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ADJACENT SUBSTANTIALLY FLEXIBLE SUBSTRATES HAVING INTEGRATED CIRCUITS THAT ARE BONDED TOGETHER BY NON-POLYMERIC LAYER

10/379,820 | U.S. Patent Application

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Location ELECTRONIC
Filed March 3, 2003
Examiner THANH PHAM, V
Class 257
Art Group 2894
Patent No. 8,035,233
Case Type Utility - 257/778000
Status Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362
Parent 10/144,791 Patented
Parent 09/607,363 Patented
Parent 08/971,565 Patented
Parent 08/835,190 Patented
Child 10/672,961 Patented
Child 12/497,655 Patented
Last Updated: 4 years, 2 months ago
Date # Transaction