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METHODS AND APPARATUS FOR PACKAGING INTEGRATED CIRCUIT DEVICES

11/891,867 | U.S. Patent Application

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Location ELECTRONIC
Filed Aug. 13, 2007
Examiner HSIEN MING LEE
Class 257
Art Group 2823
Patent No. 7,642,629
Case Type Utility - 257/678000
Status Patented Case
Parent 11/125,624 Patented
Parent 10/462,576 Patented
Last Updated: 4 years, 9 months ago
Date # Transaction