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SEMICONDUCTOR PACKAGE WITH HEAT SINK

10/876,897 | U.S. Patent Application

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Location ELECTRONIC
Filed June 25, 2004
Examiner IDA M SOWARD
Class 257
Art Group 2822
Patent No. 7,166,914
Case Type Utility - 257/713000
Status Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362
Parent 09/863,927 Abandoned
Parent 08/935,962 Patented
Parent 08/653,016 Patented
Parent 08/440,665 Patented
Parent 08/271,768 Patented
Last Updated: 5 years, 11 months ago
Date # Transaction