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Method for forming a conductive plug between conductive layers of an integrated circuit

09/599,378 | U.S. Patent Application

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Location FILE REPOSITORY (FRANCONIA)

Filed June 22, 2000

Examiner HSIEN MING LEE

Class 438

Art Group 2823

Patent No. 6,372,638

Case Type Utility - 438/640000

Status Patented Case

Parent 08/802,299 Patented

Last Updated: 4 years, 9 months ago

Date	#	Transaction
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Method for forming a conductive plug between conductive layers of an integrated circuit

09/599,378 | U.S. Patent Application

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