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Click below for detailed party information:

Inventors

Jon M. Huppenthal D. James Guzy

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GUZY, MARY ANN GUZY, MARK

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GUZY, MARY ANN, Assignor

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RECONFIGURABLE PROCESSOR MODULE COMPRISING HYBRID STACKED INTEGRATED CIRCUIT DIE ELEMENTS

10/452,113 | U.S. Patent Application

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Location ELECTRONIC

Filed June 2, 2003

Examiner DANIEL D CHANG

Class 257

Art Group 2819

Patent No. 6,781,226

Case Type Utility - 257/686000

Status Patented Case

Parent 10/12,057 Patented

Child 10/802,067 Patented

Child 11/383,149 Patented

Last Updated: 4 years, 9 months ago

Date	#	Transaction
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RECONFIGURABLE PROCESSOR MODULE COMPRISING HYBRID STACKED INTEGRATED CIRCUIT DIE ELEMENTS

10/452,113 | U.S. Patent Application

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