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Tomohiro Nishiyama Masamoto Tago

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GODO KAISHA IP BRIDGE 1

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NEC CORPORATION, Assignor

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SEMICONDUCTOR DEVICE, WIRING SUBSTRATE, AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

10/536,025 | U.S. Patent Application

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Location ELECTRONIC

Filed May 23, 2005

Examiner MONICA D HARRISON

Class 257

Art Group 2893

Patent No. 7,728,439

Case Type Utility - 257/778000

Status Patented Case

Parent PCT/JP03/14917 -

Child 2002-337376

Last Updated: 4 years ago

Date	#	Transaction
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SEMICONDUCTOR DEVICE, WIRING SUBSTRATE, AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

10/536,025 | U.S. Patent Application

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