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RECONFIGURABLE PROCESSOR MODULE COMPRISING HYBRID STACKED INTEGRATED CIRCUIT DIE ELEMENTS

11/383,149 | U.S. Patent Application

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Location ELECTRONIC
Filed May 12, 2006
Examiner DANIEL D CHANG
Class 326
Art Group 2819
Patent No. 7,282,951
Case Type Utility - 326/041000
Status Patented Case
Parent 10/802,067 Patented
Parent 10/452,113 Patented
Parent 10/12,057 Patented
Last Updated: 2 years, 4 months ago
Date # Transaction