/766,814 | U.S. Patent Application

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Location ELECTRONIC
Filed Jan. 22, 2001
Examiner ANTHONY D TUGBANG
Class 029
Art Group 2896
Patent No. 6,848,173
Case Type Utility - 029/840000
Status Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362
Parent 09/520,320 Patented
Parent 08/988,097 Abandoned
Parent 60/32,870 Expired
Parent 09/271,688 Patented
Parent 60/32,870 Expired
Parent 09/138,858 Patented
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Last Updated: 5 years, 8 months ago
Date # Transaction