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RECONFIGURABLE PROCESSOR MODULE COMPRISING HYBRID STACKED INTEGRATED CIRCUIT DIE ELEMENTS

10/802,067 | U.S. Patent Application

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Location ELECTRONIC
Filed March 16, 2004
Examiner DANIEL D CHANG
Class 257
Art Group 2819
Patent No. 7,126,214
Case Type Utility - 257/686000
Status Patented Case
Parent 10/452,113 Patented
Parent 10/12,057 Patented
Child PCT/US04/41791 Published
Child 11/383,149 Patented
Last Updated: 2 years, 8 months ago
Date # Transaction