IN THE UNITED STATES PATENT AND TRADEMARK OFFICE
`
`Attorney Docket No.: BHT-3183-128
`
`In re Patent Application of
`
`Cheng-Ting WUetal.
`
`Group Art Unit: Not Yet Assigned
`
`Application No.: Not Yet Assigned
`Filed: January 3, 2006
`
`;
`
`Examiner: Not Yet Assigned
`
`For: THIN IC PACKAGE FOR IMPROVING HEATDISSIPATION FROM CHIP
`BACKSIDE
`
`CLAIM TO PRIORITY UNDER 35 U.S.C. § 119
`
`Commissioner of Patents
`P.O. Box 1450
`Alexandria, Virginia 22313-1450
`
`Sir:
`
`Pursuant to the provisions of 35 U.S.C. § 119 and 37 C.F.R. § 1.55, Applicant
`
`claims the right of priority based upon Taiwanese Application No. 094127021 filed
`
`August9, 2005.
`
`A certified copy of Applicant's priority document is submitted herewith.
`
`Respectfully submitted,
`
`Fs
`
`Bruce H. Troxell
`Reg. No. 26,592
`
`TROXELL LAW OFFICE PLLC
`5205 Leesburg Pike, Suite 1404
`Falls Church, Virginia 22041
`Telephone:
`(703) 575-2711
`Telefax:
`(703) 575-2707
`
`Date:—January 3, 2006
`
`
`
`Attorney Docket No.: BHT-3183-128
`
`In re Patent Application of
`
`Cheng-Ting WUetal.
`
`Group Art Unit: Not Yet Assigned
`
`Application No.: Not Yet Assigned
`Filed: January 3, 2006
`
`;
`
`Examiner: Not Yet Assigned
`
`For: THIN IC PACKAGE FOR IMPROVING HEATDISSIPATION FROM CHIP
`BACKSIDE
`
`CLAIM TO PRIORITY UNDER 35 U.S.C. § 119
`
`Commissioner of Patents
`P.O. Box 1450
`Alexandria, Virginia 22313-1450
`
`Sir:
`
`Pursuant to the provisions of 35 U.S.C. § 119 and 37 C.F.R. § 1.55, Applicant
`
`claims the right of priority based upon Taiwanese Application No. 094127021 filed
`
`August9, 2005.
`
`A certified copy of Applicant's priority document is submitted herewith.
`
`Respectfully submitted,
`
`Fs
`
`Bruce H. Troxell
`Reg. No. 26,592
`
`TROXELL LAW OFFICE PLLC
`5205 Leesburg Pike, Suite 1404
`Falls Church, Virginia 22041
`Telephone:
`(703) 575-2711
`Telefax:
`(703) 575-2707
`
`Date:—January 3, 2006
`
`
`
`
`
`
`
`Ya ze He:
`Application No.
`
`a
`Appl icant(s)
`
`A
`
`094127021
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`
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`~ BRE RARA
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`PER Bemey Bez A
`INTELLECTUAL PROPERTY OFFICE
`MINISTRY OF ECONOMIC AFFAIRS
`REPUBLIC OF CHINA
`
`
`
`
`ROA ARES RAR TEAS PRP RA EERE
`KP ah Tae F
`This is to certify that annexed is.a true copy from the records of this
`
`
`office of the application as originally filed which is identified hereunde
`
`
`®
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`a
`: &vr_2005 + 08
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`Application Date
`Aug 9, 2005
`
`
`
`
`
`
`
`exam: ex 205 4 gl
`
`Issue Date
`NOV 1 62005
`
`
`#HXFR* 99421039270
`Serial No.
`
`&
`aA
`Director General
`
`CERTIFIED COPY OF
`PRIORITY DOCUMENT
`
`
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`Thin ic package for improving heat dissipation from chip backside
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`
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