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Inventors

Joachim H. Schober Heimo Scheucher Paul Hubmer

Assignee

PHILIPS SEMICONDUCTORS INTERNATIONAL B.V.

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U.S. PHILIPS CORPORATION, Assignor NXP B.V., Assignor NXP B.V., Assignor

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SEMICONDUCTOR WAFER WITH PROCESS CONTROL MODULES

10/81,893 | U.S. Patent Application

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Location ELECTRONIC

Filed Feb. 21, 2002

Examiner LUAN C THAI

Class 257

Art Group 2827

Patent No. 6,680,523

Case Type Utility - 257/620000

Status Patented Case

Child 01 890 050.6

Last Updated: 4 years, 1 month ago

Date	#	Transaction
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SEMICONDUCTOR WAFER WITH PROCESS CONTROL MODULES

10/81,893 | U.S. Patent Application

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