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MICROELECTRONIC PACKAGE HAVING A COMPLIANT LAYER WITH BUMPED PROTRUSIONS

10/107,094 | U.S. Patent Application

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Location ELECTRONIC
Filed March 26, 2002
Examiner JOSEPH H NGUYEN
Class 257
Art Group 2815
Patent No. 6,847,101
Case Type Utility - 257/781000
Status Patented Case
Parent 09/777,782 Patented
Parent 09/71,412 Patented
Parent 08/739,303 Patented
Parent 60/7,128 Expired
Child 10/219,902 Patented
Child 10/873,883 Patented
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Last Updated: 4 years, 1 month ago
Date # Transaction