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High frequency chip packages with connecting elements

11/640,765 | U.S. Patent Application

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Location ELECTRONIC
Filed Dec. 18, 2006
Examiner THINH T NGUYEN
Class 257
Art Group 2818
Case Type Utility - 257/232000
Status Abandoned -- Failure to Respond to an Office Action
Parent 10/746,810 Patented
Parent PCT/US02/27509 Published
Parent 60/315,408 Expired
Parent 10/210,160 Patented
Parent 60/315,408 Expired
Parent 60/449,673 Expired
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Last Updated: 4 years, 3 months ago
Date # Transaction