Download Docs
Export
Print

INTEGRATED CIRCUIT PACKAGE DEVICE WITH IMPROVED BOND PAD CONNECTIONS, A LEAD-FRAME AND AN ELECTRONIC DEVICE

11/817,019 | U.S. Patent Application

Interested in this case?

To schedule a demo, contact us at sales@docketalarm.com. Track this case, and find millions of cases like it, let us show you how.
Location ELECTRONIC
Filed April 22, 2008
Examiner JENNY L WAGNER
Class 257
Art Group 2891
Patent No. 7,671,474
Case Type Utility - 257/670000
Status Patented Case
Parent PCT/IB06/50492 -
Child 05101384.5
Last Updated: 2 years, 4 months ago
Date # Transaction