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PLANARIZED SEMICONDUCTOR INTERCONNECT TOPOGRAPHY AND METHOD FOR POLISHING A METAL LAYER TO FORM INTERCONNECT

09/779,123 | U.S. Patent Application

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Location ELECTRONIC
Filed Feb. 7, 2001
Examiner HSIEN MING LEE
Class 257
Art Group 2823
Patent No. 6,849,946
Case Type Utility - 257/752000
Status Patented Case
Parent 09/143,723 Patented
Last Updated: 2 years, 8 months ago
Date # Transaction